Workpiece conveyance apparatus, semiconductor manufacturing apparatus, and workpiece conveyance method

Patent metadata

Field	Value
Publication number	US-11264259-B2
Application number	US-201615769728-A
Country	US
Kind code	B2
Filing date	Oct 25, 2016
Priority date	Oct 27, 2015
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

A workpiece conveyance apparatus having: a conveyance path on which the workpiece moves; a gas flotation section that gas-floats the workpiece over the conveyance path; a movable holding section that holds the workpiece to move on the conveyance path along with the workpiece; and a treatment region conveyance path that is located on the conveyance path, and has a treatment region where predetermined treatment for the workpiece is performed, wherein the movable holding section has at least two or more holding sections along a movement direction of the conveyance path, each of the holding sections is capable of switching between release of holding and holding for the workpiece during movement of the workpiece, operation for releasing holding of the workpiece by the holding section on the treatment region conveyance path, and holding the workpiece on the conveyance path other than the treatment region conveyance path.

First claim

The invention claimed is:

1. A workpiece conveyance apparatus for conveying a workpiece, the workpiece conveyance apparatus comprising:
a conveyance path;
a gas flotation section that gas-floats the workpiece over the conveyance path;
a movable holding section that holds the workpiece floated by the gas flotation section to move on the conveyance path along with the workpiece;
a treatment region conveyance path that is located on the conveyance path, and includes a treatment region where predetermined treatment for the workpiece is performed; and
a controller,
wherein:
the movable holding section comprises at least two holding sections along a movement direction of the conveyance path,
each of the holding sections is capable of switching between release of holding and holding the workpiece during movement of the workpiece,
each of the holding sections is capable of changing a holding force by which the holding section holds the workpiece, and
the controller individually controls the holding sections to hold the workpiece by a usual holding force, thereafter to reduce the holding force thereof from the usual holding force while continuing to hold the workpiece before reaching the treatment region conveyance path, then to release holding of the workpiece on passing the treatment region conveyance path, then to restart holding of the workpiece at a reduced holding force with respect to the usual holding force after passing the treatment region conveyance path, thereafter to increase the holding force from the reduced holding force to the usual holding force, and thereafter to hold the workpiece by the usual holding force.

2. The workpiece conveyance apparatus according to claim 1 , wherein the controller acquires positional information on the conveyance path of the movable holding section, causes the holding sections to perform operation for releasing holding of the workpiece in the treatment region conveyance path based on the positional information, and controls operation for performing the holding in a region of the conveyance path outside of the treatment region conveyance path.

3. The workpiece conveyance apparatus according to claim 1 , wherein the at least two holding sections along the movement direction of the conveyance path are located on a same axis along the movement direction.

4. The workpiece conveyance apparatus according to claim 1 , further comprising another gas flotation section, wherein one of the gas flotation sections in the treatment region conveyance path is different from another one of the gas flotation sections in a region of the conveyance path outside of the treatment region conveyance path.

5. The workpiece conveyance apparatus according to claim 1 , wherein the holding sections are in a non-contact state with the workpiece when the holding is released.

6. The workpiece conveyance apparatus according to claim 1 , wherein each of the holding sections comprises a support section to hold a lower surface side of the workpiece, and an elevating and lowering mechanism operable to elevate the support section to hold the workpiece and to lower the support section to release the workpiece.

7. The workpiece conveyance apparatus according to claim 1 , wherein each of the holding sections comprises an upper holding section to hold the workpiece on an upper surface side of the workpiece, and an elevating and lowering mechanism operable to elevate the upper holding section to release the workpiece and to lower the upper holding section to hold the workpiece.

8. The workpiece conveyance apparatus according to claim 1 , wherein each of the holding sections has an electrostatic holding section or a suction holding section.

9. The workpiece conveyance apparatus according to claim 1 , wherein each of the holding sections changes size of a holding surface thereof having holding force to change the holding force.

10. The workpiece conveyance apparatus according to claim 1 , wherein the predetermined treatment is laser annealing.

11. The workpiece conveyance apparatus according to claim 1 , further comprising:
a position detection section that acquires a position of the workpiece on the treatment region conveyance path;
a height position adjustment section that adjusts a height position of the workpiece; and
a position controller that controls the height position adjustment section,
wherein the position controller receives a detection result of the position detection section, and causes the height position adjustment section to adjust the position of the workpiece on the treatment region conveyance path based on the detection result.

12. A semiconductor manufacturing apparatus comprising the workpiece conveyance apparatus according to claim 1 , wherein the workpiece is a semiconductor.

13. A workpiece conveyance method for conveying a workpiece on a conveyance path that includes a treatment region conveyance path where predetermined treatment for the workpiece is performed, the workpiece conveyance method comprising:
gas-floating the workpiece; and
holding the floating workpiece by a movable holding section that moves on the conveyance path along with the workpiece, the movable holding section comprising a plurality of holding sections arranged along a movement direction of the workpiece, each of the holding sections being capable of switching between release of holding and holding the workpiece during movement of the workpiece, and each of the holding sections being capable of changing a holding force by which the holding section holds the workpiece; and
individually controlling the holding sections to hold the workpiece by a usual holding force, thereafter to reduce the holding force thereof from the usual holding force while continuing to hold the workpiece before reaching the treatment region conveyance path, to then release holding of the workpiece on passing the treatment region conveyance path, then to restart holding of the workpiece at a reduced holding force with respect to the usual holding force after passing the treatment region conveyance path, thereafter to increase the holding force from the reduced holding force to the usual holding force, and thereafter to hold the workpiece by the usual holding force.

14. The workpiece conveyance method according to claim 13 , wherein when the holding by any of the holding sections is released, the holding section is brought into a non-contact state with the workpiece.

15. The workpiece conveyance apparatus according to claim 1 , wherein each of the holding sections comprises a plurality of individually controllable suction sections.

Assignees

• Japan Steel Works Ltd

Inventors

• Shimizu Ryo
• Sawai Miki
• Sazuka Hirotaka
• Ito Daisuke

Classifications

• H10P72/72

  using electrostatic chucks · CPC title

• H10P14/3808

  using laser beams · CPC title

• H10P14/3454

  Amorphous · CPC title

• H10P14/3411

  Silicon, silicon germanium or germanium · CPC title

• H10P72/3314

  Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers · CPC title