Sealing structure and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11244877-B2
Application number	US-201616088263-A
Country	US
Kind code	B2
Filing date	Apr 4, 2016
Priority date	Apr 4, 2016
Publication date	Feb 8, 2022
Grant date	Feb 8, 2022

Abstract

Provided is a sealing structure including a housing that houses a heat generating member or a heat dissipation member thereinside, and a resin that is filled in the housing. In a sectional view, the housing includes a first recess portion in a position facing the heat generating member or the heat dissipation member.

First claim

The invention claimed is:

1. A manufacturing method of a sealing structure which includes a housing which houses a heat generating member or a heat dissipation member thereinside, and a resin which seals an inner portion of the housing, the method comprising steps of:
filling the housing with the resin which is shrunk during curing in the housing;
gradually curing a first portion of the resin which is filled in a circumferential edge area of the inner portion of the housing prior to a second portion of the resin which is filled in an area near a gap between the heat generating member or the heat dissipation member and the housing; and
narrowing the gap by shrinkage of the resin during the curing.

2. The manufacturing method of the sealing structure according to claim 1 , wherein
in the step of filling the resin,
the housing is used which includes a first recess portion in a position facing the heat generating member or the heat dissipation member.

3. The manufacturing method of the sealing structure according to claim 1 , wherein
in the step of filling the resin,
the housing is used which includes a protrusion protruding in a direction of the heat generating member or the heat dissipation member, and
in the step of narrowing the gap by the shrinkage of the resin during the curing,
the protrusion abuts on the heat generating member or the heat dissipation member.

4. The manufacturing method of the sealing structure according to claim 2 , wherein
in the step of filling the resin,
the housing is used in which a heat conducting member is provided in a position facing the heat generating member or the heat dissipation member inside the first recess portion.

5. The manufacturing method of the sealing structure according to claim 2 , wherein
in the step of filling the resin,
the housing is used which includes a second protrusion protruding inward in a position different from the first recess portion.

6. The manufacturing method of the sealing structure according to claim 1 , wherein
in the step of filling the resin,
the housing is used which includes a second recess portion which is provided in a side wall of the housing and is recessed to act in a direction of narrowing the gap, and
in the step of narrowing the gap by the shrinkage of the resin during the curing,
the second recess portion is recessed by the shrinkage of the resin during the curing to narrow the gap.

Assignees

• Hitachi Ltd

Inventors

• Nakatsuka Tetsuya
• Kawakita Shinya
• Ishida Susumu
• Yoshida Isamu
• Ikeda Osamu

Classifications

• H10W76/05

  Providing fillings in containers, e.g. gas filling · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W40/10

  Arrangements for heating · CPC title