Methods of forming electrode structures

US11245103B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11245103-B2
Application numberUS-201916369027-A
CountryUS
Kind codeB2
Filing dateMar 29, 2019
Priority dateMar 15, 2013
Publication dateFeb 8, 2022
Grant dateFeb 8, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An electrode structure and its method of manufacture are disclosed. The disclosed electrode structures may be manufactured by depositing a first release layer on a first carrier substrate. A first protective layer may be deposited on a surface of the first release layer and a first electroactive material layer may then be deposited on the first protective layer. Subsequently, the first carrier substrate may be delaminated from the first release layer. The first release layer may then be removed from the first protective layer by dissolution in an electrolyte. The first protective layer may have a low mean peak to valley surface roughness and/or may be thin. In some embodiments, an interface between the first protective layer and the first electroactive material layer has a low mean peak to valley surface roughness. In some embodiments, a thickness of the first protective layer is greater than a mean peak to valley roughness of the first release layer. In some embodiments, an adhesive strength between the first release layer and the first protective layer is greater than an adhesive strength between the first release layer and the first carrier substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: providing a first carrier substrate; depositing a first release layer on the first carrier substrate, wherein the first release layer comprises a polymer; depositing a first protective layer on the surface of the first release layer, wherein a thickness of the first protective layer is greater than the mean peak to valley roughness of the first release layer; depositing a first electroactive material layer on the first protective layer, wherein an adhesive strength between the first release layer and the first protective layer is greater than an adhesive strength between the first release layer and the first carrier substrate; delaminating the first carrier substrate from the first release layer; and removing the first release layer from the first protective layer by dissolving the first release layer in an electrolyte. 2. The method of claim 1 , wherein the first release layer is at least one of a polymer, a gel polymer, and a wax. 3. The method of claim 1 , wherein the first release layer comprises a material that is substantially amorphous. 4. The method of claim 1 , wherein the first release layer is conductive to lithium ions. 5. The method of claim 1 , wherein the first release layer comprises a lithium salt. 6. The method of claim 1 , wherein the first electroactive material layer comprises lithium metal. 7. The method of claim 1 , wherein a mean peak to valley roughness of an interface between the first release layer and the first protective layer is less than a mean peak to valley roughness of the first carrier substrate. 8. The method of claim 1 , wherein the first electroactive material layer comprises an alkali metal. 9. The method of claim 1 , wherein the first electroactive material layer comprises lithium metal, wherein the first release layer is at least one of a polymer, a gel polymer, and a wax, wherein the thickness of the substantially continuous protective layer is at least two times greater than the mean peak to valley roughness of the substantially continuous protective layer, and wherein a thickness of the first protective layer has a thickness of between about 0.1 μm and about 2 μm. 10. The method of claim 1 , wherein delaminating the first carrier substrate further comprises delaminating the first carrier substrate from the first release layer, wherein the first release layer remains disposed on the first protective layer. 11. The method of claim 1 , further comprising laminating a separate portion of the electrode structure to the first electroactive material layer. 12. The method of claim 11 , wherein lamination involves applying a pressure of between 5 kg/cm 2 and 10 kg/cm 2 . 13. The method of claim 1 , wherein the first protective layer is substantially continuous.

Assignees

Inventors

Classifications

  • Immobilising or gelification of electrolyte · CPC title

  • with adhesive layers between electrodes and separators · CPC title

  • Polymeric materials, e.g. gel-type or solid-type · CPC title

  • Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof · CPC title

  • Processes of manufacture · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11245103B2 cover?
An electrode structure and its method of manufacture are disclosed. The disclosed electrode structures may be manufactured by depositing a first release layer on a first carrier substrate. A first protective layer may be deposited on a surface of the first release layer and a first electroactive material layer may then be deposited on the first protective layer. Subsequently, the first carrier …
Who is the assignee on this patent?
Sion Power Corp
What technology area does this patent fall under?
Primary CPC classification H01M4/0402. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).