Magnetic sensor

Patent metadata

Field	Value
Publication number	US-11269024-B2
Application number	US-201816613671-A
Country	US
Kind code	B2
Filing date	May 14, 2018
Priority date	May 16, 2017
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

To provide a magnetic sensor capable of supporting a magnetic block stably and allowing a further size reduction of the sensor chip. A magnetic sensor includes a sensor chip and a magnetic block which are mounted on a circuit board. The sensor chip is mounted on the circuit board such that a mounted surface thereof faces a mounting surface, and the magnetic block is mounted on the circuit board such that first and second surfaces and face an element formation surface and the mounting surface, respectively. The magnetic block has a cutout portion, and some of terminal electrodes E11 to E16 are disposed within a space formed by the cutout portion. According to the present invention, the magnetic block can be supported stably. In addition, the presence of the cutout portion in the magnetic block allows a further size reduction of the sensor chip.

First claim

What is claimed is:

1. A magnetic sensor comprising:
a sensor chip having an element formation surface on which a magnetic detection element and a plurality of terminal electrodes are formed and a mounted surface substantially perpendicular to the element formation surface;
a magnetic block having first and second surfaces substantially perpendicular to each other; and
a circuit board having a mounting surface on which a plurality of land patterns are formed,
wherein the sensor chip is mounted on the circuit board such that the mounted surface faces the mounting surface of the circuit board,
wherein the magnetic block is mounted on the circuit board such that the first and second surfaces face the element formation surface of the sensor chip and the mounting surface of the circuit board, respectively, and
wherein the magnetic block has a cutout portion positioned between the first and second surfaces, and at least some of the terminal electrodes are disposed within a space formed by the cutout portion.

2. The magnetic sensor as claimed in claim 1 , wherein at least some of connection conductors connecting the plurality of terminal electrodes and a plurality of land patterns, respectively, are further disposed within the space.

3. The magnetic sensor as claimed in claim 2 , wherein the connection conductors comprise a solder.

4. The magnetic sensor as claimed in claim 1 , wherein the plurality of terminal electrodes are arranged at equal intervals along an edge of the element formation surface.

5. The mage sensor as claimed in claim 1 ,
wherein the cutout portion of the magnetic block includes a third surface substantially parallel to the first surface and a fourth surface substantially parallel to the second surface, and
wherein the space is surrounded by the third surface, fourth surface, mounting surface, and element formation surface.

6. The magnetic sensor as claimed in claim 1 ,
wherein the cutout portion of the magnetic block includes a fifth surface inclined at an obtuse angle with respect to the first and second surfaces, and
wherein the space is surrounded by the fifth surface, mounting surface and element formation surface.

7. The magnetic sensor as claimed in claim 1 ,
wherein the cutout portion of the magnetic block includes a concave curved surface, and
wherein the space is surrounded by the curved surface, mounting surface, and element formation surface.

8. The magnetic sensor as claimed in claim 1 ,
wherein the magnetic detection element includes first to fourth magnetic detection elements,
wherein the first and second magnetic detection elements are positioned on one side as viewed from the first surface of the magnetic block, and
wherein the third and fourth magnetic detection elements are positioned on other side as viewed from the first surface of the magnetic block.

Assignees

• Tdk Corp

Inventors

• Tanabe Kei

Classifications

• H05K3/305 Primary

  Affixing by adhesive · CPC title

• H01F7/20

  without armatures (cores H01F3/00; coils H01F5/00 {; shaping metal by applying magnetic forces B21D26/14; electromagnets specially adapted for NMR applications G01R33/381}) · CPC title

• H05K2201/10151

  Sensor · CPC title

• G01R33/0052

  Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85) · CPC title

• G01R33/0011

  comprising means, e.g. flux concentrators, flux guides, for guiding or concentrating the magnetic flux, e.g. to the magnetic sensor · CPC title