Method of polishing a new or a refurbished electrostatic chuck

Patent metadata

Field	Value
Publication number	US-11260498-B2
Application number	US-201414341419-A
Country	US
Kind code	B2
Filing date	Jul 25, 2014
Priority date	Aug 10, 2013
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

Embodiments of the present invention provide a polishing ring assembly suitable for polishing an electrostatic chuck and method of using the same. In one embodiment, the polishing ring assembly has a retaining ring assembly and an electrostatic chuck fixture. The retaining ring assembly includes an inner diameter and a top surface, a plurality of outer drive rings wherein the plurality of outer drive rings are placed on the top surface of the ceramic retaining ring. The electrostatic chuck fixture includes an electrostatic chuck drive plate adjacent to the inner diameter of in the ceramic retaining ring. The electrostatic chuck drive plate has a lock to secure retaining ring assembly with the electrostatic chuck fixture without transferring the weight from one assembly over to the other through the locking mechanism.

First claim

What is claimed is:

1. A method for planarizing an electrostatic chuck, comprising:
placing a top surface of an electrostatic chuck against a polishing pad, the electrostatic chuck circumscribed by a retaining ring which is also disposed against the polishing pad, the electrostatic chuck having an electrostatic chuck drive plate stacked thereon;
disposing a first external weight on the electrostatic chuck drive plate;
disposing a second external weight on the retaining ring;
locking the electrostatic chuck drive plate to the electrostatic chuck and to the second external weight;
rotating the polishing pad while in contact with the electrostatic chuck and the retaining ring; and
applying an abrasive slurry to the polishing pad while the electrostatic chuck is in contact with the retaining ring.

2. The method of claim 1 , wherein applying the abrasive slurry comprises:
mixing between 1.3 grams to 1.6 grams of diamond powder with 425 ml to 450 ml of deionized water.

3. The method of claim 1 , wherein the electrostatic chuck and the retaining ring apply substantially equal force per unit area against the polishing pad.

4. The method of claim 1 , wherein an amount of weight of the first external weight is less than an amount of weight of the second external weight.

5. The method of claim 1 comprising:
removing mesas and a sealing band from the top surface of the electrostatic chuck.

6. The method of claim 5 , wherein applying the abrasive slurry comprises:
applying a slurry comprising a 30 μm diamond powder to the polishing pad.

7. The method of claim 5 , wherein the polishing pad comprises a 30 μm diamond grit.

8. The method of claim 1 comprising:
polishing the top surface of the electrostatic chuck.

9. The method of claim 8 , wherein the polishing pad comprises a 0.5 μm slurry pad.

10. The method of claim 8 , wherein applying the abrasive slurry comprises:
applying a first slurry comprising 3.0 μm diamond to the polishing pad;
rinsing the top surface of the electrostatic chuck and the diamond to the polishing pad; and
applying a second slurry comprising 0.5 μm diamond to the polishing pad.

11. The method of claim 10 , wherein polishing the top surface of the electrostatic chuck comprises:
polishing the top surface of the electrostatic chuck to a surface roughness of 3 μin.

Assignees

• Applied Materials Inc

Inventors

• Lu William Ming-Ye
• Boyd Jr Wendell Glen
• Meyer Stacy

Classifications

• H10P72/72

  using electrostatic chucks · CPC title

• B24B37/044 Primary

  characterised by the composition of the lapping agent · CPC title

• B24B37/32

  Retaining rings · CPC title

• H01L21/6831

  Electricity · mapped topic