Security element comprising a printed image with a three-dimensional effect

Patent metadata

Field	Value
Publication number	US-11267277-B2
Application number	US-201816625896-A
Country	US
Kind code	B2
Filing date	Jun 22, 2018
Priority date	Jun 27, 2017
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A method for manufacturing a physical security element with a spatially appearing pattern includes a carrier and at least one see-through transparent cover layer. Onto the carrier is applied a design layer deformable under pressure. Either the carrier has a lower dimensional stability under heat than the cover layer, or a cover layer has a lower dimensional stability under heat than the carrier. A see-through transparent structural layer forming the pattern is arranged between carrier and cover layer. The structural layer has a higher dimensional stability under heat than either the carrier or a cover layer. During lamination, the structural layer is pressed into the carrier or into the cover layer, whereby the design layer is deformed under the pattern formed by the structural layer and the structural layer in its edge regions is reshaped in such a way that its surfaces, in cross-section, converge tangentially.

First claim

The invention claimed is:

1. A method for manufacturing a physical security element having a spatially appearing pattern, comprising the steps of:
providing a carrier,
providing at least one see-through transparent cover layer,
applying a design layer onto the carrier,
wherein either the carrier has a lower dimensional stability under heat than the cover layer, or a cover layer has a lower dimensional stability under heat than the carrier,
wherein the design layer is deformable under pressure, wherein the thickness of the design layer is not changed or is changed by a maximum of 10%, by the deformation,
arranging a see-through transparent structural layer between carrier and cover layer forming the pattern,
wherein the structural layer has a higher or a similar dimensional stability under heat than the carrier or a cover layer,
laminating the carrier and the layers under pressure and heat,
wherein during lamination the structural layer is pressed into the carrier or via the carrier into a cover layer, whereby the design layer is deformed in accordance with the pattern formed by the structural layer, and whereby the structural layer in its edge regions is reshaped in such a way that, in cross-section, the surfaces of the structural layer converge tangentially.

2. The method according to claim 1 , wherein the carrier has a lower dimensional stability under heat than design layer, cover layer and structural layer, and the structural layer is arranged between design layer and cover layer so that during lamination the design layer is pressed into the carrier by the structural layer,
wherein the structural layer in its edge regions is reshaped lenticularly in such a way that the surface of the structural layer which faces the top layer and the surface of the structural layer which faces the design layer converge tangentially at the edges.

3. The method according to claim 1 , wherein the design layer is applied onto the side of and facing away from the carrier, and a further cover layer is arranged thereabove the design layer,
wherein the further cover layer has a lower dimensional stability under heat than design layer, cover layer, carrier and structural layer, and the structural layer is arranged between carrier and cover layer, so that during lamination the design layer and the carrier are pressed into the further cover layer by the structural layer,
wherein the structural layer is reshaped lenticularly in such a way that the surface of the structural layer which faces the cover layer and the surface of the structural layer which faces the design layer converge tangentially at the edge regions thereof.

4. The method according to claim 1 , wherein the structural layer is applied as a lacquer layer onto the design layer and/or the cover layer.

5. The method according to claim 4 , wherein the lacquer layer is hardened.

6. The method according to claim 1 , wherein the design layer is a metallic ink and/or is applied onto the carrier before the lamination.

7. The method according to claim 1 , wherein the surface of the structural layer which faces the design layer rises towards the surface which faces the cover layer.

8. The method according to claim 1 , wherein the design layer has a thickness of 5 to 25 μm and/or is applied in the form of at least two layers which differ in a material property.

9. The method according to claim 1 , wherein the structural layer possesses a thickness of 25 to 125 μm.

10. The method according to claim 1 , wherein the cover layer possesses a thickness of 50 to 200 μm.

11. The method according to claim 1 , wherein the structural layer is substantially undeformed in the inner zones, and the edge regions are reshaped lenticularly, forming a transition by decreasing the layer thickness until it disappears.

12. A physical security element which carries a spatially appearing pattern, having a carrier on which a design layer, a see-through transparent structural layer and a see-through transparent cover layer are configured,
wherein the structural layer covers only parts of the security element and the pattern is formed wholly or partially by the structural layer,
wherein the structural layer is pressed into the carrier and is reshaped lenticularly at its edge regions so that the surfaces of the structural layer converge tangentially in the edge regions, and through the structural layer also the design layer is pressed into the carrier, the design layer being deformed in accordance with the pattern in the structural layer,
wherein the thickness of the design layer in the deformed regions is the same or, apart from deviations of max 10%, almost the same as in the rest of the regions.

13. The security element according to claim 12 , wherein it is configured in the form of a card in a standardized format.

14. A method for manufacturing a physical security element having a spatially appearing pattern, comprising the steps of:
providing a carrier,
providing at least one see-through transparent cover layer,
applying a design layer onto the carrier,
wherein either the carrier has a lower dimensional stability under heat than the cover layer, or a cover layer has a lower dimensional stability under heat than the carrier,
wherein the design layer is deformable under pressure,
arranging a see-through transparent structural layer between carrier and cover layer forming the pattern,
wherein the structural layer has a higher or a similar dimensional stability under heat than the carrier or a cover layer,
laminating the carrier and the layers under pressure and heat,
wherein during lamination the structural layer is pressed into the carrier or via the carrier into a cover layer, whereby the design layer is deformed in accordance with the pattern formed by the structural layer, and whereby the structural layer in its edge regions is reshaped in such a way that, in cross-section, the surfaces of the structural layer converge tangentially;
wherein the structural layer is substantially undeformed in the inner zones, and the edge regions are reshaped lenticularly, forming a transition by decreasing the layer thickness until it disappears.

Assignees

• Giesecke & Devrient Mobile Security Gmbh

Inventors

• Nunez Juan
• Muller Oliver

Classifications

• B42D25/46

  using pressure · CPC title

• B42D25/40

  Manufacture · CPC title

• B42D25/29

  Securities; Bank notes · CPC title

• B42D25/324

  Reliefs · CPC title

• B42D25/48

  Controlling the manufacturing process · CPC title