Coil assembly and corresponding measuring assembly

Patent metadata

Field	Value
Publication number	US-11268832-B2
Application number	US-201716314426-A
Country	US
Kind code	B2
Filing date	Jun 12, 2017
Priority date	Jun 30, 2016
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A coil assembly includes a coil winding and a multilayer printed circuit board. The coil winding has multiple loops that are arranged in different layers of the printed circuit board and form a main magnetic field with a main measuring direction perpendicular to a main plane of the printed circuit board. The loops arranged in different layers are electrically connected together via at least one via. The printed circuit board has at least four vias or a whole-number multiple of four vias that form an equal number of reverse current paths and forward current paths between the loops of the coil winding. Each pair of vias with the same current path direction is arranged point-symmetrically relative to a common mirror point such that magnetic loops that are formed on printed circuit board secondary planes arranged perpendicularly to the main plane have opposite directions and compensate for one another.

First claim

The invention claimed is:

1. A coil assembly, comprising:
a multilayered printed circuit board; and
a coil winding having a plurality of loops, which are arranged in different layers of the printed circuit board and form a main magnetic field that has a main direction perpendicular to a main plane of the printed circuit board, the loops arranged in different layers being connected electrically to one another by at least one via,
wherein the printed circuit board has at least four vias or an integer multiple of four vias, which, between the loops of the coil winding, form an identical number of downward current paths and upward current paths,
wherein each via of the at least four vias is paired with another via of the at least four vias having a same current path direction, and the paired vias are arranged point-symmetrically with respect to a common mirror point, with the result that magnetic loops which are formed in secondary planes of the printed circuit board which are arranged perpendicular to the main plane have opposite directions and compensate for one another, and
wherein the at least four vias are arranged along a common straight line.

2. The coil assembly as claimed in claim 1 , wherein the vias arranged point-symmetrically in pairs are mirrored at a center of gravity of the coil assembly as the common mirror point, which is predetermined by a common point of intersection between a plurality of connecting straight lines of the vias arranged point-symmetrically in pairs.

3. The coil assembly as claimed in claim 2 , wherein an angle between two of the connecting straight lines has any desired value between 0 and 360°.

4. The coil assembly as claimed in claim 1 , wherein the coil winding electrically connects a first via of the at least four vias having a downward current path direction to a second via of the at least four vias having an upward current path direction, and a third via of the at least four vias having the upward current path direction to a fourth via of the at least four vias having the downward current path direction.

5. A The coil assembly, wherein comprising:
a multilayered printed circuit board; and
a coil winding having a plurality of loops, which are arranged in different layers of the printed circuit board and form a main magnetic field that has a main direction perpendicular to a main plane of the printed circuit board, the loops arranged in different layers being connected electrically to one another by at least one via,
wherein the printed circuit board has at least four vias or an integer multiple of four vias, which, between the loops of the coil winding, form an identical number of downward current paths and upward current paths,
wherein each via of the at least four vias is paired with another via of the at least four vias having a same current path direction, and the paired vias are arranged point-symmetrically with respect to a common mirror point, with the result that magnetic loops which are formed in secondary planes of the printed circuit board which are arranged perpendicular to the main plane have opposite directions and compensate for one another,
wherein at least one first loop of the plurality of loops, in a first layer of the printed circuit board, electrically connects a first via of the at least four vias having a downward current path direction to a second via of the at least four vias having an upward current path direction,
wherein at least one second loop of the plurality of loops, in a second layer of the printed circuit board, electrically connects the second via to a third via having the downward current path direction,
wherein at least one third loop of the plurality of loops, in the first layer of the printed circuit board, electrically connects the third via to a fourth via having the upward current path direction, and
wherein at least one fourth loop of the plurality of loops, which, in the second layer of the printed circuit board, electrically connects the fourth via to the first via.

6. The coil assembly as claimed in claim 5 , wherein:
the electrical connections between the vias have any desired number of loops of the plurality of loops, and
the loops of the desired number of loop do not have a point of intersection with a connecting straight line between the vias having the upward current direction.

7. The coil assembly as claimed in claim 5 , wherein the at least four vias are arranged along a common straight line.

8. The coil assembly as claimed in claim 5 , wherein the at least four vias includes only the first via, the second via, the third via, and the fourth via.

9. The coil assembly as claimed in claim 8 , wherein the first via, the second via, the third via, and the fourth via are arranged point-symmetrically in pairs and are mirrored at a center of gravity of the coil assembly as the common mirror point, which is predetermined by a common point of intersection between a plurality of connecting straight lines of the vias arranged point-symmetrically in pairs.

10. A coil assembly comprising:
a multilayered printed circuit board; and
a coil winding having a plurality of loops, which are arranged in different layers of the printed circuit board and form a main magnetic field that has a main direction perpendicular to a main plane of the printed circuit board, the loops arranged in different layers being connected electrically to one another by at least one via,
wherein the printed circuit board has at least four vias or an integer multiple of four vias, which, between the loops of the coil winding, form an identical number of downward current paths and upward current paths,
wherein each via of the at least four vias is paired with another via of the at least four vias having a same current path direction, and the paired vias are arranged point-symmetrically with respect to a common mirror point, with the result that magnetic loops which are formed in secondary planes of the printed circuit board which are arranged perpendicular to the main plane have opposite directions and compensate for one another,
wherein the at least four vias are arranged along a common straight line,
wherein the printed circuit board has a connection terminal having four connection contacts, which are each arranged point-symmetrically in pairs with respect to the common mirror point,
wherein two connection contacts of the four connection contacts include the downward current paths, and
wherein two other connection contacts of the four connection contacts include the upward current paths.

11. The coil assembly as claimed in claim 10 , wherein:
a first connection contact of the four connection contacts is one of the downward current paths and a second connection contact of the four connection contacts is one of the upward current paths,
the first connection contact and the second connection contact are coil connections located in a third layer of the printed circuit board,
a third connection contact of the four connection contacts is one of the downward current paths and a fourth connection contact of the four connection contacts is one of the upward current paths, and
the third connection contact and the fourth connection contact are each configured as a compensation contact.

12. The coil assembly as claimed in claim 11 , wherein the first connection contact and the second connection contact are looped into a first link between two vias and interrupt said link, wherein the third connection contact and the fourth connection contact are looped into a corresponding link, mirrored at the common mirror point, between two vias and interrupt the link, and wherein the third connection contact and the fourth connectio

Assignees

• Bosch Gmbh Robert

Inventors

• Buck Thomas
• Merz Andreas
• Krayl Oliver
• Leidich Stefan

Classifications

• G01D5/20 Primary

  by varying inductance, e.g. by a movable armature · CPC title

• H05K1/116

  Lands, clearance holes or other lay-out details concerning the surrounding of a via · CPC title

• G01D5/22 Primary

  differentially influencing two coils · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• G01D5/243

  influencing the phase or frequency of AC · CPC title