Work machine and mounting method

Patent metadata

Field	Value
Publication number	US-11272647-B2
Application number	US-201716758963-A
Country	US
Kind code	B2
Filing date	Nov 14, 2017
Priority date	Nov 14, 2017
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A work machine and a mounting method by which end portions of a wire member can be mounted on connecting sections which are arranged variously are provided. A work head includes a first holding section configured to hold a first end portion and a second holding section configured to hold a second end portion. A control device includes a first mounting section configured to mount the first end portion held by the first holding section on a first connecting section, a moving section configured to cause a work head moving device to move the work head in accordance with a position of the second connecting section after having mounted the first end portion on the first connecting section, and a second mounting section configured to mount the second end portion held by the second holding section on a second connecting section.

First claim

The invention claimed is:

1. A work machine comprising:
a substrate holding device including a clamp configured to hold a circuit substrate including a first connecting section and a second connecting section on a first surface of the circuit substrate;
a work head configured to hold a wire member including a first end portion and a second end portion so as to mount the wire member on the circuit substrate held by the substrate holding device;
a work head moving device configured to move the work head, the work head including a first chuck configured to hold the first end portion; and a second chuck configured to hold the second end portion; and
a control device configured to
mount the first end portion, being held by the first chuck, on the first connecting section;
determine multiple paths of the wire member to be bent between the first connecting section and the second connecting section so as to avoid contacting a component mounted on the first surface of the circuit substrate;
select a path out of the multiple paths based on a predetermined criteria;
cause the work head moving device to move the work head in accordance with a position of the component and a position of the second connecting section after having mounted the first end portion on the first connecting section based on the path; and
mount the second end portion, being held by the second chuck, on the second connecting section.

2. The work machine according to claim 1 , further comprising:
a supply device configured to supply the wire member to the work head; and a camera configured to image the work head holding the wire member, wherein the camera images the work head after the wire member is supplied from the supply device to the work head,
wherein the control device is configured to determine whether the wire member is held properly by the first chuck and the second chuck based on image data imaged by the camera.

3. The work machine according to claim 1 ,
wherein the circuit substrate includes the first surface and a second surface that faces the first surface, and
wherein the work machine further comprises:
a substrate support configured to support the circuit substrate from the second surface in at least one of a case in which the first end portion of the wire member disposed on the first surface is mounted in the first connecting section and a case in which the second end portion of the wire member disposed on the first surface is mounted in the second connecting section.

4. The work machine according to claim 1 ,
wherein the path is curved over the component.

5. The work machine according to claim 1 ,
wherein the path is curved around a side of the component.

6. The work machine according to claim 1 ,
wherein the predetermined criteria is a shortest path curvature among the multiple paths.

7. A mounting method for a work machine comprising a substrate holding device configured to hold a circuit substrate comprising a first connecting section and a second connecting section on a first surface of the circuit substrate, a work head configured to hold a wire member comprising a first end portion and a second end portion so as to mount the wire member on the circuit substrate held by the substrate holding device, and a work head moving device configured to move the work head, the mounting method being configured to mount the wire member on the circuit substrate, the work head comprising:
a first chuck configured to hold the first end portion; and
a second chuck configured to hold the second end portion,

the mounting method comprising:
a first mounting step of mounting the first end portion held by the first chuck on the first connecting section;
a determining step of determining multiple paths of the wire member to be bent between the first connecting section and the second connecting section so as to avoid contacting a component mounted on the first surface of the circuit substrate;
a selecting step of selecting a path out of the multiple paths based on a predetermined criteria;
a moving step of causing the work head moving device to move the work head in accordance with a position of the component and a position of the second connecting section after the first end portion has been mounted on the first connecting section, based on the path; and
a second mounting step of mounting the second end portion held by the second chuck on the second connecting section.

Assignees

• Fuji Corp

Inventors

• Mukohara Takaji

Classifications

• H05K13/0069

  Holders for printed circuit boards · CPC title

• H05K13/0404 Primary

  Pick-and-place heads or apparatus, e.g. with jaws · CPC title

• H05K13/0882

  Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such (H05K13/083 takes precedence) · CPC title

• H05K13/06

  Wiring by machine · CPC title

• H05K13/0408 Primary

  Incorporating a pick-up tool · CPC title