Liquid coolant based thermal energy management for containers receiving pluggable circuit modules

Patent metadata

Field	Value
Publication number	US-11266043-B2
Application number	US-201815913462-A
Country	US
Kind code	B2
Filing date	Mar 6, 2018
Priority date	Mar 6, 2018
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

Embodiments include apparatuses, methods, and systems for managing thermal energy of a computing device. An apparatus may include a heat pipe physically and thermally attached to a container by a retainer. The container may include a plurality of slots to removably receive various plurality of pluggable circuit modules during a lifetime of the container. The heat pipe may facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into the plurality of slots of the container. The retainer may have a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold. Other embodiments may also be described and claimed.

First claim

What is claimed is:

1. An apparatus for managing thermal energy of a computing device, comprising:
a container having at least first and second slots;
first and second pluggable circuit modules removably received by the at least first and second slots of the container respectively;
a first heat sink attached to the container, wherein the first heat sink is in physical and thermal contact with the first pluggable circuit module;
a second heat sink attached to the container, wherein the second heat sink is in physical and thermal contact with the second pluggable circuit module;
a heat pipe to facilitate a liquid coolant flow to remove thermal energy from the first and second pluggable circuit modules removably received into the at least first and second slots of the container, wherein the heat pipe is thermally coupled to the first and second heat sinks;
a retainer to physically and thermally attach the heat pipe to the container; and
a heat spreader coupled to the heat pipe, to provide a first thermal conduction path among the heat spreader, the heat pipe, the first heat sink, and the first pluggable circuit module, and further to provide a second thermal conduction path among the heat spreader, the heat pipe, the second heat sink, and the second pluggable circuit module, to provide for heat dissipation
below a design performance threshold, wherein the heat spreader and the heat pipe are mounted directly on an upper surface of the container.

2. The apparatus of claim 1 , wherein the first and second pluggable circuit modules include a small form-factor pluggable (SFP) module, a compact small form-factor pluggable (CSFP) module, a quad small form-factor pluggable (QSFP) module, or a quad small form-factor pluggable (QSFP)-DD double density module.

3. The apparatus of claim 1 , wherein the retainer is a spring metal clip, a torsion spring, a fastener, a cable, a chain, a wrap, or a hinge.

4. The apparatus of claim 1 , wherein the retainer is attached to an outer surface of the container, or inside the container.

5. The apparatus of claim 1 , wherein the retainer includes stainless steel, carbon steel, or alloy steel, with the tensile strength in a range of 2 lbs to 15 lbs.

6. The apparatus of claim 1 , wherein the design performance threshold for the container is to cool an output power of 10 Watts at an operating temperature of 70 degrees Celsius for the container.

7. The apparatus of claim 1 , wherein a lifetime of the container is in a range of about 50 to 5000 repeated receiving and removal of the first and second pluggable circuit modules.

8. The apparatus of claim 1 , wherein the heat pipe is to be shared by the first and second pluggable circuit modules removably received into the at least first and second slots of the container.

9. The apparatus of claim 1 , wherein at least a portion of the first or second thermal conduction path is embedded into a recess of the container.

10. The apparatus of claim 1 , wherein the first or second heat sink or the heat spreader includes copper or aluminum, and is attached to an outer surface of the container by the retainer, wherein the retainer is a spring metal clip.

11. The apparatus of claim 1 , wherein the heat spreader is soldered to the heat pipe.

Assignees

• Intel Corp

Inventors

• Chen Annie
• Rodriguez David
• Faneuf Barrett M
• Cevallos Juan G

Classifications

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• G06F1/20

  Cooling means · CPC title