Chemical mechanical planarization membrane

Patent metadata

Field	Value
Publication number	US-11267099-B2
Application number	US-201815994088-A
Country	US
Kind code	B2
Filing date	May 31, 2018
Priority date	Sep 27, 2017
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

In some embodiments, the present disclosure, in some embodiments, relates to a method of forming a CMP membrane. The method is performed by providing a malleable material within a cavity within a membrane mold. The cavity has a central region and a peripheral region surrounding the central region. The malleable material within the cavity is cured to form a membrane. Curing the malleable material is performed by heating the malleable material within the central region of the membrane mold to a first temperature and heating the malleable material within the peripheral region of the membrane mold to a second temperature that is greater than the first temperature.

First claim

What is claimed is:

1. A method of forming a chemical mechanical planarization (CMP) membrane, comprising:
providing a malleable material within a cavity in a membrane mold, wherein the cavity comprises a central region and a peripheral region surrounding the central region;
curing the malleable material to form a membrane, wherein curing the malleable material comprises:
heating the malleable material within the central region of the membrane mold to a first temperature to cause the malleable material along an uppermost surface of the membrane facing away from the membrane mold to have a first malleability within the central region;
heating the malleable material within the peripheral region of the membrane mold to a second temperature that is greater than the first temperature, wherein heat applied to the uppermost surface of the malleable material within the peripheral region causes the malleable material along the uppermost surface of the membrane to have a second malleability within the peripheral region that is greater than the first malleability; and

attaching the membrane to a CMP carrier so that the uppermost surface of the membrane faces away from the CMP carrier.

2. The method of claim 1 ,
wherein the membrane has a substantially constant thickness between outermost sidewalls of the membrane; and
wherein the malleable material having the first malleability and the malleable material having the second malleability both continuously extend between a bottommost surface of the membrane and the uppermost surface of the membrane.

3. The method of claim 1 , wherein the peripheral region separates the central region from a second peripheral region that surrounds the peripheral region, the second peripheral region having a third malleability that is less than the second malleability.

4. The method of claim 1 , wherein the peripheral region extends as a continuous ring around the central region.

5. The method of claim 1 , wherein heating the malleable material within the central region to the first temperature and heating the malleable material within the peripheral region to the second temperature is performed by a plurality of heating lamps.

6. The method of claim 1 , wherein heating the malleable material within the central region to the first temperature and heating the malleable material within the peripheral region to the second temperature is performed by resistive heating elements embedded within the membrane mold.

7. The method of claim 1 , wherein a difference between the first temperature and the second temperature is configured to achieve a difference in malleability or stiffness between a central region of the membrane and a peripheral region of the membrane.

8. The method of claim 1 , wherein the malleable material consists of silicone.

9. The method of claim 1 , further comprising:
attaching the membrane to the CMP carrier;
performing a CMP process on a substrate using the membrane;
determining a first deviation in removal rates between a central region of the substrate and a peripheral region of the substrate; and
determining a first new temperature and a second new temperature, wherein the first new temperature and the second new temperature are configured to be used to form an additional membrane that provides for a second deviation in removal rate that is less than the first deviation in removal rates.

10. The method of claim 9 , further comprising:
providing additional malleable material within the cavity in the membrane mold;
heating the additional malleable material within the central region of the membrane mold to the first new temperature; and
heating the additional malleable material within the peripheral region of the membrane mold to the second new temperature.

11. A method of forming a CMP membrane, comprising:
providing silicone within a cavity defined by interior surfaces of a membrane mold, wherein the cavity comprises a central region and a peripheral region surrounding the central region;
forming a membrane within the membrane mold, wherein forming the membrane comprises:
heating the silicone within the central region of the cavity of the membrane mold to a first temperature that causes the silicone within a central region of the membrane to have a first stiffness;
heating the silicone within the peripheral region of the cavity of the membrane mold to a second temperature that causes the silicone within a peripheral region of the membrane to have a second stiffness that is less than the first stiffness, wherein the silicone that is heated to have the first stiffness laterally contacts the silicone that is heated to have the second stiffness; and

attaching the membrane to a CMP carrier, wherein a bottommost surface of the membrane comprises silicone having both the first stiffness and the second stiffness after attaching the membrane to the CMP carrier.

12. The method of claim 11 , wherein heating the silicone within the central region to the first temperature and heating the silicone within the peripheral region to the second temperature is performed by a plurality of heating lamps.

13. The method of claim 11 , wherein the silicone that is heated to have the first stiffness laterally abuts the silicone that is heated to have the second stiffness along an interface that vertically extends from the bottommost surface of the membrane to a topmost surface of the membrane.

14. The method of claim 11 ,
wherein the peripheral region laterally extends from the central region to an outermost edge of the cavity; and
wherein the silicone that is heated to have the first stiffness and the silicone that is heated to have the second stiffness both vertically extend completely through the membrane.

15. The method of claim 11 , wherein the silicone is transparent.

16. The method of claim 11 , wherein the peripheral region is a non-continuous ring comprising discrete segments that are separated by the central region.

17. A chemical mechanical planarization (CMP) tool, comprising:
a housing;
a retainer ring attached to the housing and configured to laterally surround a substrate;
a malleable membrane having a lower surface configured to contact a back-side of the substrate, wherein the lower surface of the malleable membrane comprises a first malleable material that provides a central region of the lower surface with a first stiffness and a second malleable material that provides a first peripheral region of the lower surface, which surrounds the central region, with a second stiffness less than the first stiffness;
wherein the first peripheral region of the lower surface is configured to contact the substrate; and
wherein the first malleable material of the lower surface provides the first stiffness and the second malleable material of the lower surface provides the second stiffness.

18. The CMP tool of claim 17 , wherein the first malleable material covers a side of the second malleable material.

19. The CMP tool of claim 17 ,
wherein the first malleable material arranged along the lower surface of the malleable membrane within the central region comprises a first form of silicone having the first stiffness and the second malleable material arranged along the lower surface of the malleable membrane within the first peripheral region comprises a second form of silicone having the second stiffness;
wherein the first form of silicone and the second form of silicone both define a smooth upper surface and a smooth lower surface of the malleable membrane; and
wherein the first form of sili

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Cheng-Ping
• Lee Ren-Dou
• Peng Sheng-Tai
• Lai Tsung-Lung
• Shieh Tzi-Yi
• Chang Chien-Wei

Classifications

• H10P52/403

  of conductive or resistive materials · CPC title

• B24B37/20

  Lapping pads for working plane surfaces · CPC title

• B24B37/015

  Temperature control · CPC title

• H10W20/062

  by smoothing of conductive parts, e.g. by planarisation · CPC title

• B24B37/32 Primary

  Retaining rings · CPC title