Electrical circuit board with low thermal conductivity and method of constructing thereof

Patent metadata

Field	Value
Publication number	US-11259398-B2
Application number	US-201816499555-A
Country	US
Kind code	B2
Filing date	Mar 30, 2018
Priority date	Mar 31, 2017
Publication date	Feb 22, 2022
Grant date	Feb 22, 2022

Abstract

An electrical circuit board includes a first conductive layer and a second conductive layer. And an interlayer forming a thermal barrier is placed between the first conductive layer and the second conductive layer, wherein the thermal barrier reduces heat transfer between the first conductive layer and the second conductive layer.

First claim

The invention claimed is:

1. An electrical circuit board, comprising:
a first conductive layer and a second conductive layer;
an interlayer as a thermal barrier, placed between the first conductive layer and the second conductive layer, wherein the thermal barrier reduces heat transfer between the first conductive layer and the second conductive layer, wherein the interlayer is a first heat insulating layer;
a second heat insulating layer;
a first bonding layer bonding the second heat insulating layer with the first heat insulating layer;
a second bonding layer bonding the first heat insulating layer with the second conductive layer; and
a third bonding layer bonding the first heat insulating layer with the first conductive layer; wherein
the first conductive layer is an Insulectro™ type H1 copper foil;
the first bonding layer includes five sheets of Insulectro™ 106NF prepreg;
the first heat insulating layer includes one sheet of 1-5 oz./yd 2 Nomex® woven fabric, tight weave;
the second bonding layer includes eight sheets of Insulectro™ 106NF prepreg;
the second heat insulating layer includes one sheet of 1-5 oz./yd 2 Nomex® woven fabric, tight weave;
the third bonding layer includes five sheets of Insulectro™ 106NF prepreg; and
the second conductive layer is an Insulectro™ type H1 copper foil.

2. The electrical circuit board of claim 1 , wherein the thermal barrier includes a plurality of air bubbles within the interlayer.

3. The electrical circuit board of claim 1 , wherein at least one of the first and second heat insulating layer is made of heat resistant material.

4. The electrical circuit board of claim 3 , wherein the heat resistant material is Nomex® woven fabric, tight weave.

5. The electrical circuit board of claim 4 , wherein the heat resistant material is one sheet of 1-5 oz./yd 2 Nomex® woven fabric, tight weave.

6. The electrical circuit board of claim 1 , further comprising at least one bonding layer for securely attaching the first heat insulating layer to at least one of the first and second conductive layers.

7. The electrical circuit board of claim 6 , further comprising a plurality of air bubbles within the at least one bonding layer.

8. The electrical circuit board of claim 6 , wherein the at least one bonding layer is made from a plurality of sheets of bonding materials.

9. The electrical circuit board of claim 6 , wherein the at least one bonding layer is made from a plurality of sheets of prepreg.

10. The electrical circuit board of claim 6 , wherein the at least one bonding layer is made from a plurality of sheets of Insulectro™ 106NF prepreg.

11. The electrical circuit board of claim 1 , wherein the first and second conductive layers are copper foils.

12. The electrical circuit board of claim 1 , wherein:
the first conductive layer is an Insulectro™ type H1 copper foil;
the first bonding layer includes three sheets of Insulectro™ 106NF prepreg;
the first heat insulating layer includes one sheet of 1-5 oz./yd 2 Nomex® woven fabric, tight weave;
the second bonding layer includes 12 sheets of Insulectro™ 106NF prepreg;
the second heat insulating layer includes one sheet of 1-5 oz./yd 2 Nomex® woven fabric, tight weave;
the third bonding layer includes three sheets of Insulectro™ 106NF prepreg; and
the second conductive layer is an Insulectro™ type H1 copper foil.

13. The electrical circuit board of claim 1 , further comprising a plurality of air bubbles within one or more of the first bonding layer, the first heat insulating layer, the second bonding layer, the second heat insulating layer, and the third bonding layer.

14. The electrical circuit board of claim 13 , wherein the electrical circuit board is used in a cooling or heating circuit for a vehicle seat.

15. The electrical circuit board of claim 13 , further comprising a flexible printed circuit securely attached to a side of the electrical circuit board.

16. The electrical circuit board of claim 15 , wherein the electrical circuit board locally rigidizes the flexible printed circuit in an area and thermally isolates each side of the electrical circuit board.

17. The electrical circuit board of claim 15 , wherein the conductive traces of the flexible printed circuit forms a conductive layer of the electrical circuit board.

Assignees

• Magna Seating Inc
• Kozlowski Eric
• Davis Jason
• Peters Jr Larry

Inventors

• Kozlowski Eric
• Davis Jason
• Peters Jr Larry

Classifications

• H05K2201/0355

  Metal foils · CPC title

• H05K1/038

  Textiles (used as reinforcing materials for organic insulating substrates H05K1/0366) · CPC title

• H05K1/0201 Primary

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K2201/062

  Means for thermal insulation, e.g. for protection of parts · CPC title

• H05K2201/029

  Woven fibrous reinforcement or textile · CPC title