Mounting bracket having electrical and thermal properties

Patent metadata

Field	Value
Publication number	US-11272641-B2
Application number	US-202016823976-A
Country	US
Kind code	B2
Filing date	Mar 19, 2020
Priority date	Mar 19, 2020
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

Example embodiments described in this disclosure are generally directed to a mounting bracket for deployment in a vehicle. In one embodiment, a multilayer mounting bracket includes a first layer made of a dual-conductive polymer and a second layer made of a polymer that includes an endothermic blowing agent. The dual-conductive polymer includes carbon material that renders the first layer electrically conductive and also includes graphite material that renders the first layer thermally conductive. The endothermic blowing agent renders the second layer thermally insulative. An electronic module such as an engine controller can be mounted upon the first layer, which operates as a heat sink to dissipate heat generated by the electronic module and also operates as an electromagnetic interference (EMI) shield. The second layer prevents heat from being transferred from the first layer into another electronic module that may be mounted upon the mounting bracket.

First claim

That which is claimed is:

1. An assembly, the assembly comprising:
a first electronic module; and
a multilayer mounting bracket comprising:
a first layer comprising a first polymer that includes a first quantity of carbon and a first quantity of graphite, the first layer having a first electrical conductivity characteristic and a first thermal conductivity characteristic based on the first quantity of carbon and the first quantity of graphite in the first layer, the first electronic module disposed upon an external major surface of the first layer,
wherein the first layer includes a grounding element that electrically connects the first layer to a ground node; and
a second layer adjoining the first layer, the second layer comprising a second polymer that includes an endothermic blowing agent, the second layer having a thermal insulation characteristic based on the second layer having the endothermic blowing agent.

2. The assembly of claim 1 , wherein at least one of the first polymer or the second polymer is one of polybutylene terephthalate (PBT), polypropylene, or polyethylene.

3. The assembly of claim 1 , wherein the first polymer is one of polybutylene terephthalate (PBT), polypropylene, or polyethylene, wherein the first quantity of carbon comprises carbon black in a first range of about 8% to about 40% of an amount of the first polymer, and wherein the first quantity of graphite comprises graphite in a second range of about 20% to about 40% of the amount of the first polymer.

4. The assembly of claim 1 , wherein the multilayer mounting bracket is mounted to a structure using an attachment member, and wherein the attachment member is at least one of a tab, a bolt, a rivet, or a fastener.

5. The assembly of claim 1 , wherein the first layer adjoins an obverse major surface of the second layer, and further comprising:
a third layer adjoining a reverse major surface of the second layer, the third layer comprising a third polymer that includes a second quantity of carbon and a second quantity of graphite, the second layer having a second electrical conductivity characteristic and a second thermal conductivity characteristic based on the second quantity of carbon and the second quantity of graphite in the second layer.

6. The assembly of claim 5 , further comprising a second electronic module on an external major surface of the second layer.

Assignees

• Ford Global Tech Llc

Inventors

• Salter Stuart C
• Dellock Paul Kenneth
• Budaj John
• Rojas Silva Estefania
• Escalante Marko

Classifications

• B32B2264/108

  Carbon, e.g. graphite particles · CPC title

• F28F9/0256 Primary

  Arrangements for coupling connectors with flow lines · CPC title

• B32B3/30

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

• B32B2307/212

  Electromagnetic interference shielding · CPC title

• B32B2307/304

  Insulating · CPC title