Bake system and method of fabricating display device using the same

Patent metadata

Field	Value
Publication number	US-11264571-B2
Application number	US-201916656462-A
Country	US
Kind code	B2
Filing date	Oct 17, 2019
Priority date	Nov 9, 2018
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

A bake system may include a chamber having an internal space, a stage disposed in the internal space of the chamber and on which a target substrate is disposed, a gas ejection structure providing a process gas in the chamber, an exhaust structure, an atmosphere analyzer monitoring moisture and oxygen in the chamber, and a gas supplier controlling a flow rate of the process gas based on information provided from the atmosphere analyzer. The exhaust structure may include a suction part disposed in the internal space, and an exhaust part connected to the suction part and is disposed outside the chamber.

First claim

What is claimed is:

1. A bake system, comprising:
a chamber having an internal space;
a stage disposed in the internal space of the chamber and on which a target substrate is disposed;
a gas ejection structure providing a process gas in the chamber;
an exhaust structure including a suction part disposed in the internal space, and an exhaust part connected to the suction part and is disposed outside the chamber;
an atmosphere analyzer monitoring moisture and oxygen in the chamber; and
a gas supplier controlling a flow rate of the process gas, based on information provided from the atmosphere analyzer.

2. The bake system of claim 1 , further comprising a guide part disposed between the suction part and the gas ejection structure,
wherein the guide part includes one or more openings, and
wherein the process gas is exhausted to the exhaust structure through the one or more openings of the guide part.

3. The bake system of claim 2 , further comprising a cooling part disposed in the guide part and configured to decrease the temperature of the internal space of the chamber.

4. The bake system of claim 1 , wherein the gas ejection structure comprises a first ejection structure and a second ejection structure that is spaced apart from the first ejection structure and configured to produce an airflow in a direction different from that produced by the first ejection structure.

5. The bake system of claim 4 , wherein the first ejection structure comprises a first transfer pipe connected to the gas supplier, a first distribution pipe connected to the first transfer pipe, and a first ejection pipe connected to the first distribution pipe, and
wherein the first ejection pipe comprises a first ejection hole configured to eject the process gas.

6. The bake system of claim 5 , wherein the first ejection pipe comprises a first ejection hole and a second ejection hole configured to eject the process gas in different directions.

7. The bake system of claim 4 , wherein the second ejection structure comprises a second transfer pipe connected to the gas supplier, a second distribution pipe connected to the second transfer pipe, and a second ejection pipe connected to the second distribution pipe, and
wherein the second ejection pipe comprises a second ejection hole configured to eject the process gas.

8. The bake system of claim 7 , wherein the gas ejection structure further comprises a dummy part disposed between the first ejection structure and the second ejection structure and extended along the second ejection pipe, and
wherein the process gas ejected through the second ejection pipe is deflected by the dummy part and is exhausted to the exhaust structure.

9. The bake system of claim 1 , wherein the stage further comprises a heating part providing heat to the target substrate.

10. The bake system of claim 1 , wherein the stage comprises a loading part configured to load the target substrate into the chamber, and a supporting part connected to the loading part, and
wherein a height of the loading part is controlled by the supporting part.

11. The bake system of claim 1 , wherein the exhaust structure further comprises an exhaust control part connected to the exhaust part and configured to control an exhaust amount of the process gas.

12. The bake system of claim 1 , wherein the target substrate comprises a base substrate, a transistor disposed on the base substrate, a first electrode connected to the transistor, a pixel definition layer including an opening exposing at least a portion of the first electrode, and a preliminary organic layer filling the opening.

13. The bake system of claim 1 , wherein the chamber further comprises at least one cooling part disposed on an inner wall of the chamber and configured to remove an organic solution in the chamber.

Assignees

• Samsung Display Co Ltd

Inventors

• Kishimoto Katsushi

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• B05D1/60 Primary

  Deposition of organic layers from vapour phase (vapour phase deposition in general C23C14/00, C23C16/00) · CPC title

• B05D3/0272

  with ovens · CPC title