Cooling apparatus for electronic element

Patent metadata

Field	Value
Publication number	US-11266041-B2
Application number	US-202016893394-A
Country	US
Kind code	B2
Filing date	Jun 4, 2020
Priority date	Dec 8, 2017
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe. The unit heat pipe includes one end which is connected to the outer surface of the cooling cover and another end to which a plurality of cooling ribs are formed to extend outward in a radial direction from an outer circumferential surface of the another end of the unit heat pipe.

First claim

The invention claimed is:

1. A cooling apparatus for an electronic element comprising:
a printed circuit board comprising one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation;
a board case which accommodates the printed circuit board;
a cooling cover which has an inner surface and an outer surface, wherein the inner surface of the cooling cover is in close contact with an another surface of the printed circuit board while covering the board case; and
a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally,
wherein each of the plurality of radial cooling bodies comprises a unit heat pipe, wherein the unit heat pipe comprises one end which is connected to the outer surface of the cooling cover and another end to which a plurality of cooling ribs are formed to extend outward in a radial direction from an outer circumferential surface of the another end of the unit heat pipe.

2. The cooling apparatus for the electronic element of claim 1 ,
wherein portions of the outer surface of the cooling cover are recessed.

3. The cooling apparatus for the electronic element of claim 2 ,
wherein the outer surface of the cooling cover is formed with a plurality of heat conduction grooves corresponding to a number of the plurality of unit heat pipes, each of the plurality of heat conduction grooves being coupled with one end of a corresponding unit heat pipes of the plurality of unit heat pipes so that the one end is embedded in the respective heat conducting groove.

4. The cooling apparatus for the electronic element of claim 3 ,
wherein a first number of heat conduction grooves among the plurality of heat conduction grooves longitudinally form a line vertically, and are formed so that the first number of heat conduction grooves adjacent to each other vertically are spaced apart from each other at a predetermined distance.

5. The cooling apparatus for the electronic element of claim 3 ,
wherein a first number of heat conduction grooves among the plurality of heat conduction grooves longitudinally form a plurality of lines vertically, and are formed so that the lines adjacent to each other horizontally are spaced apart from each other at a predetermined distance.

6. The cooling apparatus for the electronic element of claim 3 ,
wherein the plurality of heat conduction grooves and the plurality of unit heat pipes are disposed to have different heights of the heat conduction grooves and the unit heat pipes adjacent to each other horizontally.

7. The cooling apparatus for the electronic element of claim 2 ,
wherein the plurality of cooling ribs formed on the outer circumferential surface of the another end of each of the plurality of unit heat pipes are each formed so that each tip of the plurality of cooling ribs spaced apart from the outer circumferential surface of the another end of the unit heat pipe is not higher than the another end of the unit heat pipe.

8. The cooling apparatus for the electronic element of claim 2 ,
wherein each of the plurality of radial cooling bodies further comprises a pipe fixing block which is coupled to the outer surface of the cooling cover, and fixes a corresponding unit heat pipe to surround the outer circumferential surface of the one end of the corresponding unit heat pipe which are not recessed to the outer surface of the cooling cover.

9. The cooling apparatus for the electronic element of claim 8 ,
wherein the one end of each of the plurality of unit heat pipes and the respective pipe fixing block among the components of the plurality of radial cooling bodies is provided at a location corresponding to a location of a respective one of the plurality of electronic elements disposed on the inner surface of the cooling cover.

10. The cooling apparatus for the electronic element of claim 2 ,
wherein the plurality of cooling ribs are formed to be spaced apart from the outer surface of the cooling cover at a predetermined distance.

11. The cooling apparatus for the electronic element of claim 2 ,
wherein a distance from each of the tips of the plurality of cooling ribs to the outer surface of the cooling cover is the same as a distance from all other tips to the outer surface of the cooling cover.

12. The cooling apparatus for the electronic element of claim 2 ,
wherein the plurality of unit heat pipes are provided so that heat transfer fluid is filled therein, the heat transfer fluid being configured to be vaporized by heat transferred from the cooling cover and to transfer the heat to the plurality of cooling ribs and then be liquefied.

13. The cooling apparatus for the electronic element of claim 12 ,
wherein each of the plurality of unit heat pipes has one end coupled to the outer surface of the cooling cover and the one end is located lower than the another end provided with the plurality of cooling ribs.

Assignees

• Kmw Inc

Inventors

• Kim Duk Yong
• Yang Jun Woo
• Yeo Jin Soo
• Yoo Chang Woo
• Park Min Sik
• Kim Hye Yeon

Classifications

• H05K5/03

  Covers · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20936 Primary

  Liquid coolant with phase change · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title