LED transfer device and micro LED transferring method using the same

Patent metadata

Field	Value
Publication number	US-11264531-B2
Application number	US-201916688577-A
Country	US
Kind code	B2
Filing date	Nov 19, 2019
Priority date	Nov 20, 2018
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a plurality of LEDs arranged on a first substrate to a relay substrate; a memory configured to store characteristic information of each of the plurality of LEDs; and a processor configured to determine arrangement locations of each of the plurality of LEDs on the relay substrate based on the stored characteristic information, and control the transfer part to transfer the plurality of LEDs to the determined arrangement locations.

First claim

What is claimed is:

1. A light emitting diode (LED) transfer device comprising:
a transfer part configured to transfer a plurality of LEDs arranged on a first substrate to a relay substrate;
a memory configured to store characteristic information of each of the plurality of LEDs; and
a processor configured to:
determine arrangement locations of each of the plurality of LEDs on the relay substrate based on the stored characteristic information, and
control the transfer part to transfer the plurality of LEDs to the determined arrangement locations,

wherein the processor is further configured to:
divide the relay substrate into a plurality of second areas, and
determine the arrangement locations of each of the plurality of LEDs on the relay substrate such that output characteristics of the plurality of second areas are uniform, based on the stored characteristic information.

2. The LED transfer device of claim 1 , wherein the relay substrate has a size that is different from a size of the first substrate.

3. The LED transfer device of claim 1 , wherein the plurality of LEDs are arranged in a pattern on the relay substrate.

4. The LED transfer device of claim 1 , wherein the plurality of LEDs include a first LED emitting red light, a second LED emitting green light, and a third LED emitting blue light, and
wherein the first LED, the second LED, and the third LED are sequentially arranged on the relay substrate.

5. The LED transfer device of claim 1 , wherein the processor is further configured to:
divide the first substrate a plurality of first areas, and
arrange the plurality of LEDs in the plurality of first areas of the first substrate into one of the plurality of second areas of the relay substrate.

6. The LED transfer device of claim 5 , wherein the processor is further configured to control the transfer part so that the plurality of LEDs in the plurality of first areas of the first substrate are alternatively arranged in the one of the plurality of second areas of the relay substrate.

7. The LED transfer device of claim 1 , wherein the transfer part is configured to simultaneously collect the plurality of LEDs on the first substrate and arrange the collected plurality of LEDs on the relay substrate, and
wherein the processor is further configured to control the transfer part so that the plurality of LEDs spaced apart from one another on the first substrate are simultaneously collected.

8. The LED transfer device of claim 1 , wherein the transfer part comprises a mask device having openings formed in locations corresponding to the determined arrangement locations of the plurality of LEDs on the first substrate, and
wherein the processor is further configured to control a light source to irradiate laser light on the mask device and control the mask device to transfer the plurality of LEDs on the relay substrate.

9. The LED transfer device of claim 1 , wherein the characteristic information is at least one of output wavelengths, luminance, and performance levels of the plurality of LEDs.

10. The LED transfer device of claim 1 , wherein the relay substrate is provided on a stage and is moveable in a horizontal direction.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Sangmoo
• Kwag Doyoung
• Kim Eunhye
• Oh Minsub
• Lee Yoonsuk

Classifications

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W90/00

  Package configurations · CPC title

• H10P72/0446 Primary

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title