Tin-plated copper terminal material, terminal, and electric-wire terminal structure

Patent metadata

Field	Value
Publication number	US-11264750-B2
Application number	US-201816612812-A
Country	US
Kind code	B2
Filing date	May 15, 2018
Priority date	May 16, 2017
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

Provided is a tin-plated copper terminal material, a terminal formed from the terminal material, and an electric-wire terminal structure using the terminal: the terminal material has a substrate of copper or a copper alloy; an intermediate zinc layer of a zinc alloy that is formed on the substrate and has a thickness of 0.10 μm to 5.00 μm; and a tin layer of tin or a tin alloy that is formed on the intermediate zinc layer and in which the length proportion occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed.

First claim

The invention claimed is:

1. A tin-plated copper terminal material comprising: a substrate made of copper or a copper alloy; an intermediate zinc layer formed on the substrate, made of a zinc alloy, and having a thickness of not less than 0.10 μm and not more than 5.00 μm; and a tin layer made of tin or a tin alloy, formed on the intermediate zinc layer, in which a proportion of a length occupied by low-angle grain boundaries is not less than 2% and not more than 30% with respect to a total length of all crystal grain boundaries.

2. The tin-plated copper terminal material according to claim 1 , wherein corrosion potential with respect to a silver-silver chloride electrode is not more than −500 mV and not less than −900 mV.

3. The tin-plated copper terminal material according claim 1 , wherein the intermediate zinc layer comprising one or more among nickel, iron, manganese, molybdenum, cobalt, cadmium and lead as an additional element, and content percentage of zinc in the intermediate zinc layer is not less than 65% by mass and not more than 95% by mass.

4. The tin-plated copper terminal material according to claim 1 , wherein an average crystal grain size of the tin layer is not less than 0.5 μm and not more than 8.0 μm.

5. The tin-plated copper terminal material according to claim 1 , wherein a surface metallic-zinc layer is provided on the tin layer.

6. The tin-plated copper terminal material according to claim 5 , wherein the surface metallic-zinc layer has zinc concentration of not less than 5 at % and not more than 40 at %.

7. The tin-plated copper terminal material according to claim 1 , comprising a ground layer between the substrate and the intermediate zinc layer, made of nickel or a nickel alloy, with a thickness of not less than 0.10 μm and not more than 5.00 μm and a nickel content percentage of not less than 80% by mass.

8. The tin-plated copper terminal material according to claim 1 , comprising a belt-sheet shape carrier part, and elements connected to the carrier part and disposed in an interval in a longitudinal direction of the belt-sheet shape carrier part.

9. A terminal formed from the tin-plated copper terminal material according to claim 1 .

10. An electric-wire terminal structure wherein the terminal according to claim 9 is crimped to an electric wire made of an aluminum wire or an aluminum alloy wire.

Assignees

• Mitsubishi Materials Corp

Inventors

• Kubota Kenji
• Tarutani Yoshie
• Nakaya Kiyotaka

Classifications

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title

• H01R4/185

  combined with a U-shaped insulation-receiving portion · CPC title

• C25D3/30

  of tin · CPC title

• C25D5/617

  Crystalline layers · CPC title