Selective powder dosing for an additively manufacturing system

US11260649B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11260649-B2
Application numberUS-201916533974-A
CountryUS
Kind codeB2
Filing dateAug 7, 2019
Priority dateNov 16, 2016
Publication dateMar 1, 2022
Grant dateMar 1, 2022

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An additive manufacturing system can include a powder dispenser; a gate adjacent to the powder dispenser; a recoater blade system; and a control operable to move the gate with respect to the powder dispenser to selectively dispense powder from the powder dispenser.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of additive manufacturing comprising: moving a gate with respect to a powder dispenser to selectively dispense powder from the powder dispenser through the gate, the gate movable relative to movement of a recoater blade, wherein movement of the recoater blade spreads dispensed powder, wherein moving the gate includes selecting one of a multiple of apertures, at least one of the multiple of apertures different than at least one of the other apertures; and applying a laser to the dispensed powder. 2. The method as recited in claim 1 , wherein moving the gate includes sliding a control strip. 3. The method as recited in claim 1 , wherein moving the gate includes rotating a control strip formed as a continuous loop. 4. The method as recited in claim 1 , further comprising adjusting a position of the gate to change the amount of the powder dispensed onto the powder bed. 5. The method as recited in claim 1 , further comprising adjusting a position of the gate to change a depth of the powder dispensed onto the powder bed. 6. The method as recited in claim 1 , further comprising adjusting a position of the gate to change a location of the powder dispensed onto the powder bed. 7. The method as recited in claim 1 , further comprising adjusting a position of the gate to change the powder dispensed as a prior layer on the powder bed. 8. A method of additive manufacturing comprising: moving a gate to selectively dispense one of a multiple of powders from a multi-powder dispenser, the gate movable with respect to a movement direction of a recoater blade, wherein movement of the recoater blade spreads dispensed powder, wherein moving the gate includes selecting one of a multiple of apertures, at least one of the multiple of apertures different than at least one of the other apertures; and applying a laser to the dispensed powder. 9. The method as recited in claim 8 , wherein moving the gate includes sliding a control strip. 10. The method as recited in claim 8 , wherein moving the gate includes rotating a control strip formed in a continuous loop.

Assignees

Inventors

Classifications

  • of powder bed aspects, e.g. density · CPC title

  • Metering means · CPC title

  • Blades · CPC title

  • Hoppers · CPC title

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

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Frequently asked questions

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What does patent US11260649B2 cover?
An additive manufacturing system can include a powder dispenser; a gate adjacent to the powder dispenser; a recoater blade system; and a control operable to move the gate with respect to the powder dispenser to selectively dispense powder from the powder dispenser.
Who is the assignee on this patent?
United Technologies Corp, Raytheon Tech Corp
What technology area does this patent fall under?
Primary CPC classification B33Y30/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).