Sensor/transmitter plug-and-play for process instrumentation

Patent metadata

Field	Value
Publication number	US-11255735-B2
Application number	US-201615290757-A
Country	US
Kind code	B2
Filing date	Oct 11, 2016
Priority date	Oct 22, 2008
Publication date	Feb 22, 2022
Grant date	Feb 22, 2022

Abstract

A sensor assembly with a sensing element sends a sensor signal from the sensing element to attached process transmitter over sensor connection wires. The sensor assembly has memory circuitry for storing information related to the sensor assembly and interface circuitry that provides for digital communication of the stored information with the attached process transmitter. This digital communication is sent over the sensor connection wires.

First claim

The invention claimed is:

1. A process instrument comprising:
a sensor assembly including:
sensor wires;
a sensor element conductively connected to the sensor wires so as to transmit, without amplification or signal processing, an analog sensor signal indicative of a process parameter sensed by the sensor element;
memory circuitry having configuration data related to the sensor assembly; and
interface circuitry electrically connected to the memory circuitry and reactively coupled to the sensor wires so as to transmit, over the sensor wires, a digital communication signal indicative of the configuration data; and

a process transmitter including:
sensor measurement circuitry conductively connected to the sensor wires so as to receive, over the sensor wires, the analog sensor signal, the sensor measurement circuitry configured to convert the received analog sensor signal to a digital sensor signal;
sensor communication circuitry reactively coupled to the sensor wires so as to receive, via the sensor wires, the digital communication signal indicative of the configuration data;
a microprocessor electrically connected to the sensor measurement circuitry so as to receive the digital sensor signal and electrically connected to the sensor communication circuitry so as to receive the digital communication signal indicative of the configuration data, the microprocessor configured to calculate, based on the received digital sensor signal and the configuration data, a calibrated measurement value indicative of the process parameter; and
communication circuitry electrically connected to the microprocessor and configured to transmit an output signal representative of the calibrated measurement value.

2. The process instrument of claim 1 , wherein the interface circuitry of the sensor assembly is inductively coupled to the sensor wires.

3. The process instrument of claim 1 , wherein the interface circuitry of the sensor assembly is capacitively coupled to the sensor wires.

4. The process instrument of claim 1 , wherein the interface circuitry of the sensor assembly comprises:
a modulator conductively connected to the memory circuitry and reactively coupled to the sensor wires and configured to receive, from the memory circuitry, the configuration data related to the sensor assembly and to transmit, over the sensor wires, the digital communication indicative of the configuration data.

5. The process instrument of claim 1 , wherein the digital communication signal is a first digital communication signal, the interface circuitry of the sensor assembly further comprising:
a demodulator conductively connected to the memory circuitry and reactively coupled to the sensor wires so as to receive, over the sensor wires, a second digital communication signal containing instructions.

6. The process instrument of claim 1 , wherein the microprocessor of the process transmitter is a first microprocessor, the memory circuitry of the sensor assembly further comprising:
nonvolatile memory;
a second microprocessor in electrical communication with both the nonvolatile memory and the interface circuitry, the second microprocessor configured to execute the instructions contained in the second digital communication signal, and to store and/or retrieve, in response to the received instructions, information to and/or from the nonvolatile memory, respectively.

7. The process instrument of claim 1 , wherein the interface circuitry of the sensor assembly comprises:
a rectifier/power buffer that provides, using the digital communication, power to the interface circuitry and/or memory circuitry.

8. The process instrument of claim 1 , wherein the memory circuitry and the interface circuitry of the sensor assembly comprise a radio-frequency identification (RFID) chip.

9. The process instrument of claim 1 , wherein the sensor element of the sensor assembly comprises a temperature sensing element.

10. The process instrument of claim 1 , wherein the sensor element of the sensor assembly comprises a thermocouple.

11. The process instrument of claim 1 , wherein the sensor element of the sensor assembly comprises a Resistive Temperature Device (RTD).

12. The process instrument of claim 1 , wherein the sensor assembly further comprises:
a bypass capacitor electrically connected across the sensor element.

13. The process instrument of claim 1 , wherein the interface circuitry of the sensor assembly is reactively coupled to the sensor wires via a transformer having a first winding formed by the sensor wires.

14. The process instrument of claim 13 , wherein the first winding formed by the sensor wires is in series with the sensor element.

15. The process instrument of claim 13 , wherein the first winding formed by the sensor wires is in parallel with the sensor element.

16. A sensor assembly for use with a process transmitter, the sensor assembly comprising:
sensor wires;
a sensor element directly and conductively connected to the sensor wires so as to transmit, over the sensor wires and without amplification and without signal processing, an analog sensor signal indicative of a process parameter sensed by the sensor element;
memory circuitry having configuration data related to the sensor assembly; and
interface circuitry electrically connected to the memory circuitry and reactively coupled to the sensor wires so as to transmit, over the sensor wires, a digital communication signal indicative of the configuration data.

17. The sensor assembly of claim 16 , wherein the interface circuitry is inductively coupled to the sensor wires.

18. The sensor assembly of claim 16 , wherein the interface circuitry is capacitively coupled to the sensor wires.

19. The sensor assembly of claim 16 , wherein the interface circuitry comprises:
a modulator conductively connected to the memory circuitry and reactively coupled to the sensor wires and configured to receive, from the memory circuitry, the configuration data related to the sensor assembly and to transmit, over the sensor wires, the digital communication indicative of the configuration data.

20. The sensor assembly of claim 16 , wherein the digital communication signal is a first digital communication signal, the interface circuitry further comprising:
a demodulator conductively connected to the memory circuitry and reactively coupled to the sensor wires so as to receive, over the sensor wires, a second digital communication signal containing instructions.

21. The sensor assembly of claim 16 , further comprising:
nonvolatile memory;
a microprocessor in electrical communication with both the nonvolatile memory and the interface circuitry, the microprocessor configured to execute the instructions contained in the second digital communication signal, and to store and/or retrieve, in response to the received instructions, information to and/or from the nonvolatile memory, respectively.

22. The sensor assembly of claim 16 , wherein the interface circuitry comprises:
a rectifier/power buffer that provides, using the digital communication signal, power to the interface circuitry and/or memory circuitry.

23. The sensor assembly of claim 16 , wherein the memory circuitry and the interface circuitry comprise a radio-frequency identification (RFID) chip.

24. The sensor assembly of claim 16 , wherein the sensor element comprises a temperature sensing element.

25. The sensor assembly of claim 16 , wherein the

Assignees

• Rosemount Inc

Inventors

• Engelstad Loren Michael
• Arnston Douglas Wayne
• Rud Jason Harold
• Holmstadt Clarence Edward
• Paschke Randy Kenneth
• Asmolov Sergey Viktorovich
• Kuznetsov Yury Mickolaevich

Classifications

• G01D3/022 Primary

  having an ideal characteristic, map or correction data stored in a digital memory · CPC title

• G01K1/024

  for remote indication · CPC title

• G01K7/021

  Particular circuit arrangements (G01K7/026, G01K7/12, G01K7/14 take precedence) · CPC title

• G01K1/022

  for recording · CPC title

• G01K19/00 Primary

  Testing or calibrating calorimeters · CPC title