Power relay assembly

US11276536B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11276536-B2
Application numberUS-201716468018-A
CountryUS
Kind codeB2
Filing dateDec 15, 2017
Priority dateDec 15, 2016
Publication dateMar 15, 2022
Grant dateMar 15, 2022

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: an upper case having at least one electric element mounted on one surface thereof; a lower case coupled to the upper case; and at least one bus bar electrically connected to the electric element, disposed between the upper case and the lower case, and including a bottom portion that is in surface contact with at least one of the upper case and the lower case, wherein at least one side of the bottom portion contacts a portion made of a plastic material having heat dissipation and insulation properties in the upper case and the lower case.

First claim

Opening claim text (preview).

The invention claimed is: 1. A power relay assembly comprising: an upper case in which at least one electric element is mounted on one surface thereof; a lower case coupled to the upper case; and at least one bus bar electrically connected to the electric element, disposed between the upper case and the lower case, and including a bottom portion in surface contact with the upper case and the lower case, wherein the upper case and the lower case are formed of a plastic material having a heat dissipation property and an insulation property, wherein one surface of the bottom portion is in surface contact with an inner surface of the upper case and an opposite surface of the bottom portion is in surface contact with an inner surface of the lower case, wherein the inner surface of the upper case in surface contact with the bottom portion is a protruding portion configured to protrude by a predetermined height, and wherein the protruding portion is formed to correspond to a shape of the bottom portion. 2. The power relay assembly of claim 1 , wherein the bus bar includes the bottom portion and at least one height portion configured to extend from the bottom portion to protrude to an outer side of the upper case. 3. The power relay assembly of claim 1 , wherein the bottom portion is formed in a plate shape having a predetermined area. 4. The power relay assembly of claim 1 , further comprising an inner plate disposed between the upper case and the lower case, wherein a plurality of bus bars are provided and some bus bars among the plurality of bus bars are disposed at a location in which bottom portions thereof partially overlap each other, and the inner plate is disposed to be located between the bottom portions of the overlapping bus bars. 5. The power relay assembly of claim 4 , wherein the inner plate is formed of a plastic material having a heat dissipation property and an insulation property. 6. The power relay assembly of claim 4 , wherein in each of the bus bars disposed at the location in which bottom portions thereof partially overlap each other among the plurality of bus bars, both surfaces of the bottom portion are in surface contact with one surface of the inner plate and one surface of the upper case or one surface of the inner plate and one surface of the lower case. 7. The power relay assembly of claim 1 , wherein: at least one of the upper case and the lower case includes a plate-shaped metal member; and the metal member is integrated with the upper case or the lower case, wherein the upper case or lower case is formed of a resin-forming composition having a heat dissipation property and an insulation property through insert-molding. 8. The power relay assembly of claim 7 , wherein the metal member is completely buried inside the upper case or the lower case or fixed to one surface of the upper case or the lower case so that the one surface thereof is exposed to the outside. 9. The power relay assembly of claim 1 , wherein a coating layer having an insulation property and a heat dissipation property is formed on an exposed surface of the power relay assembly. 10. The power relay assembly of claim 1 , wherein the bus bar is formed of an aluminum material and has a coating layer having an insulation property and a heat dissipation property formed on a surface thereof.

Assignees

Inventors

Classifications

  • External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

  • Electric vehicles · CPC title

  • H01H50/02Primary

    Bases; Casings; Covers (frames for mounting two or more relays or for mounting a relay and another electric component H02B1/01, H04Q1/08, H05K) · CPC title

  • Electrical distribution centers · CPC title

  • Boxes; Parts thereof or accessories therefor · CPC title

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Frequently asked questions

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What does patent US11276536B2 cover?
A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: an upper case having at least one electric element mounted on one surface thereof; a lower case coupled to the upper case; and at least one bus bar electrically connected to the electric element, disposed between the upper case and the lower case, and including a b…
Who is the assignee on this patent?
Amogreentech Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01H50/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 15 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).