Epoxy patch having improved adhesion characteristics

Patent metadata

Field	Value
Publication number	US-11274232-B2
Application number	US-201716087155-A
Country	US
Kind code	B2
Filing date	Mar 23, 2017
Priority date	Mar 23, 2016
Publication date	Mar 15, 2022
Grant date	Mar 15, 2022

Abstract

A device comprising an adhesive material and a fiberglass mesh located in direct planar contact with the adhesive material. The adhesive material is tacky in its green state and includes an epoxy, an epoxidized cashew nut shell oil, and at least about 20% by weight of a component containing a core shell polymer material to improve the adhesion capability to surfaces that are contaminated and/or exposed to high pressure spraying or chemical treatments, heat and humidity.

First claim

The invention claimed is:

1. A patch comprising:
an activatable adhesive material comprising:
(a) a solid epoxy;
(b) a core shell polymer dissolved in liquid epoxy;
(c) an epoxidized cashew nut shell oil; and
(d) phenoxy resin dissolved in bisphenol F;

a fiberglass mesh located in direct planar contact with the adhesive material and along at least a portion of the adhesive material;
a release liner located along a surface of the adhesive;
wherein the patch is sufficiently flexible and tacky that it can be located in its green state onto a contoured substrate with no additional fastening means and adhere to that substrate during exposure to elevated temperatures during chemical baths without wash-off.

2. The patch of claim 1 , wherein the adhesive material is tacky prior to activation allowing the adhesive material to adhere to the fiberglass mesh and to a surface for reinforcing the surface.

3. The patch of claim 2 , wherein the adhesive material includes at least about 30% by weight of a component including a core shell polymer.

4. The patch of claim 2 , wherein the patch includes a release liner on the surface opposite a surface receiving the mesh.

5. The patch of claim 4 , wherein the release liner is removed from the patch without removing any adhesive at temperatures up to at least about 120° F.

6. The patch of claim 4 , wherein the release liner is removed from the patch without removing any adhesive at temperatures between 60° F. and 120° F.

7. The patch of claim 2 , wherein the patch resists adhesive failure to oily substrates in its green state.

8. The patch of claim 1 , wherein the adhesive material includes from about 20% to about 45% by weight of a component including a core shell polymer.

9. The patch of claim 8 , wherein the adhesive material includes from about 3% to about 15% by weight epoxidized cashew nut shell oil.

10. The patch of claim 8 , wherein the core shell polymer is dispersed in a material that is in liquid form at ambient temperature.

11. The patch of claim 8 , wherein the patch has a green state prior to activation and the patch in its green state remains adhered to a metallic surface during exposure to a high pressure spray process or chemical bath treatment.

12. The patch of claim 1 , wherein the adhesive material includes at least about 20% by weight of a component including a core shell polymer.

13. The patch of claim 1 , wherein the adhesive material includes at least about 35% by weight core shell polymer.

14. The patch of claim 1 , wherein the patch is substantially free of any magnetic materials.

15. The patch of claim 1 , wherein the core shell polymer containing component includes a liquid epoxy resin.

16. The patch of claim 15 , wherein the core shell polymer containing component is formed by emulsion polymerization utilizing a liquid epoxy resin as the emulsion base.

17. The patch of claim 15 , wherein the adhesive includes from about 5% to about 15% of a phenoxy resin.

18. The patch of claim 1 , wherein the adhesive absorbs oil from an oily substrate surface.

19. A method for reinforcing a substrate comprising:
coating at least a portion of the substrate with stamping lubricant;
locating the patch of claim 1 onto the portion of the substrate that is coated;
exposing the patch and substrate to an elevated temperature so that the patch hardens and cures.

Assignees

• Zephyros Inc

Inventors

• Kosal David
• Madaus Keith

Classifications

• C09J7/20 Primary

  characterised by their carriers · CPC title

• C09J2301/412

  presence of microspheres · CPC title

• C09J7/22 Primary

  Plastics; Metallised plastics · CPC title

• C09J2463/00

  Presence of epoxy resin · CPC title

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title