Energy recovery system for a semiconductor fabrication facility

Patent metadata

Field	Value
Publication number	US-11248822-B2
Application number	US-201916522270-A
Country	US
Kind code	B2
Filing date	Jul 25, 2019
Priority date	Jul 25, 2019
Publication date	Feb 15, 2022
Grant date	Feb 15, 2022

Abstract

One illustrative energy recovery system disclosed herein includes a semiconductor fabrication facility (“fab”) and a closed chilled water loop including a chilled water stream delivered to the fab and a returning water stream that is received from the fab. In this example, the system also includes a primary heat exchanger having a first fluid side and a second fluid side, the first fluid side is adapted to receive supply water and the second fluid side is adapted to receive at least a portion of the returning return water stream, wherein the primary heat exchanger is adapted to effectuate heat transfer between the supply water flowing in the first fluid side and the returning water stream flowing in the second fluid side.

First claim

The invention claimed is:

1. A system comprising:
a semiconductor fabrication facility (“fab”);
a closed chilled water loop comprising a chilled water stream delivered to the fab and a returning water stream that is received from the fab;
a primary heat exchanger comprising a first fluid side and a second fluid side, the first fluid side being adapted to receive supply water, the second fluid side being adapted to receive at least a portion of the returning water stream, wherein the primary heat exchanger is adapted to effectuate heat transfer between the supply water flowing in the first fluid side and the returning water stream flowing in the second fluid side; and
a secondary heat exchanger that is adapted to receive the supply water after it exits the first fluid side of the primary heat exchanger, wherein the secondary heat exchanger is adapted to increase a temperature of the supply water as it flows through the secondary heat exchanger.

2. The system of claim 1 , wherein the chilled water stream delivered to the fab is at a first temperature where it enters the fab and the returning water stream is at a second temperature where it exits the fab, wherein the first temperature is less than the second temperature.

3. The system of claim 1 , wherein the fab further comprises a plurality of water-cooled processing tools, wherein the closed chilled water loop is a process cooling water loop that is dedicated to supplying chilled water to the plurality of water-cooled processing tools and wherein the returning water stream is received from the plurality of water-cooled processing tools.

4. The system of claim 1 , wherein the primary heat exchanger is adapted to increase a temperature of the supply water flowing in the first fluid side and decrease a temperature of the returning water stream flowing in the second fluid side.

5. The system of claim 4 , wherein the supply water flowing in the first fluid side is at a first temperature where it enters the first fluid side and the returning water stream flowing in the second fluid side is at a second temperature where it enters the second fluid side, wherein the first temperature is less than the second temperature.

6. The system of claim 1 , wherein the primary heat exchanger is adapted to decrease a temperature of supply water flowing in the first fluid side and the secondary heat exchanger is adapted to increase a temperature of the returning water stream flowing in the second fluid side.

7. The system of claim 6 , wherein the supply water flowing in the first fluid side is at a first temperature where it enters the first fluid side and the returning water stream flowing in the second fluid side is at a second temperature where it enters the second fluid side, wherein the first temperature is greater than the second temperature.

8. The system of claim 1 , further comprising:
an incoming water line in which the supply water is adapted to flow; and
at least one water storage tank that is adapted to receive supply water from the incoming water line and store supply water, wherein the supply water flowing in the first fluid side is received from at least one of the incoming water line or the at least one water storage tank.

9. The system of claim 1 , further comprising:
a first pump that is adapted to receive the supply water after it exits the first fluid side of the primary heat exchanger;
a pump water storage tank that is adapted to receive the supply water from the first pump and store the supply water in the pump water storage tank; and
a second pump that is adapted to receive the supply water stored in the pump water storage tank and supply the supply water to the secondary heat exchanger.

10. The system of claim 9 , further comprising a deionized water system that is adapted to receive the supply water after it exits the secondary heat exchanger.

11. A system comprising:
a semiconductor fabrication facility (“fab”);
a plurality of water-cooled processing tools positioned within the fab;
a process cooling water loop that is dedicated to supplying chilled water to the plurality of water-cooled processing tools, the process cooling water loop comprising a chilled water stream delivered to the fab that flows to the plurality of water-cooled processing tools and a returning water stream that is received from the fab;
a primary heat exchanger comprising a first fluid side and a second fluid side, the first fluid side being adapted to receive supply water and the second fluid side being adapted to receive at least a portion of the returning water stream, wherein the primary heat exchanger is adapted to increase a temperature of the supply water flowing in the first fluid side and decrease a temperature of the returning water stream flowing in the second fluid side; and
a secondary heat exchanger that is adapted to receive the supply water after it exits the first fluid side of the primary heat exchanger, wherein the secondary heat exchanger is adapted to increase a temperature of the supply water as it flows through the secondary heat exchanger.

12. The system of claim 11 , wherein the water stream delivered to the fab is at a first temperature and the returning water stream is at a second temperature, wherein the first temperature is less than the second temperature.

13. The system of claim 12 , wherein the supply water is at a first temperature where it enters the first fluid side and the returning water is at a second temperature where it enters the second fluid side, wherein the first temperature is less than the second temperature.

14. The system of claim 11 , further comprising:
an incoming water line in which supply water is adapted to flow; and
at least one water storage tank that is adapted to receive supply water from the incoming water line and store supply water, wherein the supply water flowing in the first fluid side is received from at least one of the incoming water line or the at least one water storage tank.

15. The system of claim 14 , further comprising:
a first pump that is adapted to receive the supply water after it exits the first fluid side of the primary heat exchanger;
a pump water storage tank that is adapted to receive the supply water from the first pump and store the supply water; and
a second pump that is adapted to receive the supply water stored in the pump water storage take and supply the supply water to the secondary heat exchanger, wherein the secondary heat exchanger is adapted to increase a temperature of the supply water as it flows through the secondary heat exchanger.

16. The system of claim 15 , further comprising a deionized water system that is adapted to receive the supply water after it exits the secondary heat exchanger.

17. A system comprising:
a semiconductor fabrication facility (“fab”);
a closed chilled water loop comprising a chilled water stream delivered to the fab and a returning water stream that is received from the fab;
a primary heat exchanger comprising a first fluid side and a second fluid side, the first fluid side being adapted to receive supply water, the second fluid side being adapted to receive at least a portion of the returning water stream, wherein the primary heat exchanger is adapted to effectuate heat transfer between the supply water flowing in the first fluid side and the returning water stream flowing in the second fluid side; and
a secondary heat exchanger that is adapted to receive the supply water after it exits the first fluid side of the primary heat exchanger, wherein the secondary heat exchanger is adapted to decrease a temperatu

Assignees

• Globalfoundries Us Inc

Inventors

• Huang Thomas

Classifications

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• F24D2200/29

  Electrical devices, e.g. computers, servers · CPC title

• F24D17/00 Primary

  Domestic hot-water supply systems · CPC title

• F24H1/00 Primary

  Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters (steam boilers F22B) · CPC title