Machining system and machining method

US11254106B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11254106-B2
Application numberUS-201916528844-A
CountryUS
Kind codeB2
Filing dateAug 1, 2019
Priority dateSep 20, 2018
Publication dateFeb 22, 2022
Grant dateFeb 22, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A machining system includes an application device that applies a photocurable resin to surfaces of a plurality of linear objects provided in a workpiece; a curing device that brings the linear objects, to which the photocurable resin has been applied by the application device, into close contact with each other in radial directions and that radiates light onto the photocurable resin, which has been applied to the linear objects brought into close contact, thus curing the photocurable resin; and a machining device that machines the workpiece, in which the plurality of linear objects have been bound together through the curing of the photocurable resin performed by the curing device.

First claim

Opening claim text (preview).

The invention claimed is: 1. A machining system comprising: an application device that applies a photocurable resin to surfaces of a plurality of linear objects provided in a workpiece; a curing device that brings the linear objects, to which the photocurable resin has been applied by the application device, into close contact with each other in radial directions and that radiates light onto the photocurable resin, which has been applied to the linear objects brought into close contact, thus curing the photocurable resin; a machining device that machines the workpiece in which the plurality of linear objects have been bound together through the curing of the photocurable resin performed by the curing device; and a removal device that radiates light onto the cured photocurable resin and removes the cured photocurable resin after completion of the machining of the workpiece performed by the machining device; wherein the curing device and the removal device are provided with a common light source that produces ultraviolet light. 2. The machining system according to claim 1 , wherein the curing device radiates the ultraviolet light, which is produced by the common light source, onto the photocurable resin at a position where the ultraviolet light is diffused; and the removal device radiates the ultraviolet light, which is produced by the common light source, onto the photocurable resin at a position where the ultraviolet light is focused. 3. The machining system according to claim 1 , further comprising a robot in which a hand that holds the workpiece is mounted at a distal end thereof, wherein the robot moves the workpiece held by the hand, among the application device, the curing device, and the machining device.

Assignees

Inventors

Classifications

  • the wires being disposed by machine · CPC title

  • H01B13/003Primary

    using irradiation · CPC title

  • Harness tying apparatus · CPC title

  • B05C9/14Primary

    the auxiliary operation involving heating {or cooling} · CPC title

  • for welding together plastic insulated wires side-by-side · CPC title

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Frequently asked questions

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What does patent US11254106B2 cover?
A machining system includes an application device that applies a photocurable resin to surfaces of a plurality of linear objects provided in a workpiece; a curing device that brings the linear objects, to which the photocurable resin has been applied by the application device, into close contact with each other in radial directions and that radiates light onto the photocurable resin, which has …
Who is the assignee on this patent?
Fanuc Corp
What technology area does this patent fall under?
Primary CPC classification H01B13/003. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).