Detector array for a radiation system, and related system

Patent metadata

Field	Value
Publication number	US-11275187-B2
Application number	US-202017008889-A
Country	US
Kind code	B2
Filing date	Sep 1, 2020
Priority date	Apr 14, 2015
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

First claim

What is claimed is:

1. A detector array for a radiation system, the detector array comprising:
a radiation detection sub-assembly comprising a photodetector array adjacent to a scintillator array; and
a routing sub-assembly adjacent to the photodetector array, the routing sub-assembly comprising:
a dielectric material;
a shielding material adjacent to at least a portion of the dielectric material, gaps between portions of the shielding material exhibiting a cross-shaped cross-section; and
conductive elements extending through the dielectric material and electrically connecting a first interconnection layer between the photodetector array to a second interconnection layer.

2. The detector array of claim 1 , wherein the dielectric material comprises fiberglass, silicon, silicon dioxide, aluminum oxide, sapphire, germanium, gallium arsenide, a printed circuit board material, or a glass reinforced epoxy laminate.

3. The detector array of claim 1 , wherein the dielectric material comprises a ceramic material.

4. The detector array of claim 1 , wherein the shielding material comprises a unitary material, an opening defined within the shielding material through which the conductive elements extend.

5. The detector array of claim 1 , further comprising an electronics sub-assembly in electrical communication with the radiation detection sub-assembly.

6. The detector array of claim 5 , wherein the shielding material is substantially aligned with the electronics sub-assembly.

7. The detector array of claim 5 , wherein the electronics sub-assembly comprises a first sub-assembly portion spaced from at least a second sub-assembly portion by a gap.

8. The detector array of claim 1 , wherein the shielding material defines one or more openings.

9. A radiation system, comprising:
a radiation source; and
a detector array configured to detect radiation from the radiation source, the detector array comprising:
a radiation detector sub-assembly;
an electronics sub-assembly in electrical communication with the radiation detector sub-assembly; and
a routing sub-assembly between the radiation detector sub-assembly and the electronics sub-assembly, the routing sub-assembly comprising:
a shielding material;
conductive elements extending through an opening in the shielding material and electrically coupling the radiation detector sub-assembly to the electronics sub-assembly; and
a dielectric material adjacent to the shielding material, wherein the dielectric material spaces the conductive elements from each other.

10. The radiation system of claim 9 , wherein the shielding material comprises tungsten, lead, tantalum, leaded glass, or a powder.

11. The radiation system of claim 9 , wherein gaps between portions of the shielding material exhibit a cross-shaped cross-section.

12. The radiation system of claim 9 , wherein the conductive elements define a smaller lateral area than a first interconnection layer between the radiation detector sub-assembly and the routing sub-assembly.

13. The radiation system of claim 9 , wherein the radiation detector sub-assembly comprises a scintillator array and a photodetector array.

14. The radiation system of claim 9 , wherein the radiation detector sub-assembly is configured to directly convert the radiation into analog signals.

15. A detector array for a radiation system, the detector array comprising:
a routing sub-assembly located between a radiation detector sub-assembly and an electronics sub-assembly, the routing sub-assembly comprising:
a dielectric material between the radiation detector sub-assembly and the electronics sub-assembly;
a shielding material including at least one surface in contact with the dielectric material; and
a plurality of conductive elements extending through an opening in the shielding material.

16. The detector array of claim 15 , wherein the dielectric material fills spaces between adjacent conductive elements.

17. The detector array of claim 15 , wherein the opening in the shielding material comprises a single opening.

18. The detector array of claim 15 , wherein the shielding material comprises four portions, each portion of the four portions spaced from the other portions by the dielectric material.

Assignees

• Analogic Corp

Inventors

• Luhta Randy
• Marsden Lane
• Deych Ruvin
• Greenwald Jeffrey
• Choquette Martin
• Tibbetts Christopher David

Classifications

• H10F39/8057

  Optical shielding · CPC title

• H10F39/1898

  Indirect radiation image sensors, e.g. using luminescent members · CPC title

• H10F39/1895

  of the hybrid type · CPC title

• H10F39/809

  of hybrid image sensors · CPC title

• G01T1/2018

  Scintillation-photodiode combinations · CPC title