Electromagnetic interference shielding film having a laminated structure including a stack of metal nanoplates and a nano electrode including the same

US11246247B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11246247-B2
Application numberUS-201816630104-A
CountryUS
Kind codeB2
Filing dateDec 24, 2018
Priority dateJan 5, 2018
Publication dateFeb 8, 2022
Grant dateFeb 8, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electromagnetic wave shielding film includes a substrate; and an electromagnetic wave shielding layer disposed on the substrate and including a laminated structure having a planar shape and including a stack of metal nanoplates, wherein each metal nanoplate of the stack of metal nanoplates is staggered with respect to one or more other metal nanoplate of the stack of metal nanoplates so that the laminated structure has pores defined therein and between laminated structures in a stack of laminates structures. An additional embodiment of an electromagnetic wave shielding film includes an electromagnetic wave shielding layer including a composite of a polymer resin matrix composed of a polymer and at least one metal nanoplate, wherein each metal nanoplate of the at least one metal nanoplate is staggered with respect to one or more other metal nanoplate of the at least one metal nanoplate so that the composite has pores defined therein.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electromagnetic wave shielding film, comprising: a substrate; and an electromagnetic wave shielding layer disposed on the substrate and comprising a laminated structure having a planar shape and including a stack of metal nanoplates, wherein each metal nanoplate of the stack of metal nanoplates is staggered with respect to one or more other metal nanoplate of the stack of metal nanoplates so that the laminated structure has pores defined therein, and wherein the electromagnetic wave shielding layer comprises a plurality of laminated structures that are stacked and adjacent laminated structures of the plurality of laminated structures define pores therebetween so that the stack of laminated structures has pores defined therein. 2. An electromagnetic wave shielding film, comprising: an electromagnetic wave shielding layer comprising a composite of a polymer resin matrix comprised of a polymer and at least one metal nanoplate, wherein each metal nanoplate of the at least one metal nanoplate is staggered with respect to one or more other metal nanoplate of the at least one metal nanoplate so that the composite has pores defined therein, and wherein the electromagnetic wave shielding layer comprises a plurality of laminated structures that are stacked and adjacent laminated structures of the plurality of laminated structures define pores therebetween so that the stack of laminated structures has pores defined therein. 3. The electromagnetic wave shielding film according to claim 1 , wherein the metal nanoplate has a face-centered cubic structure (FCC). 4. The electromagnetic wave shielding film according to claim 1 , wherein each metal nanoplate of the stack of metal nanoplates extends in a plane that is a (111) crystal plane. 5. The electromagnetic wave shielding film according to claim 1 , wherein the metal comprises copper, silver, platinum, gold, or a transition metal. 6. The electromagnetic wave shielding film of claim 1 , wherein the laminated structure has a porosity of 20% or more. 7. The electromagnetic wave shielding film of claim 1 , wherein the stack of metal nanoplates has a loading amount of 0.2-100 mg/cm 2 . 8. The electromagnetic wave shielding film according to claim 1 , wherein each metal nanoplate has a coverage of 95% or more based on a total area of the electromagnetic shielding film. 9. The electromagnetic wave shielding film according to claim 1 , wherein the electromagnetic wave shielding layer has a thickness ranging from 50 nm to 500 μm. 10. The electromagnetic wave shielding film according to claim 1 , wherein the electromagnetic wave shielding layer further comprises metal nanoparticles or metal nanowires. 11. The electromagnetic wave shielding film according to claim 1 , wherein the electromagnetic wave shielding film is configured to dissipate heat. 12. A nano electrode comprising the electromagnetic wave shielding film according to claim 1 . 13. The nano electrode according to claim 12 , wherein the nano electrode is a patterned electrode including a pattern of electromagnetic wave shielding films. 14. The nano electrode according to claim 12 , wherein the stack of metal nanoplates has a loading amount of 0.2-100 mg/cm 2 . 15. The nano electrode according to claim 12 , wherein each metal nanoplate has a coverage of 95% or more based on a total area of the electromagnetic shielding film.

Assignees

Inventors

Classifications

  • performed by spraying · CPC title

  • After-treatment · CPC title

  • by exposure to radiation (B05D3/02 takes precedence {; plasma treatment B05D3/141}) · CPC title

  • for applying particular liquids or other fluent materials · CPC title

  • comprising electro-conductive pigments, e.g. paint, ink, tampon printing · CPC title

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What does patent US11246247B2 cover?
An electromagnetic wave shielding film includes a substrate; and an electromagnetic wave shielding layer disposed on the substrate and including a laminated structure having a planar shape and including a stack of metal nanoplates, wherein each metal nanoplate of the stack of metal nanoplates is staggered with respect to one or more other metal nanoplate of the stack of metal nanoplates so that…
Who is the assignee on this patent?
Korea Inst Sci & Tech
What technology area does this patent fall under?
Primary CPC classification H05K9/0083. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).