One-component toughened epoxy adhesives containing a mixture of latent curing agents

Patent metadata

Field	Value
Publication number	US-11274236-B2
Application number	US-201816482925-A
Country	US
Kind code	B2
Filing date	Feb 19, 2018
Priority date	Feb 26, 2017
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

A one-component toughened epoxy-modified polyurethane and/or urea adhesive includes a mixture of dicyandiamide and a dihdyrazide as curing agents. The mixture of curing agents permits the adhesive to be cured at lower temperatures while developing good adhesive and mechanical properties in the cured adhesive.

First claim

What is claimed is:

1. A method for bonding two substrates, comprising forming a layer of an adhesive comprising in admixture A) at least one non-rubber-modified epoxy resin, B) at least one toughening agent, C) at least one epoxy curing catalyst and D) a curing agent mixture that includes dicyandiamide and one or more dihydrazide compounds, the dicyandiamide and one or more dihydrazide compounds being present at a weight ratio of 0.63 to 99:1, at a bondline between the two substrates to form an assembly and then curing the adhesive layer at the bondline by heating to a temperature of 130 to 165° C. to form a cured adhesive bonded to the two substrates at the bondline, wherein one of the substrates is a metal and the other substrate is a thermoplastic organic polymer, a thermoset organic polymer or a fiber composite.

2. The method of claim 1 , wherein the two substrates have coefficients of linear thermal expansion that are different from each other by at least 5×10 −6 m/m-K.

3. A method for forming a bonded and coated assembly, comprising 1) forming a layer of the adhesive comprising in admixture A) at least one non-rubber-modified epoxy resin, B) at least one toughening agent, C) at least one epoxy curing catalyst and D) a curing agent mixture that includes dicyandiamide and one or more dihydrazide compounds, the dicyandiamide and one or more dihydrazide compounds being present at a weight ratio of 1:99 to 99:1 at a bondline between a first and a second substrate to form an assembly that includes the first and second substrates each in contact with the adhesive composition at the bondline; then
2) immersing the assembly into a coating bath to form a layer of an uncured coating on at least a portion of an exposed surface of the assembly; and
3) heating the assembly to a temperature of at least 130° C. to cure the adhesive to form a cured adhesive bonded to the substrates at the bondline and simultaneously cure the coating layer.

4. The method of claim 3 wherein the temperature is 130 to 175° C.

5. The method of claim 3 wherein the temperature is 133 to 165° C.

6. The method of claim 3 , wherein the first and second substrates have coefficients of linear thermal expansion that are different from each other by at least 5×10 −6 m/m-K.

7. The method of claim 3 , wherein one of the substrates is a metal and the other substrate is a thermoplastic organic polymer, a thermoset organic polymer or a fiber composite.

Assignees

• Ddp Specialty Electronic Materials Us Llc

Inventors

• Auvil Tyler
• Krishnan Bindu
• Lutz Andreas
• Koch Felix
• Clinton Cody

Classifications

• B32B2255/02

  on fibrous or filamentary layer · CPC title

• C08G59/4021

  Ureas; Thioureas; Guanidines; Dicyandiamides · CPC title

• C08G59/4035

  Hydrazines; Hydrazides · CPC title

• B32B2250/02

  2 layers · CPC title

• B32B2255/10

  on synthetic resin layer or on natural or synthetic rubber layer · CPC title