Silicone mold

Patent metadata

Field	Value
Publication number	US-11247368-B2
Application number	US-201816498344-A
Country	US
Kind code	B2
Filing date	Feb 5, 2018
Priority date	Mar 27, 2017
Publication date	Feb 15, 2022
Grant date	Feb 15, 2022

Abstract

Provided is a silicone mold with which a curable composition containing an epoxy resin can be molded with good precision even if used repeatedly. The silicone mold according to an embodiment of the present invention is a silicone mold for use in molding a curable composition containing an epoxy resin, the silicone mold including a cured product of a silicone resin composition, wherein the cured product has a light transmittance at a wavelength of 400 nm of 80% or higher at a thickness of 1 mm, an elongation at break in accordance with JIS K 7161 of 250% or less, and a thermal linear expansion coefficient of 350 ppm/° C. or less at 20 to 40° C.

First claim

The invention claimed is:

1. A silicone mold for use in molding a curable composition containing an epoxy resin, the silicone mold comprising a cured product of a silicone resin composition, wherein the cured product has a light transmittance at a wavelength of 400 nm of 80% or higher at a thickness of 1 mm, an elongation at break in accordance with JIS K 7161 of 250% or less, a thermal linear expansion coefficient of 350 ppm/° C. or less at 20 to 40° C., and viscosity (at 23° C.) of the silicone resin is from 5000 mPa·s to less than 75000 mPa·s.

2. The silicone mold according to claim 1 , wherein the silicone resin composition is an addition reaction type silicone resin composition.

3. The silicone mold according to claim 1 , wherein a maximum thickness of the silicone mold is 5 mm or less.

4. A method for producing a silicone mold comprising molding a silicone resin composition, and subsequently heat-curing the silicone resin composition to form the silicone mold described in claim 1 .

5. A method for producing an optical element comprising molding a curable composition containing an epoxy resin using the silicone mold described in claim 1 , and subsequently subjecting the curable composition to photocuring to form an optical element including a cured product of the curable composition.

6. The method for producing an optical element according to claim 5 , wherein the epoxy resin is a polyfunctional alicyclic epoxy compound.

7. The method for producing an optical element according to claim 5 , wherein the epoxy resin is a compound represented by Formula (i) below:

wherein X represents a single bond or a linking group.

8. The method for producing an optical element according to claim 5 , wherein a maximum thickness of the optical element is from 0.1 to 2.0 mm.

9. The method for producing an optical element according to claim 5 , wherein the optical element is a microlens, a Fresnel lens, a molded product formed of a plurality of microlenses or Fresnel lenses bonded via a joining section, a lenticular lens sheet, or a prism sheet.

10. The silicone mold according to claim 2 , wherein a maximum thickness of the silicone mold is 5 mm or less.

11. A method for producing a silicone mold comprising molding a silicone resin composition, and subsequently heat-curing the silicone resin composition to form the silicone mold described in claim 2 .

12. A method for producing a silicone mold comprising molding a silicone resin composition, and subsequently heat-curing the silicone resin composition to form the silicone mold described in claim 3 .

13. A method for producing an optical element comprising molding a curable composition containing an epoxy resin using the silicone mold described in claim 2 , and subsequently subjecting the curable composition to photocuring to form an optical element including a cured product of the curable composition.

14. A method for producing an optical element comprising molding a curable composition containing an epoxy resin using the silicone mold described in claim 3 , and subsequently subjecting the curable composition to photocuring to form an optical element including a cured product of the curable composition.

15. The method for producing an optical element according to claim 6 , wherein a maximum thickness of the optical element is from 0.1 to 2.0 mm.

16. The method for producing an optical element according to claim 7 , wherein a maximum thickness of the optical element is from 0.1 to 2.0 mm.

17. The method for producing an optical element according to claim 6 , wherein the optical element is a microlens, a Fresnel lens, a molded product formed of a plurality of microlenses or Fresnel lenses bonded via a joining section, a lenticular lens sheet, or a prism sheet.

18. The method for producing an optical element according to claim 7 , wherein the optical element is a microlens, a Fresnel lens, a molded product formed of a plurality of microlenses or Fresnel lenses bonded via a joining section, a lenticular lens sheet, or a prism sheet.

19. The method for producing an optical element according to claim 8 , wherein the optical element is a microlens, a Fresnel lens, a molded product formed of a plurality of microlenses or Fresnel lenses bonded via a joining section, a lenticular lens sheet, or a prism sheet.

Assignees

• Daicel Corp

Inventors

• Fujikawa Takeshi
• Fukui Sadayuki

Classifications

• C08G59/24

  carbocyclic · CPC title

• B29C33/3842

  Manufacturing moulds, e.g. shaping the mould surface by machining · CPC title

• B29C2035/0877

  using electron radiation, e.g. beta-rays · CPC title

• B29C33/405

  Elastomers, e.g. rubber (B29C33/50 takes precedence) · CPC title

• B29K2063/00

  Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material · CPC title