Metal nanoplate, a method for preparing the same, a conductive ink composition, and a conductive film comprising the same
US-2016137865-A1 · May 19, 2016 · US
US11246247B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11246247-B2 |
| Application number | US-201816630104-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 24, 2018 |
| Priority date | Jan 5, 2018 |
| Publication date | Feb 8, 2022 |
| Grant date | Feb 8, 2022 |
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An electromagnetic wave shielding film includes a substrate; and an electromagnetic wave shielding layer disposed on the substrate and including a laminated structure having a planar shape and including a stack of metal nanoplates, wherein each metal nanoplate of the stack of metal nanoplates is staggered with respect to one or more other metal nanoplate of the stack of metal nanoplates so that the laminated structure has pores defined therein and between laminated structures in a stack of laminates structures. An additional embodiment of an electromagnetic wave shielding film includes an electromagnetic wave shielding layer including a composite of a polymer resin matrix composed of a polymer and at least one metal nanoplate, wherein each metal nanoplate of the at least one metal nanoplate is staggered with respect to one or more other metal nanoplate of the at least one metal nanoplate so that the composite has pores defined therein.
Opening claim text (preview).
The invention claimed is: 1. An electromagnetic wave shielding film, comprising: a substrate; and an electromagnetic wave shielding layer disposed on the substrate and comprising a laminated structure having a planar shape and including a stack of metal nanoplates, wherein each metal nanoplate of the stack of metal nanoplates is staggered with respect to one or more other metal nanoplate of the stack of metal nanoplates so that the laminated structure has pores defined therein, and wherein the electromagnetic wave shielding layer comprises a plurality of laminated structures that are stacked and adjacent laminated structures of the plurality of laminated structures define pores therebetween so that the stack of laminated structures has pores defined therein. 2. An electromagnetic wave shielding film, comprising: an electromagnetic wave shielding layer comprising a composite of a polymer resin matrix comprised of a polymer and at least one metal nanoplate, wherein each metal nanoplate of the at least one metal nanoplate is staggered with respect to one or more other metal nanoplate of the at least one metal nanoplate so that the composite has pores defined therein, and wherein the electromagnetic wave shielding layer comprises a plurality of laminated structures that are stacked and adjacent laminated structures of the plurality of laminated structures define pores therebetween so that the stack of laminated structures has pores defined therein. 3. The electromagnetic wave shielding film according to claim 1 , wherein the metal nanoplate has a face-centered cubic structure (FCC). 4. The electromagnetic wave shielding film according to claim 1 , wherein each metal nanoplate of the stack of metal nanoplates extends in a plane that is a (111) crystal plane. 5. The electromagnetic wave shielding film according to claim 1 , wherein the metal comprises copper, silver, platinum, gold, or a transition metal. 6. The electromagnetic wave shielding film of claim 1 , wherein the laminated structure has a porosity of 20% or more. 7. The electromagnetic wave shielding film of claim 1 , wherein the stack of metal nanoplates has a loading amount of 0.2-100 mg/cm 2 . 8. The electromagnetic wave shielding film according to claim 1 , wherein each metal nanoplate has a coverage of 95% or more based on a total area of the electromagnetic shielding film. 9. The electromagnetic wave shielding film according to claim 1 , wherein the electromagnetic wave shielding layer has a thickness ranging from 50 nm to 500 μm. 10. The electromagnetic wave shielding film according to claim 1 , wherein the electromagnetic wave shielding layer further comprises metal nanoparticles or metal nanowires. 11. The electromagnetic wave shielding film according to claim 1 , wherein the electromagnetic wave shielding film is configured to dissipate heat. 12. A nano electrode comprising the electromagnetic wave shielding film according to claim 1 . 13. The nano electrode according to claim 12 , wherein the nano electrode is a patterned electrode including a pattern of electromagnetic wave shielding films. 14. The nano electrode according to claim 12 , wherein the stack of metal nanoplates has a loading amount of 0.2-100 mg/cm 2 . 15. The nano electrode according to claim 12 , wherein each metal nanoplate has a coverage of 95% or more based on a total area of the electromagnetic shielding film.
performed by spraying · CPC title
After-treatment · CPC title
by exposure to radiation (B05D3/02 takes precedence {; plasma treatment B05D3/141}) · CPC title
for applying particular liquids or other fluent materials · CPC title
comprising electro-conductive pigments, e.g. paint, ink, tampon printing · CPC title
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