Printed wiring board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11266018-B2
Application number	US-201816652849-A
Country	US
Kind code	B2
Filing date	Dec 4, 2018
Priority date	Dec 8, 2017
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

A printed wiring board includes a main substrate, a standing substrate, a first electrode portion, and a second electrode portion. The second electrode portion is connected to the first electrode portion with solder while a support portion is inserted in a slit. The first electrode portion is provided to reach the slit. The second electrode portion is disposed to span from a bottom surface to a height position higher than or equal to a midpoint between a top surface and the bottom surface.

First claim

The invention claimed is:

1. A printed wiring board comprising:
a main substrate having a top surface and a bottom surface facing the top surface, the main substrate having a slit extending from the top surface to the bottom surface in a direction in which the top surface and the bottom surface face each other;
a first electrode portion provided on the bottom surface of the main substrate;
a standing substrate having a support portion inserted in the slit; and
a second electrode portion provided on both surfaces of the support portion of the standing substrate,
the second electrode portion being connected to the first electrode portion with solder while the support portion is inserted in the slit,
the first electrode portion being provided to reach the slit,
the second electrode portion being disposed to span from the bottom surface to a height position higher than or equal to a midpoint between the top surface and the bottom surface, and
both surfaces of the support portion being arranged in the slit to be spaced from ends of the slit, with a distance of the space being more than or equal to 50 μm and less than or equal to 190 μm.

2. The printed wiring board according to claim 1 , wherein
the first electrode portion and an entirety of the second electrode portion exposed at the slit are covered with the solder, the solder continues to a fillet on the second electrode portion in the slit, and a slit-side end surface of each of a plurality of first electrodes is covered with solder.

3. The printed wiring board according to claim 1 , wherein
the standing substrate has a front surface and a rear surface facing the front surface, and
in a direction in which the front surface and the rear surface face each other, the slit has a width greater than a thickness of the support portion.

4. The printed wiring board according to claim 1 , wherein
the main substrate has a first auxiliary slit extending from the top surface to the bottom surface in the direction in which the top surface and the bottom surface face each other,
the first auxiliary slit is separated from the slit and arranged to be aligned with the slit,
the standing substrate has a first auxiliary support portion separated from the support portion and arranged to be aligned with the support portion,
the first auxiliary support portion is inserted in the first auxiliary slit, and
in a direction in which the slit and the first auxiliary slit are arranged to be aligned with each other, the support portion is greater in length than the first auxiliary support portion, and the slit is greater in length than the first auxiliary slit.

5. The printed wiring board according to claim 4 , wherein
the main substrate has a second auxiliary slit extending from the top surface to the bottom surface in the direction in which the top surface and the bottom surface face each other,
the second auxiliary slit is separated from the slit and arranged such that the slit is interposed between the first auxiliary slit and the second auxiliary slit,
the standing substrate has a second auxiliary support portion separated from the support portion and arranged such that the support portion is interposed between the first auxiliary support portion and the second auxiliary support portion,
the second auxiliary support portion is inserted in the second auxiliary slit,
the printed wiring board further comprises:
a first auxiliary main electrode and a second auxiliary main electrode provided on the bottom surface of the main substrate and arranged such that the first electrode portion is interposed between the first auxiliary main electrode and the second auxiliary main electrode;
a first auxiliary sub-electrode provided on the first auxiliary support portion; and
a second auxiliary sub-electrode provided on the second auxiliary support portion,
the first auxiliary sub-electrode is connected to the first auxiliary main electrode with solder while the first auxiliary support portion is inserted in the first auxiliary slit,
the second auxiliary sub-electrode is connected to the second auxiliary main electrode with solder while the second auxiliary support portion is inserted in the second auxiliary slit,
the first electrode portion includes a plurality of first electrodes,
the second electrode portion includes a plurality of second electrodes,
each of the plurality of second electrodes is connected to each of the plurality of first electrodes with solder,
each of the first auxiliary main electrode and the second auxiliary main electrode is greater in surface area than each of the plurality of first electrodes, and
each of the first auxiliary sub-electrode and the second auxiliary sub-electrode is greater in surface area than each of the plurality of second electrodes.

6. The printed wiring board according to claim 1 , further comprising a raised resin portion provided at a position where the slit intersects the second electrode portion, wherein
the raised resin portion is provided on the second electrode portion.

7. A method for manufacturing a printed wiring board, the method comprising:
preparing a main substrate having a top surface and a bottom surface facing the top surface, the main substrate having a first electrode portion provided on the bottom surface;
forming a slit in such a manner that the first electrode portion is partially cut out, the slit extending from the top surface to the bottom surface of the main substrate;
preparing a standing substrate having a support portion to be inserted in the slit, the standing substrate having a second electrode portion provided on the support portion; and
connecting the second electrode portion to the first electrode portion with solder after the support portion of the standing substrate is inserted in the slit,
both surfaces of the support portion being arranged in the slit to be spaced from ends of the slit, with a distance of the space being more than or equal to 50 μm and less than or equal to 190 μm.

8. The printed wiring board according to claim 3 , wherein
the width of the slit has a dimension obtained by adding 0.35 mm to the thickness of the support portion.

Assignees

• Mitsubishi Electric Corp

Inventors

• Sasaki Shunsuke
• Morimoto Yusuke

Classifications

• H05K3/366 Primary

  substantially perpendicularly to each other (H05K3/361 takes precedence) · CPC title

• H05K3/34

  by soldering · CPC title

• H05K2201/09063

  Holes or slots in insulating substrate not used for electrical connections · CPC title

• H05K1/117

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title

• H05K2201/0302

  Properties and characteristics in general · CPC title