Direct write, high conductivity MMIC attach

Patent metadata

Field	Value
Publication number	US-11264299-B1
Application number	US-202017011382-A
Country	US
Kind code	B1
Filing date	Sep 3, 2020
Priority date	Sep 3, 2020
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.

First claim

What is claimed is:

1. An integrated circuit assembly comprising:
a substrate;
an integrated circuit formed on one side of the substrate;
a thermal spreading layer printed on an opposite side of the substrate from the integrated circuit, wherein the thermal spreading layer removes heat generated by the integrated circuit; and
a heat sink thermally attached to the thermal spreading layer opposite to the substrate, wherein the heat sink is part of a hermetically sealed housing for the integrated circuit.

2. The assembly according to claim 1 wherein the thermal spreading layer is printed directly on the substrate.

3. The assembly according to claim 1 wherein the thermal spreading layer is a silver composition.

4. The assembly according to claim 1 wherein the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the thermal spreading layer to the heat sink.

5. The assembly according to claim 1 wherein the substrate is a silicon carbide substrate.

6. The assembly according to claim 1 wherein the integrated circuit is a monolithic microwave integrated circuit (MMIC).

7. The assembly according to claim 1 wherein the thermal spreading layer is about 0.012″ thick.

8. The assembly according to claim 1 wherein the thermal spreading layer is printed onto the substrate using an aerosol printer or an inkjet printer.

9. An integrated circuit assembly comprising:
a substrate;
a monolithic microwave integrated circuit (MMIC) formed on one side of the substrate;
a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the MMIC, wherein the thermal spreading layer removes heat generated by the MMIC; and
a heat sink thermally attached to the thermal spreading layer opposite to the substrate, wherein the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the thermal spreading layer to the heat sink.

10. The assembly according to claim 9 wherein the heat sink is part of a hermetically sealed housing for the integrated circuit.

11. The assembly according to claim 9 wherein the thermal spreading layer is about 0.012″ thick.

12. The assembly according to claim 9 wherein the thermal spreading layer is printed onto the substrate using an aerosol printer or an inkjet printer.

13. A method for providing an integrated circuit assembly, said method comprising:
providing a substrate;
forming an integrated circuit formed on one side of the substrate;
printing a thermal spreading layer on an opposite side of the substrate from the integrated circuit, wherein the thermal spreading layer removes heat generated by the integrated circuit; and
thermally attaching a heat sink to the thermal spreading layer opposite to the substrate, wherein attaching the heat sink to the thermal spreading layer includes printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.

14. The method according to claim 13 wherein printing the thermal spreading layer includes directly printing the spreading layer on the substrate.

15. The method according to claim 13 wherein the thermal spreading layer is a silver composition.

16. The method according to claim 13 wherein printing the thermal spreading layer onto the substrate includes using an aerosol printer or an inkjet printer.

Assignees

• Northrop Grumman Systems Corp

Inventors

• Tice Jesse
• Mass Steven J
• Barako Michael T

Classifications

• H10P14/6346

  using printing, e.g. ink-jet printing · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title