Organizer for fiber optic components

Patent metadata

Field	Value
Publication number	US-11269148-B2
Application number	US-202016861059-A
Country	US
Kind code	B2
Filing date	Apr 28, 2020
Priority date	Apr 28, 2020
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

An optoelectronic module includes a housing and a printed circuit board (“PCB”) positioned within the housing. A positioning member is coupled to the PCB and includes one or more receptacles each configured to receive and secure positioning of an optical component relative to the PCB. The positioning member may include a plurality of receptacles positioned relative to one another in an arrangement defining a vertical array of receptacles, a lateral array of receptacles, or both. In one form, an optical component, when positioned in a receptacle of the positioning member, is spaced from the PCB. The positioning member may be formed of a thermally insulative or thermally conductive material, and a number of optical fibers may be routed between the positioning member and the housing.

First claim

What is claimed is:

1. An optoelectronic module, comprising:
a housing;
a printed circuit board (“PCB”) positioned within the housing; and
a positioning member coupled to the PCB and including a number of receptacles each configured to receive and secure positioning of an optical component relative to the PCB,
wherein a first of the optical component is spaced from the PCB when positioned in a first of the receptacles of the positioning member;
wherein a second receptacle of the number of receptacles is positioned between the PCB and the first receptacle of the number of receptacles in an arrangement defining a vertical array of the first and second receptacles; and
wherein each of the first and second receptacles includes a first surface, a second surface extending transversely to the first surface, and a third surface extending between and connecting the first and second surfaces.

2. The optoelectronic module of claim 1 , wherein the positioning member includes a base portion and a first vertical portion extending from the base portion, and the first receptacle and the second receptacle are positioned in the vertical array on the first vertical portion.

3. The optoelectronic module of claim 1 , wherein a ridge extends between and separates the first receptacle and the second receptacle.

4. The optoelectronic module of claim 1 , wherein the third surface includes a pressure sensitive adhesive.

5. The optoelectronic module of claim 1 , further comprising a second positioning member positioned in the housing, wherein the second positioning member includes a pair of laterally adjacent receptacles each configured to receive and secure positioning of at least one optical component relative to the PCB in an arrangement where the at least one optical component is spaced from the PCB.

6. The optoelectronic module of claim 5 , wherein each of the pair of laterally adjacent receptacles includes a first surface, a second surface extending transversely to the first surface, and a third surface extending between and connecting the first and second surfaces.

7. The optoelectronic module of claim 1 , wherein the positioning member includes a pair of laterally adjacent receptacles each configured to receive and secure positioning of at least one optical component relative to the PCB in an arrangement where the at least one optical component is spaced from the PCB.

8. The optoelectronic module of claim 7 , wherein each of the pair of laterally adjacent receptacles includes a first surface, a second surface extending transversely to the first surface, and a third surface extending between and connecting the first and second surfaces.

9. The optoelectronic module of claim 1 , wherein a pressure sensitive adhesive material is positioned between the PCB and the positioning member.

10. The optoelectronic module of claim 1 , wherein the positioning member is at least partially formed of a thermally conductive material.

11. An optoelectronic module, comprising:
a housing;
a printed circuit board (“PCB”) positioned within the housing; and
a positioning member coupled to the PCB and including a base portion, a vertical portion extending from the base portion, and a first receptacle and a second receptacle positioned on the vertical portion,
wherein the first receptacle and the second receptacle are configured to receive and secure positioning of an optical component relative to the PCB, and the first receptacle is positioned between the second receptacle and the PCB; and
wherein each of the first and second receptacles includes a first surface, a second surface extending in a non-parallel fashion relative to the first surface, and a third surface extending between and connecting the first and second surfaces.

12. The optoelectronic module of claim 11 , wherein the vertical portion extends transversely to a longitudinal axis and the first surface and the second surface extend transversely to the vertical portion.

13. The optoelectronic module of claim 11 , further comprising a first optical component positioned in the first receptacle and an optical fiber positioned between the positioning member and the housing.

14. An optoelectronic module, comprising:
a housing having a heat-dissipating exterior portion;
a printed circuit board (“PCB”) positioned within the housing; and
a positioning member coupled to the PCB and including a number of receptacles each configured to receive and secure positioning of an optical component relative to the PCB,
wherein a first receptacle of the number of receptacles is spaced from the PCB toward the heat-dissipating exterior portion of the housing;
wherein a second receptacle of the number of receptacles is positioned laterally of the first receptacle; and
wherein at least one side of the positioning member includes a third receptacle of the number of receptacles configured to receive and secure positioning of a third optical component relative to the PCB, the third optical component spaced from the PCB when positioned in the third receptacle.

15. The optoelectronic module of claim 14 , wherein the positioning member is formed of a thermally insulative material.

16. The optoelectronic module of claim 14 , wherein the positioning member further includes a ridge extending between and separating the first and second receptacles, and each of the first and second receptacles includes a first surface, a second surface extending transversely to the first surface, and a third surface extending between and connecting the first and second surfaces.

17. The optoelectronic module of claim 14 , wherein the positioning member comprises a mounting portion on a bottom thereof configured to mount to the PCB, the mounting portion having a pair of oppositely positioned sidewalls that curve from a first separation from one another at one end of the mounting portion to a second separation, smaller than the first separation, at another end of the mounting portion.

18. The optoelectronic module of claim 14 , wherein the housing comprises an intermediate portion having sidewalls in which the PCB is positioned; and wherein the heat-dissipating exterior portion comprises a cover of the housing attached to the sidewalls.

19. The optoelectronic module of claim 2 , wherein the positioning member comprises a second vertical portion extending from the base portion, the second vertical portion includes a pair of the receptacles arranged in a vertical array.

20. The optoelectronic module of claim 19 , wherein the second vertical portion is spaced from the first vertical portion; and wherein the base portion between the first and second vertical portions supports one or more additional optical components at a distance from the PCB.

Assignees

• Ii Vi Delaware Inc

Inventors

• Wang Yajun
• Mcclean Ian
• Green Eric T

Classifications

• G02B6/4441

  Boxes · CPC title

• G02B6/428 Primary

  containing printed circuit boards [PCB] · CPC title

• G02B6/4244 Primary

  Mounting of the optical elements · CPC title

• G02B6/4246

  Bidirectionally operating package structures · CPC title

• G02B6/4261

  Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails · CPC title