Ceramic electronic device and manufacturing method of ceramic electronic device

US11244788B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11244788-B2
Application numberUS-201816178314-A
CountryUS
Kind codeB2
Filing dateNov 1, 2018
Priority dateNov 14, 2017
Publication dateFeb 8, 2022
Grant dateFeb 8, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A ceramic electronic device includes: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are respectively formed on the first edge face and the second edge face and extend to at least one of side faces of the ceramic main body, wherein an interval between side edge portions of the external electrodes on the at least one of side faces is shorter than center portions of the external electrodes on the at least one of side faces.

First claim

Opening claim text (preview).

What is claimed is: 1. A ceramic electronic device comprising: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are formed on the first edge face and the second edge face, respectively, and extend in a length direction to at least one of four side faces of the ceramic main body, each of the external electrodes being constituted by compositionally different one or more conductive layers, wherein a shortest distance in the length direction between first conductive layers of the respective external electrodes on the at least one of the side faces is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the respective first conductive layers in a width direction orthogonal to the length direction on the at least one of the side faces, each of said corner portions of the ceramic main body being a ridge region connecting the at least one of the side faces and another of the side faces adjacent to the at least one of the side faces and having a curvature as viewed in the length direction, said first conductive layers being in direct contact with the first edge face and the second edge face, respectively, and extending in the length direction to the at least one of the side faces, wherein each of the first conductive layers has a thickness of 1 μm or more on the respective corner portions of the ceramic main body, which is less than a thickness on the at least one of the side faces between the corner portions. 2. The ceramic electronic device as claimed in claim 1 , wherein a distance between the first edge face and the second edge face is 1 mm or less. 3. The ceramic electronic device as claimed in claim 2 , wherein (L2−L1)/2 is 5 μm or greater and 30 μm or less where L1 represents the shortest distance in the length direction between the respective first conductive layers on the at least one of the side faces between the locations corresponding to the corner portions of the ceramic main body, respectively, and L2 represents a distance in the length direction between the respective first conductive layers on the at least one of the side faces between the center portions of the respective first conductive layers in the width direction on the at least one of the side faces. 4. The ceramic electronic device as claimed in claim 1 , wherein each of the external electrodes has a thickness of 10 μm or less on the at least one of the side faces. 5. A manufacturing method of a ceramic electronic device having internal electrode layers inside thereof and having a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face, comprising: forming external electrodes on the first edge face and the second edge face, respectively, in a manner extending in a length direction to at least one of four side faces of the ceramic main body, wherein each of the external electrodes are constituted by compositionally different one or more conductive layers, and a shortest distance in the length direction between first conductive layers of the respective external electrodes on the at least one of the side faces is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the respective first conductive layers in a width direction orthogonal to the length direction on the at least one of the side faces, each of said corner portions of the ceramic main body being a ridge region connecting the at least one of the side faces and another of the side faces adjacent to the at least one of the side faces and having a curvature as viewed in the length direction, said first conductive layers being in direct contact with the first edge face and the second edge face, respectively, and extending in the length direction to the at least one of the side faces, wherein each of the first conductive layers has a thickness of 1 μm or more on the respective corner portions of the ceramic main body, which is less than a thickness on the at least one of the side faces between the corner portions. 6. The method as claimed in claim 5 , wherein the forming of the external electrodes comprises: reforming a surface of the ceramic main body; coating a conductive metal paste on the ceramic main body after the reforming, by dipping the ceramic main boy after the reforming into a conductive metal paste; forming a ground later by baking the conductive metal paste; and forming a plated layer on the ground layer. 7. The method as claimed in claim 6 , wherein, in the reforming, the surface is reformed so that a contact angle of the surface of the ceramic body with respect to water is 100° or more. 8. A ceramic electronic device comprising: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are formed on the first edge face and the second edge face, respectively, and extend in a length direction to at least one of four side faces of the ceramic main body, wherein a shortest distance in the length direction between the respective external electrodes on the at least one of the side faces is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the respective external electrodes in a width direction orthogonal to the length direction on the at least one of the side faces, each of said corner portions of the ceramic main body being a ridge region connecting the at least one of the side faces and another of the side faces adjacent to the at least one of the side faces and having a curvature as viewed in the length direction, wherein each of the external electrodes has a thickness of 1 μm or more on the respective corner portions of the ceramic main body, which is less than a thickness on the at least one of the side faces between the corner portions, wherein a distance between the first edge face and the second edge face is 1 mm or less, and wherein (L2−L1)/2 is 5 μm or greater and 30 μm or less where L1 represents the shortest distance in the length direction between the respective external electrodes on the at least one of the side faces between the locations corresponding to the corner portions of the ceramic main body, respectively, and L2 represents a distance in the length direction between the respective external electrodes on the at least one of the side faces between the center portions of the respective external electrodes in the width direction on the at least one of the side faces. 9. The ceramic electronic device as claimed in claim 8 , wherein each of the external electrodes has a thickness of 10 μm or less on the at least one of the side faces. 10. The ceramic electronic device as claimed in claim 8 , wherein each of the external electrodes is constituted by compositionally different one or more conductive layers, and each of first conductive layers of the respective external electrodes ha

Assignees

Inventors

Classifications

  • H01G4/232Primary

    electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

  • Apparatus or processes for applying terminals · CPC title

  • H01G4/30Primary

    Stacked capacitors (H01G4/33 takes precedence) · CPC title

  • Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

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What does patent US11244788B2 cover?
A ceramic electronic device includes: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; ex…
Who is the assignee on this patent?
Taiyo Yuden Kk
What technology area does this patent fall under?
Primary CPC classification H01G4/232. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).