Polyvinyl acetal resin composition, adhesive sheet, and method for producing adhesive sheet

Patent metadata

Field	Value
Publication number	US-11248149-B2
Application number	US-201615764971-A
Country	US
Kind code	B2
Filing date	Oct 6, 2016
Priority date	Oct 7, 2015
Publication date	Feb 15, 2022
Grant date	Feb 15, 2022

Abstract

The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G′ at 200° C. before irradiation with light of 8×104 Pa or lower and a storage modulus G′ at 200° C. after irradiation with light of 8×103 Pa or higher, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.

First claim

The invention claimed is:

1. A polyvinyl acetal resin composition comprising:
a polyvinyl acetal;
a reactive diluent; and
a photopolymerization initiator,
the polyvinyl acetal resin composition having a storage modulus G′ at 200° C. before irradiation with light of 1.5×10 2 Pa to 7.0×10 4 Pa and a storage modulus G′ at 200° C. after irradiation with light of 9.1×10 3 Pa to 1.2×10 6 Pa, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.

2. The polyvinyl acetal resin composition according to claim 1 ,
wherein the polyvinyl acetal resin composition has a capillary viscosity at 190° C. before irradiation with light of 7,000 Pa·s or lower.

3. The polyvinyl acetal resin composition according to claim 1 ,
wherein the polyvinyl acetal resin composition has a breaking strength at 85° C. of 0.3 MPa or higher.

4. The polyvinyl acetal resin composition according to claim 1 ,
wherein the polyvinyl acetal is polyvinyl butyral.

5. The polyvinyl acetal resin composition according to claim 1 ,
wherein the reactive diluent is a (meth)acrylic reactive diluent, an epoxy reactive diluent, or a silicone reactive diluent.

6. The polyvinyl acetal resin composition according to claim 1 ,
wherein the amount of the reactive diluent is 0.1 to 30 parts by weight relative to 100 parts by weight of the polyvinyl acetal.

7. The polyvinyl acetal resin composition according to claim 1 , further comprising a plasticizer.

8. The polyvinyl acetal resin composition according to claim 7 ,
wherein the amount of the plasticizer is 1 to 30 parts by weight relative to 100 parts by weight of the polyvinyl acetal.

9. The polyvinyl acetal resin composition according to claim 8 ,
wherein the amount of the plasticizer is 1 to 15 parts by weight relative to 100 parts by weight of the polyvinyl acetal.

10. An adhesive sheet comprising:
the polyvinyl acetal resin composition according to claim 1 .

Assignees

• Sekisui Chemical Co Ltd

Inventors

• Fukatani Juichi
• Uenomachi Kiyomi
• Okabayashi Takazumi
• EBINA Ryousuke
• Wada Atsushi

Classifications

• C08K5/0025 Primary

  Crosslinking or vulcanising agents; including accelerators · CPC title

• C08K5/132

  Phenols containing keto groups {, e.g. benzophenones} · CPC title

• C09J7/30

  characterised by the adhesive composition · CPC title

• B29K2105/0097

  Glues or adhesives, e.g. hot melts or thermofusible adhesives · CPC title

• C09J7/10

  without carriers · CPC title