Heat dissipation fan

US11268525B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11268525-B2
Application numberUS-201916716513-A
CountryUS
Kind codeB2
Filing dateDec 17, 2019
Priority dateDec 18, 2018
Publication dateMar 8, 2022
Grant dateMar 8, 2022

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat dissipation fan suited for being assembled in an electronic device is provided. The heat dissipation fan includes a hub and a plurality of fan blades disposed at and surrounding the hub. The fan blade has ductility and flexibility, and any two fan blades next to each other are in different thickness.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat dissipation fan, adapted to be disposed in an electronic device, the heat dissipation fan comprising: a hub; and a plurality of fan blades, surrounding and disposed at the hub, wherein the fan blades have ductility and flexibility, and any two of the fan blades next to each other have different thicknesses, wherein each of the fan blades is a sheet-like structure with constant thickness and the fan blades comprise at least three thicknesses. 2. The heat dissipation fan according to claim 1 , wherein a material of the fan blades is metal. 3. The heat dissipation fan according to claim 1 , further comprising a housing disposed in the electronic device, the hub and the fan blades are received in the housing, the housing has a tongue portion disposed on one side of an air outlet of the heat dissipation fan. 4. The heat dissipation fan according to claim 1 , wherein the hub and the fan blades are located on a reference plane and rotated on the reference plane, and the fan blades are respectively assembled on the hub in a direction orthogonal to the reference plane. 5. The heat dissipation fan according to claim 4 , wherein the hub has a lateral surface orthogonal to the reference plane, and the fan blades are extended radially from the lateral surface. 6. The heat dissipation fan according to claim 4 , wherein the hub has a lateral surface orthogonal to the reference plane, and the fan blades are extended at an oblique angle relative to the lateral surface. 7. The heat dissipation fan according to claim 1 , wherein each of the fan blades has an arc-shaped contour with respect to a radial plane of the hub, and a concave surface of the arc-shaped contour faces a rotation direction of the fan blades. 8. The heat dissipation fan according to claim 1 , wherein the fan blades are equidistantly disposed at the hub. 9. The heat dissipation fan according to claim 1 , wherein each of the fan blades has a thickness of less than 0.5 mm. 10. The heat dissipation fan according to claim 1 , wherein the number of the fan blades is greater than or equal to 50.

Assignees

Inventors

Classifications

  • by mistuning rotor blades or stator vanes with irregular interblade spacing, airfoil shape · CPC title

  • by means of rotor construction or layout, e.g. unequal distribution of blades or vanes · CPC title

  • Flexible vanes · CPC title

  • Ductility · CPC title

  • F04D17/16Primary

    for displacing without appreciable compression · CPC title

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Frequently asked questions

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What does patent US11268525B2 cover?
A heat dissipation fan suited for being assembled in an electronic device is provided. The heat dissipation fan includes a hub and a plurality of fan blades disposed at and surrounding the hub. The fan blade has ductility and flexibility, and any two fan blades next to each other are in different thickness.
Who is the assignee on this patent?
Acer Inc
What technology area does this patent fall under?
Primary CPC classification F04D17/16. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Mar 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).