Semiconductor laser

Patent metadata

Field	Value
Publication number	US-11245248-B2
Application number	US-201816959528-A
Country	US
Kind code	B2
Filing date	Oct 19, 2018
Priority date	Jan 10, 2018
Publication date	Feb 8, 2022
Grant date	Feb 8, 2022

Abstract

A semiconductor laser includes a semiconductor layer including end faces and at least one of the end faces is configured as a light emission end face. The semiconductor layer includes a waveguide and a light window structure region. The waveguide has a first width and is extended between the end faces. The light window structure region includes an opening having a second width greater than the first width arranged along the waveguide and is formed continuously or intermittently from one to another of the end faces.

First claim

The invention claimed is:

1. A semiconductor laser, comprising:
a semiconductor layer including end faces, at least one of the end faces being configured as a light emission end face, wherein
the semiconductor layer includes
a waveguide having a first width extended between the end faces, and
a light window structure region including an opening having a second width greater than the first width arranged along the waveguide, the light window structure region formed continuously or intermittently from one to another of the end faces.

2. The semiconductor laser according to claim 1 , wherein
the semiconductor layer includes an active layer, a first clad layer arranged at a substrate side, and a second clad layer arranged at an opposite side of the first clad layer with respect to the active layer.

3. The semiconductor laser according to claim 2 , wherein
the light window structure region is arranged in a depth that reaches from the second clad layer to the first clad layer via the active layer.

4. The semiconductor laser according to claim 2 , wherein
the waveguide is a ridge waveguide.

5. The semiconductor laser according to claim 4 , wherein
the ridge waveguide has tapered or reverse tapered side faces extended from one to another of the end faces.

6. The semiconductor laser according to claim 4 , wherein
the semiconductor layer has a concave part pair formed by sandwiching the ridge waveguide along the ridge waveguide.

7. The semiconductor laser according to claim 4 , wherein
the semiconductor layer has further a high resistance layer, the high resistance layer being arranged along the waveguide, formed continuously or intermittently from one to another of the end faces, and arranged in the second clad layer of the light window structure region from a surface opposite to a side in which the active layer is arranged to a position shallower than the active layer.

8. The semiconductor laser according to claim 2 , wherein
the semiconductor layer has further a high resistance layer, the high resistance layer being arranged along the waveguide, formed continuously or intermittently from one to another of the end faces, and arranged in the second clad layer of the light window structure region from a surface opposite to a side in which the active layer is arranged to a position shallower than the active layer.

9. The semiconductor laser according to claim 4 , wherein
the semiconductor layer is configured to match a center of the waveguide in a width direction with a center of the opening in the width direction.

10. The semiconductor laser according to claim 9 , wherein
the first width that is a width of the ridge waveguide is 0.5 μm or more and 5 μm or less, and
the second width is 5 μm or more and 40 μm or less.

11. The semiconductor laser according to claim 7 , wherein
the high resistance layer has an opening arranged so as to overlap with the opening of the light window structure region.

12. The semiconductor laser according to claim 11 , wherein
a width of the opening of the high resistance layer is identical to or smaller than the second width of the opening of the light window structure region.

13. The semiconductor laser according to claim 7 , wherein
the high resistance layer includes at least one of Si, B, or H.

14. The semiconductor laser according to claim 1 , wherein
the light window structure region is a Zn diffusion region.

Assignees

• Sony Semiconductor Solutions Corp

Inventors

• Satou Shinya
• Iki Hideto

Classifications

• H01S5/22

  having a ridge or stripe structure · CPC title

• H01S5/2086

  lateral etch control, e.g. mask induced · CPC title

• H01S5/026

  Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers (stabilisation of output H01S5/06) · CPC title

• H01S5/223

  Buried stripe structure {(H01S5/227 takes precedence)} · CPC title

• H01S5/162 Primary

  with window regions made by diffusion or disordening of the active layer · CPC title