Vibration detecting arrangement for reducing resonant noise

US11255717B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11255717-B2
Application numberUS-201916563662-A
CountryUS
Kind codeB2
Filing dateSep 6, 2019
Priority dateMay 31, 2019
Publication dateFeb 22, 2022
Grant dateFeb 22, 2022

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

According to one embodiment, a vibration detecting device includes a housing, a vibration sensor in the housing, a circuit board in the housing, a flexible wiring component, a first face, and a second face. The vibration sensor is housed in the housing. An electric component that processes a detection signal of the vibration sensor is provided on the circuit board. The wiring component electrically connects the vibration sensor and the circuit board. The first face is provided on the housing and is configured to be attached to an object. The second face is provided inside the housing and is inclined with respect to the first face, the vibration sensor being attached thereto.

First claim

Opening claim text (preview).

What is claimed is: 1. A vibration detecting device comprising: a housing; a vibration sensor in the housing; a circuit board in the housing, the circuit board on which an electric component that processes a detection signal of the vibration sensor is provided; a flexible wiring component that electrically connects the vibration sensor and the circuit board; a first face provided on the housing, the first face configured to be attached to an object; and a second face provided inside the housing and inclined with respect to the first face, the second face to which the vibration sensor is attached, wherein the circuit board has a third face on which the electric component is mounted, the third face inclined with respect to the first face, and an angle between the first face and the second face is different from an angle between the first face and the third face. 2. The vibration detecting device according to claim 1 , wherein the vibration sensor includes a shock sensor. 3. The vibration detecting device according to claim 1 , wherein the second face is inclined with respect to the first face around a first axis, and the third face is inclined with respect to the first face around a second axis that is in parallel with the first axis. 4. The vibration detecting device according to claim 3 , wherein the second face is inclined an acute first angle with respect to the first face in an inclination direction around the first axis, and the third face is inclined an acute second angle with respect to the first face in the inclination direction around the second axis. 5. The vibration detecting device according to claim 4 , wherein the first angle is smaller than the second angle. 6. The vibration detecting device according to claim 1 , wherein an acute angle between the first face and the second face is smaller than 45°. 7. The vibration detecting device according to claim 1 , wherein the wiring component has a first end portion connected to the circuit board, and a second end portion connected to the vibration sensor and is bent at one position between the first end portion and the second end portion. 8. The vibration detecting device according to claim 1 , wherein the housing includes a first component that houses the vibration sensor and the circuit board, and a second component that is attached to the first component and that has the second face. 9. A vibration detecting device comprising: a housing; a first face provided on the housing, the first face configured to be attached to an object; a second face provided inside the housing; a vibration sensor in the housing, the vibration sensor including a bottom face inclined with respect to the first face and attached to the second face; a circuit board in the housing, the circuit board on which an electric component that processes a detection signal of the vibration sensor is provided; and a flexible wiring component that electrically connects the vibration sensor and the circuit board, wherein the circuit board has a third face on which the electric component is mounted, the third face inclined with respect to the first face, and an angle between the first face and the bottom face is different from an angle between the first face and the third face. 10. The vibration detecting device according to claim 9 , wherein the vibration sensor includes a shock sensor. 11. The vibration detecting device according to claim 9 , wherein the bottom face is inclined with respect to the first face around a first axis, and the third face is inclined with respect to the first face around a second axis that is in parallel with the first axis. 12. The vibration detecting device according to claim 11 , wherein the bottom face is inclined an acute first angle with respect to the first face in an inclination direction around the first axis, and the third face is inclined an acute second angle with respect to the first face in the inclination direction around the second axis. 13. The vibration detecting device according to claim 12 , wherein the first angle is smaller than the second angle. 14. The vibration detecting device according to claim 9 , wherein an acute angle between the first face and the bottom face is smaller than 45°. 15. The vibration detecting device according to claim 9 , wherein the wiring component has a first end portion connected to the circuit board, and a second end portion connected to the vibration sensor and is bent at one position between the first end portion and the second end portion. 16. The vibration detecting device according to claim 9 , wherein the housing includes a first component that houses the vibration sensor and the circuit board, and a second component that is attached to the first component and that has the second face. 17. A vibration detecting device comprising: a housing; a vibration sensor in the housing; a circuit board in the housing, the circuit board on which an electric component that processes a detection signal of the vibration sensor is provided; a flexible wiring component that electrically connects the vibration sensor and the circuit board; a first face provided on the housing, the first face configured to be attached to an object; and a second face provided inside the housing and inclined with respect to the first face, the second face to which the vibration sensor is attached, wherein the housing includes: a first component that houses the vibration sensor and the circuit board; and a second component that is attached to the first component and that has the second face and a third face, and the third face is attached to the first component and is inclined with respect to the second face.

Assignees

Inventors

Classifications

  • G01H1/12Primary

    of longitudinal or not specified vibrations · CPC title

  • G01H17/00Primary

    Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the other groups of this subclass · CPC title

  • by magnetic means, e.g. reluctance · CPC title

  • by electric means · CPC title

  • Measuring {characteristics of} vibrations in solids by using direct conduction to the detector (G01H9/00, G01H11/00 take precedence) · CPC title

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What does patent US11255717B2 cover?
According to one embodiment, a vibration detecting device includes a housing, a vibration sensor in the housing, a circuit board in the housing, a flexible wiring component, a first face, and a second face. The vibration sensor is housed in the housing. An electric component that processes a detection signal of the vibration sensor is provided on the circuit board. The wiring component electric…
Who is the assignee on this patent?
Toshiba Kk, Toshiba Electronic Devices & Storage Corp
What technology area does this patent fall under?
Primary CPC classification G01H1/12. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).