Method for manufacturing a sensor of a thermal, flow measuring device for measuring mass flow of a medium in a measuring tube

US11248941B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11248941-B2
Application numberUS-201716315735-A
CountryUS
Kind codeB2
Filing dateJun 26, 2017
Priority dateJul 7, 2016
Publication dateFeb 15, 2022
Grant dateFeb 15, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to a method for manufacturing a sensor for a thermal, flow measuring device. The method includes, in such case, manufacturing a metal jacketing for a sensor core, introducing the sensor core into the metal jacketing and sintering the metal jacketing with introduced sensor core.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing a sensor of a thermal, flow measuring device for measuring mass flow of a medium in a measuring tube, the method comprising: manufacturing a metal jacketing using a metal powder injection molding method, wherein the jacketing has a first blind hole, an open first end, and a closed second end; introducing a sensor core into the first blind hole of the jacketing through the open first end, wherein the jacketing completely encloses the sensor core; and sintering the jacketing such that, after sintering, a releasing of the sensor core from the jacketing requires a tensile force of at least 1 Newton, wherein the sensor core includes: a ceramic core having a lateral surface; a metal wire wound around the lateral surface of the ceramic core; and an electrically insulating layer adapted to insulate the metal wire electrically from the jacketing. 2. The method as claimed in claim 1 , wherein the jacketing shrinks during the sintering, wherein a cross section of the first blind hole before sintering of the jacketing is greater than a cross section of the sensor core, wherein after sintering of the jacketing the cross section of the first blind hole equals the cross section of the sensor core, and wherein the jacketing after sintering of completely encloses the sensor core and establishes a thermal contact with the sensor core. 3. The method as claimed in claim 1 , wherein the metal powder injection molding method uses a metal powder having a grain size less than 6 micrometers. 4. The method as claimed in claim 2 , wherein the volume of the jacketing decreases by less than 40% from the sintering after insertion of the sensor core. 5. The method as claimed in claim 1 , wherein the ceramic core has a hollow-cylindrical structure having an open third end and an open fourth end, wherein the metal wire is led through the fourth end to the third end, and wherein the third end of the ceramic core faces toward the open first end of the jacketing and the fourth end of the ceramic core faces toward the closed second end of the jacketing. 6. The method as claimed in claim 1 , wherein the ceramic core has a hollow-cylindrical structure having an open third end and a fifth end, wherein the ceramic core has in the region of the fifth end a radial bore, wherein the metal wire is led through the radial bore to the third end, and wherein the third end of the ceramic core faces toward the open first end of the jacketing and the fifth end of the ceramic core faces toward the closed second end of the jacketing.

Assignees

Inventors

Classifications

  • with one or more parts not made from powder {(B22F7/062 takes precedence)} · CPC title

  • G01F1/684Primary

    Structural arrangements; Mounting of elements, e.g. in relation to fluid flow · CPC title

  • Processes characterised by the sequence of their steps · CPC title

  • Casings, e.g. of special material · CPC title

  • Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids · CPC title

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Frequently asked questions

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What does patent US11248941B2 cover?
The present disclosure relates to a method for manufacturing a sensor for a thermal, flow measuring device. The method includes, in such case, manufacturing a metal jacketing for a sensor core, introducing the sensor core into the metal jacketing and sintering the metal jacketing with introduced sensor core.
Who is the assignee on this patent?
Flowtec Ag
What technology area does this patent fall under?
Primary CPC classification G01F1/684. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 15 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).