Colour ILED display on silicon
US-10515580-B2 · Dec 24, 2019 · US
US11244605B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11244605-B2 |
| Application number | US-202117201381-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2021 |
| Priority date | Jul 31, 2014 |
| Publication date | Feb 8, 2022 |
| Grant date | Feb 8, 2022 |
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A method of fabricating an image generator for use in a display, the method comprising: fabricating a plurality of discrete ILED array chips comprising a plurality of ILED emitters configured to produce light having the same wavelength, and wherein each of the plurality of ILED array chips is configured to produce light having one of a plurality of wavelengths; positioning the plurality of discrete ILED array chips on a carrier substrate such that a plurality of ILED emitters from adjacent chips form a pixel of a display; and bonding a first surface of the plurality of ILED array chips to a driver backplane such that electrical contacts of the plurality of ILED array chips are in electrical communication with the driver backplane, wherein the driver backplane comprises electronics for driving the ILED array chips.
Opening claim text (preview).
The invention claimed is: 1. A display, comprising: inorganic light emitting diode (ILED) array chips configured to produce light having different wavelengths, each ILED array chip including ILED emitters configured to produce light having the same wavelength at a first side of the ILED array chip; discrete control chips each including control electronics, the discrete control chips being interconnected to the ILED array chips at second sides of the ILED array chips opposite to the first sides; and substrates each including an optical component, each ILED array chip being bonded at the first side to a respective substrate that manipulates light emitted from the ILED array chip. 2. The display of claim 1 , wherein each LED chip includes a driver backplane. 3. The display of claim 2 , wherein the driver backplane includes thin-film transistor (TFT) circuitry. 4. The display of claim 1 , wherein the ILED array chips include a first ILED array chip including first ILED emitters configured to produce a red light, a second array ILED array chip including second ILED emitters configured to produce a green light, and a third ILED array chip including third ILED emitters configured to produce a blue light. 5. The display of claim 1 , wherein a pixel of the display is formed with a plurality of ILED emitters configured to produce light of different wavelengths from adjacent ILED array chips. 6. The display of claim 5 , wherein the pixel is formed with at least two ILED emitters from each of the adjacent ILED array chips. 7. The display of claim 5 , wherein a contact of each of the plurality of ILED emitters from the adjacent ILED array chips that form the pixel are connected to each other. 8. The display of claim 1 , wherein the ILED emitters of each ILED array chip are individually addressable. 9. The display of claim 1 , wherein the control electronics include complementary metal-oxide-semiconductor (CMOS) circuitry or thin-film transistor (TFT) circuitry. 10. The display of claim 1 , wherein the control electronics include an active backplane. 11. The display of claim 1 , wherein at least one ILED emitter of an ILED array chip includes one of: gallium nitride (GaN); gallium phosphide (GaP); or gallium arsenide (GaAs). 12. The display of claim 1 , wherein the ILED array chips are bonded to the discrete control chips such that electrical contacts of the ILED array chips are in electrical communication with the control electronics for driving the ILED array chips. 13. The display of claim 1 , wherein spacing between adjacent ILED array chips is less than 100 μm. 14. The display of claim 1 , wherein each ILED emitter of each ILED array chip includes a reflective mesa structure for reflecting generated light at an angle such that the generated light escapes the ILED emitter. 15. The display of claim 1 , wherein each of the substrates faces a light emitting surface of one of the ILED array chips. 16. The display of claim 1 , wherein each of the ILED array chips is of a rectangular, triangular, or hexagonal shape. 17. The display of claim 1 , wherein each ILED emitter of each ILED array chip includes a mesa structure including a semiconductor epitaxial layer an active light emitting layer. 18. The display of claim 17 , the mesa structure includes a truncated top at a side opposite to a light emitting surface of the ILED emitter. 19. The display of claim 1 , wherein two adjacent pixels of the display each includes an ILED emitter from an ILED array chip. 20. The display of claim 1 , wherein the ILED emitters of each ILED array chip are located at corners of the ILED array chip.
Package configurations · CPC title
comprising only Group III-V materials, e.g. GaP · CPC title
characterised by multiple TFTs · CPC title
characterised by their shape, e.g. curved or truncated substrates · CPC title
Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title
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