Electronic module

Patent metadata

Field	Value
Publication number	US-11276663-B2
Application number	US-201716614316-A
Country	US
Kind code	B2
Filing date	May 19, 2017
Priority date	May 19, 2017
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

An electronic module has a first substrate 11, a first conductor layer 12 that is provided on one side of the first substrate 11, a first electronic element 13 that is provided on one side of the first conductor layer 12, a second electronic element 23 that is provided on one side of the first electronic element 23, and a second connecting body 70 that has a second head part 71 provided on one side of the second electronic element 23 and an extending part 75 extending from the second head part 71 to the other side and abutting against the first substrate 11 or the first conductor layer 12.

First claim

The invention claimed is:

1. An electronic module comprising:
a first substrate;
three or more first conductor layers that are provided on one side of the first substrate;
a first electronic element that is provided on one side of one of the first conductor layers;
a second electronic element that is provided on one side of the first electronic element; and
a second connecting body that has a second head part provided on one side of the second electronic element, and three or more extending parts extending from the second head part to the other side and abutting against the three or more first conductor layers, wherein
the second connecting body has a second pillar part extending from the second head part to the other side, and the second pillar part is connected to the second electronic element, and
among the three or more first conductor layers connected by the three or more extending parts, at least two of the first conductor layers are not electrically connected to the other first conductor layer, the first electronic element, the second electronic element, and do not work electrically, and at least one of the first conductor layers works electrically.

2. The electronic module according to claim 1 , wherein
at least one of the extending parts has a plane-direction extending part extending from the second head part in a plane direction and a height-direction extending part extending from the plane-direction extending part to the other side.

3. The electronic module according to claim 1 , wherein
at least one of the extending parts has an extending base end part extending in a plane direction.

4. The electronic module according to claim 1 , further comprising
a first connecting body that is provided on one side of the first electronic element and is provided on the other side of the second electronic element,
wherein the first connecting body has a first head part, on one side of which the second electronic element is provided, and a support part extending from the first head part to the other side and abutting against the first substrate or at least one of the first conductor layers.

5. The electronic module according to claim 4 , wherein
the first connecting body has a plurality of support parts.

6. The electronic module according to claim 4 , wherein
each of extending parts has a plane-direction extending part,
each of support parts has a plane-direction support part, and
the plane-direction extending part and the plane-direction support parts do not overlap with each other in a plane view.

7. An electronic module comprising:
three or more first substrates;
a first electronic element that is provided on one side of one of the first substrates;
a second electronic element that is provided on one side of the first electronic element; and
a second connecting body that has a second head part provided on one side of the second electronic element, and three or more extending parts extending from the second head part to the other side and abutting against the three or more first substrates, wherein
the first substrates are metal substrates,
the second connecting body has a second pillar part extending from the second head part to the other side, and the second pillar part is connected to the second electronic element, and
among the three or more first substrates connected by the three or more extending parts, at least two of the first substrates are not electrically connected to the other first substrate, the first electronic element, the second electronic element, and do not work electrically, and at least one of the first substrates works electrically.

Assignees

• Shindengen Electric Mfg

Inventors

• Ikeda Kosuke
• Matsuzaki Osamu

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/865

  Die-attach connectors and bond wires · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title