Polymer film laminated substrate and method for producing flexible electronic device

Patent metadata

Field	Value
Publication number	US-11267216-B2
Application number	US-201816479825-A
Country	US
Kind code	B2
Filing date	Jan 23, 2018
Priority date	Jan 25, 2017
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

[Problem] To provide a polyimide film laminated substrate in which stable peeling with a constant low force from an inorganic substrate is enabled when a polyimide film is to be peeled from an inorganic substrate even after heat treatment at a temperature exceeding 500° C. is performed.[Solution] Silane coupling agent treatment is performed on an inorganic substrate on which a thin film of an aluminum oxide, a thin film of a composite oxide of aluminum and silicon, a thin film of molybdenum or tungsten, or an alloy thin film of molybdenum and tungsten is formed continuously or discontinuously on a part of at least one surface thereof, and a polyimide film layer is further laminated on the silane coupling agent layer. In the obtained laminate, the part where the aluminum oxide thin film layer is present functions as an easily-peelable layer, the part where no aluminum oxide thin film layer functions as an easily-bondable part. The bonding strength of the easily-peelable part does not change even after heat treatment at 500° C. or more, and the low value is stably maintained.

First claim

The invention claimed is:

1. A polymer film laminated substrate comprising a thin film continuously or discontinuously formed on a part of at least one surface of an inorganic substrate; a silane coupling agent layer continuously or discontinuously formed on the thin film; and further a polymer film layer laminated on the silane coupling agent layer, wherein
the thin film is (i) a thin film of an aluminum oxide, (ii) a thin film of a composite oxide of aluminum and silicon, or (iii) a thin film of at least one metal selected from molybdenum and tungsten,
a surface on which the polymer film is laminated includes: an easily-peelable part being a region in which the polymer film can be easily separated from the inorganic substrate together with the silane coupling agent layer when the polymer film is cut; and an easily-bondable part being a region in which the polymer film cannot be easily separated from the inorganic substrate, and
bonding strength of the easily-peelable part is 0.5 N/cm or less.

2. The polymer film laminated substrate according to claim 1 , wherein the bonding strength of the easily-peelable part after heat treatment at 500° C. for 10 minutes is 0.5 N/cm or less.

3. The polymer film laminated substrate according to claim 2 , wherein the thin film is discontinuously formed on at least one surface of the inorganic substrate, the easily-peelable part is covered with the thin film, and the easily-bondable part is not covered with the thin film.

4. The polymer film laminated substrate according to claim 3 , wherein the polymer film is a polyimide film.

5. The polymer film laminated substrate according to claim 4 , which is used to temporarily support a polymer film material on the inorganic substrate when an electronic device is formed on the polymer film.

6. The polymer film laminated substrate according to claim 1 , wherein the thin film is discontinuously formed on at least one surface of the inorganic substrate, the easily-peelable part is covered with the thin film, and the easily-bondable part is not covered with the thin film.

7. The polymer film laminated substrate according to claim 1 , wherein the polymer film is a polyimide film.

8. The polymer film laminated substrate according to claim 1 , which is used to temporarily support a polymer film material on the inorganic substrate when an electronic device is formed on the polymer film.

9. A method for producing a flexible electronic device, comprising the steps of:
continuously or discontinuously forming a thin film on a part of at least one surface of an inorganic substrate;
continuously or discontinuously forming a silane coupling agent layer on the thin film;
laminating a polymer film layer on the silane coupling agent layer;
forming an electronic device on the polymer film; and
cutting the polymer film layer and peeling at least a part of the polymer film layer from the inorganic substrate together with the electronic device,
wherein the thin film is (i) a thin film of an aluminum oxide, (ii) a thin film of a composite oxide of aluminum and silicon, or (iii) a thin film of at least one metal selected from molybdenum and tungsten.

Assignees

• Toyo Boseki

Inventors

• Okuyama Tetsuo
• Watanabe Naoki
• Tsuchiya Toshiyuki
• Yamashita Masahiro
• Tokuda Kaya

Classifications

• H10W70/695

  Organic materials · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10P95/11 Primary

  Separation of active layers from substrates · CPC title

• H10D86/60

  wherein the TFTs are in active matrices · CPC title

• H10D86/411

  characterised by materials, geometry or structure of the substrates · CPC title