Bioriented polyethylene film

US11273592B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11273592-B2
Application numberUS-201916435935-A
CountryUS
Kind codeB2
Filing dateJun 10, 2019
Priority dateAug 26, 2011
Publication dateMar 15, 2022
Grant dateMar 15, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention discloses a process for forming a biaxially oriented film. The process includes first selecting a polyolefin resin wherein said polyolefin resin comprises a linear low density polyethylene resin characterized by having from 9 to 35 weight percent of the total weight of linear low density polyethylene resin eluting from a CEF at a temperature greater than 97.0° C.; and further characterized by having a CDR of from 33 to 80 and a Mw Ratio of from 0.15 to 0.45. Next a film is formed from the polyolefin resin selected in the first step. Finally the film formed in the second step is oriented in a sequential manner. The films produced by this process are characterized by having an ultimate elongation at least 1.5 times greater in the MD as compared to the CD and the 2% secant modulus is a least 1.25 times greater in the CD as compared to the MD. The films are further characterized by having free residual shrinkage of less than 10% in the MD and less than 10% in the CD when exposed to a temperature of 90° C. for 10 minutes.

First claim

Opening claim text (preview).

What is claimed is: 1. A biaxially oriented film comprising: a polyolefin resin wherein said polyolefin resin comprises a linear low density polyethylene resin characterized by having from 9 to 35 weight percent of the total weight of the linear low density polyethylene resin eluting from a crystallization elution fractionation (CEF) at a temperature greater than 97° C.; and further characterized by having a comonorner distribution ratio (CDR) of from 33 to 80 and a molecular weight ratio (Mw Ratio) of from 0.15 to 0.45; wherein said film is surface treated to exhibit a surface tension of greater than or equal to 38 dyne/cm surface tension; wherein the film is characterized by having an ultimate elongation at least 1.5 times greater in the machine direction (MD) as compared to the cross direction (CD) and the 2% secant modulus is at least 1.25 times greater in the CD as compared to the MD; and wherein the film is characterized by having free residual shrinkage of less than 10% in the MD and less than 10% in the CD when exposed to a temperature of 90° C. for 10 minutes. 2. The film of claim 1 , wherein the film has a thickness of from 20 to 50 microns. 3. The film of claim 1 , in which the film is a mono layer film. 4. The film of claim 1 , in which the film is a multilayer film. 5. The film of claim 4 , wherein the film comprises one or more core layers and two skin layers and wherein at least one core layer has a higher density than at least one of the skin layers. 6. A laminated film structure comprising a substrate with the film of claim 5 laminated thereto. 7. The laminated film structure of claim 6 wherein the substrate is selected from the group consisting of one or more of the following: bi-oriented polypropylene film, oriented polyethylene terephthalate film, oriented polyamide film, blown or cast PE film, aluminum foil and paper.

Assignees

Inventors

Classifications

  • Physical, chemical or physicochemical properties · CPC title

  • Homopolymers or copolymers of propene · CPC title

  • combined with shaping by orienting, stretching or shrinking, e.g. film blowing (B29C48/0017 takes precedence) · CPC title

  • of synthetic resin · CPC title

  • Density or compression of components · CPC title

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What does patent US11273592B2 cover?
The present invention discloses a process for forming a biaxially oriented film. The process includes first selecting a polyolefin resin wherein said polyolefin resin comprises a linear low density polyethylene resin characterized by having from 9 to 35 weight percent of the total weight of linear low density polyethylene resin eluting from a CEF at a temperature greater than 97.0° C.; and furt…
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification B29C55/005. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 15 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).