Electronic device with antenna

Patent metadata

Field	Value
Publication number	US-11264700-B2
Application number	US-201916723405-A
Country	US
Kind code	B2
Filing date	Dec 20, 2019
Priority date	Dec 20, 2018
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

An electronic device is provided that includes a housing; a printed circuit board including a first and second surfaces; an antenna module disposed on the first surface and adjacent to a side surface member, forming a first gap therewith, the antenna module being configured to radiate an antenna beam; a wireless communication circuit electrically connected with the antenna module, and configured to transmit or receive a signal having a frequency between 3 and 100 gigahertz; and a dielectric structure including a seating portion to have the antenna module mounted thereon, and configured to form the antenna beam to be radiated toward an outside of the housing.

First claim

What is claimed is:

1. An electronic device comprising:
a housing comprising a first plate facing in a first direction, a second plate facing in a second direction opposite to the first direction, and a side surface member surrounding at least part of a space between the first and second plates;
a printed circuit board comprising a first surface facing in the first direction and a second surface facing in the second direction, the printed circuit board being disposed in the housing;
a dielectric structure disposed on the first surface of the printed circuit board, the dielectric structure having a base and a vertical sidewall that define an inner space of the dielectric structure;
an antenna module disposed adjacent to the side surface member, forming a first gap therewith, on a seating portion defined by the inner space of the dielectric structure, the antenna module being configured to radiate an antenna beam in a third direction which is perpendicular to the first and second directions;
a wireless communication circuit electrically connected with the antenna module, and configured to transmit or receive a signal having a frequency between 3 gigahertz (GHz) and 100 GHz; and
the dielectric structure comprising the seating portion to have the antenna module mounted thereon, and configured to form the antenna beam to be radiated toward an outside of the housing in the third direction.

2. The electronic device of claim 1 , wherein the antenna module comprises at least one antenna array configured to support communication of a frequency band of 20 GHz or higher.

3. The electronic device of claim 1 , wherein the third direction faces toward the outside of the housing from the antenna module.

4. The electronic device of claim 1 , wherein the dielectric structure contacts the first surface of the printed circuit board, has a second gap formed with the side surface member, faces an inner surface of the side surface member, has a third gap formed with the antenna module, and faces an antenna array of the antenna module.

5. The electronic device of claim 4 , wherein the first gap is larger than the second gap.

6. The electronic device of claim 1 , wherein the dielectric structure comprises a support member of an injection molding material.

7. The electronic device of claim 6 , wherein the support member is disposed on the first surface of the printed circuit board to have the antenna module seated thereon.

8. The electronic device of claim 7 , wherein the support member comprises:
a base; and
at least one vertical sidewall extended along a circumference of the base to surround the circumference, and protruding from the circumference of the base in the first direction.

9. The electronic device of claim 8 , wherein the base comprises at least one first opening, and
wherein the vertical sidewall comprises at least one second opening.

10. The electronic device of claim 9 , wherein a soft circuit board is disposed in the second opening to electrically connect the antenna module to the printed circuit board.

11. The electronic device of claim 8 , wherein the support member further comprises a release prevention protrusion formed on the at least one vertical sidewall, and
wherein the release prevention protrusion protrudes in a fourth direction which is perpendicular to the first, second, and third directions.

12. The electronic device of claim 1 , further comprising at least one peripheral metal structure formed in the second direction of the printed circuit board.

13. The electronic device of claim 12 , wherein the peripheral metal structure comprises:
a subscriber identity module (SIM) card socket device disposed on the second surface of the printed circuit board and having at least a portion formed with a metallic material; and
an internal support structure having at least a portion formed with a metallic material and configured to support the printed circuit board.

14. The electronic device of claim 13 , wherein the SIM card socket device comprises:
a SIM card cover disposed to face in the third direction;
a SIM card tray connected to the SIM card cover, having a SIM card seated therein, and inserted into or drawn out from the third direction; and
a SIM card socket formed with a metallic material and configured to connect the seated SIM card to the printed circuit board.

15. The electronic device of claim 14 , wherein an internal cover is further included between the second plate and the SIM card socket, and the internal cover is connected with and disposed in parallel with the internal support structure.

16. An electronic device comprising:
a housing comprising a first plate facing in a first direction, a second plate facing in a second direction opposite to the first direction, and a side surface member surrounding at least part of a space between the first and second plates;
a printed circuit board comprising a first surface facing in the first direction and a second surface facing in the second direction, the printed circuit board being disposed in the housing;
an antenna module disposed on the first surface of the printed circuit board and adjacent to the side surface member, forming a first gap therewith, and the antenna module being configured to radiate an antenna beam in a third direction which is perpendicular to the first and second directions;
a wireless communication circuit electrically connected with the antenna module, and configured to transmit or receive a signal having a frequency between 3 gigahertz (GHz) and 100 GHz;
an injection support member comprising a seating portion to have the antenna module mounted thereon, and configured to form an antenna beam to be radiated toward an outside of the housing in the third direction;
a first peripheral metal structure configured to connect a seated subscriber identity module (SIM) card to the printed circuit board; and
a second peripheral metal structure disposed in parallel with and between the first peripheral metal structure and the second plate.

17. The electronic device of claim 16 , wherein the first peripheral metal structure comprises a SIM card socket of a metallic material.

18. The electronic device of claim 16 , wherein the second peripheral metal structure has at least a portion formed with a metallic material, and comprises an internal support structure configured to support the printed circuit board.

19. The electronic device of claim 16 , wherein the printed circuit board comprises a third peripheral metal structure.

20. The electronic device of claim 16 , wherein the injection support member is disposed to have a first gap with a front surface of the antenna module, and to have a second gap with an inner surface of the side surface member,
wherein the second gap is smaller than the first gap.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Jeon Seunggil
• Park Jongsam
• Hong Seongbeom
• Moon Sunghoon
• Lee Kyungwoo
• Choi Wonjoon

Classifications

• H01Q1/24

  with receiving set · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title

• H04M1/0277

  for a printed circuit board assembly · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q1/243

  with built-in antennas · CPC title