Thermal temperature sensors for power amplifiers

Patent metadata

Field	Value
Publication number	US-11264954-B2
Application number	US-201916684179-A
Country	US
Kind code	B2
Filing date	Nov 14, 2019
Priority date	Nov 14, 2019
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

Thermal temperature sensors for power amplifiers are provided herein. In certain implementations, a semiconductor die includes a compound semiconductor substrate, and a power amplifier including a plurality of field-effect transistors (FETs) configured to amplify a radio frequency (RF) signal. The plurality of FETs are arranged on the compound semiconductor substrate as a transistor array. The semiconductor die further includes a semiconductor resistor configured to generate a signal indicative of a temperature of the transistor array. The semiconductor resistor is located adjacent to one end of the transistor array.

First claim

What is claimed is:

1. A semiconductor die with thermal temperature sensing, the semiconductor die comprising:
a compound semiconductor substrate;
a power amplifier including a plurality of field-effect transistors (FETs) configured to amplify a radio frequency (RF) signal, wherein the plurality of FETs are arranged on the compound semiconductor substrate as a transistor array;
a semiconductor resistor configured to generate a signal indicative of a temperature of the transistor array; and
a voltage divider including the semiconductor resistor and configured to output the signal indicative of the temperature as a voltage,
wherein the semiconductor resistor is located adjacent to one end of the transistor array.

2. The semiconductor die of claim 1 , wherein the voltage divider further comprises a thin film resistor electrically connected in series with the semiconductor resistor.

3. The semiconductor die of claim 1 , wherein the voltage divider further comprises a transistor configured to amplify the signal indicative of the temperature.

4. The semiconductor die of claim 1 , wherein the voltage divider further comprises a diode electrically connected in series with the semiconductor resistor.

5. The semiconductor die of claim 1 , further comprising an amplifier configured to amplify the signal indicative of the temperature.

6. The semiconductor die of claim 1 , wherein the semiconductor resistor is located adjacent to at least two sides of the transistor array.

7. The semiconductor die of claim 1 , further comprising an amplifier electrically connected to the semiconductor resistor and configured to output the signal indicative of the temperature.

8. The semiconductor die of claim 1 , further comprising a reference semiconductor resistor configured to generate a signal indicative of a reference temperature, the reference semiconductor resistor placed in a region substantially unaffected by heat generated by the transistor array.

9. A power amplifier comprising:
a plurality of field-effect transistors (FETs) configured to amplify a radio frequency (RF) signal, wherein the plurality of FETs are arranged as a transistor array;
a semiconductor resistor configured to generate a signal indicative of a temperature of the transistor array; and
a voltage divider including the semiconductor resistor and configured to output the signal indicative of the temperature as a voltage,
wherein the semiconductor resistor is located adjacent to one end of the transistor array.

10. The power amplifier of claim 9 , wherein the voltage divider further comprises a thin film resistor electrically connected in series with the semiconductor resistor.

11. The power amplifier of claim 9 , wherein the voltage divider further comprises a transistor configured to amplify the signal indicative of the temperature.

12. The power amplifier of claim 9 , wherein the voltage divider further comprises a diode electrically connected in series with the semiconductor resistor.

13. The power amplifier of claim 9 , further comprising an amplifier configured to amplify the signal indicative of the temperature.

14. The power amplifier of claim 9 , wherein the semiconductor resistor is located adjacent to at least two sides of the transistor array.

15. The power amplifier of claim 9 , further comprising a comparator electrically connected to the semiconductor resistor and configured to output the signal indicative of the temperature.

16. A power amplifier comprising:
a plurality of field-effect transistors (FETs) configured to amplify a radio frequency (RF) signal, wherein the plurality of FETs are arranged as a transistor array;
a semiconductor resistor configured to generate a signal indicative of a temperature of the transistor array; and
a reference semiconductor resistor configured to generate a signal indicative of a reference temperature, the reference semiconductor resistor placed in a region substantially unaffected by heat generated by the transistor array,
wherein the semiconductor resistor is located adjacent to one end of the transistor array.

17. The power amplifier of claim 16 , further comprising:
a voltage divider including the semiconductor resistor and configured to output the signal indicative of the temperature as a voltage.

18. The power amplifier of claim 17 , wherein the voltage divider further comprises a thin film resistor electrically connected in series with the semiconductor resistor.

19. The power amplifier of claim 17 , wherein the voltage divider further comprises a transistor configured to amplify the signal indicative of the temperature.

20. The power amplifier of claim 17 , wherein the voltage divider further comprises a diode electrically connected in series with the semiconductor resistor.

Assignees

• Analog Devices Inc

Inventors

• Benson keith e

Classifications

• H03F3/213

  in integrated circuits · CPC title

• H03F2200/451

  the amplifier being a radio frequency amplifier · CPC title

• H03F2200/468

  the temperature being sensed · CPC title

• G01K7/16

  using resistive elements · CPC title

• G01K13/00

  Thermometers specially adapted for specific purposes · CPC title