Conductive composition and conductive molded article

Patent metadata

Field	Value
Publication number	US-11242471-B2
Application number	US-201515121076-A
Country	US
Kind code	B2
Filing date	Feb 12, 2015
Priority date	Feb 24, 2014
Publication date	Feb 8, 2022
Grant date	Feb 8, 2022

Abstract

The present invention relates to a conductive composition containing a conductive metal powder and a resin component, in which the conductive metal powder contains at least a metal flake having a crystalline structure in which a metal crystal grows in a flake shape, and the resin component contains an aromatic amine skeleton.

First claim

The invention claimed is:

1. A conductive composition comprising a conductive metal powder and thermosetting resin composition comprising a thermosetting epoxy resin and an aromatic amine-based curing agent, wherein the conductive metal powder comprises at least a metal flake having a crystalline structure in which a metal crystal grows in a flake shape,
wherein the thermosetting epoxy resin is bisphenol A propoxy diglycidyl ether or a phenol novolak epoxy resin,
wherein the aromatic amine-based curing agent is 4, 4′-methylenebis(2-ethyl-6-methylaniline) or 4, 4′-diaminodiphenyl ether; and further wherein;
a ratio of the thermosetting resin composition is from 3 to 15 parts by weight, relative to 100 parts by weight of the metal flake;
a ratio of the aromatic amine-based curing agent is from 5 to 80 parts by weight, relative to 100 parts by weight of the thermosetting epoxy resin; and
the metal flake is a silver flake having an average particle diameter of 1 to 10 μm and having a value X represented by the following equation of 1 to 10% when diffraction integrated intensity values of a (111) plane and a (200) plane in X-ray diffraction are taken as I 111 and I 200 ,respectively:
X=[I 200 /( I 111 +I 200 )]×100 (%).

2. The conductive composition according to claim 1 , which is a conductive adhesive.

3. A method of bonding a metal base material to a semiconductor base material comprising applying the conductive adhesive of claim 2 to the metal base material, the semiconductor base material, or both, and pressing together the metal base material and the semiconductor base material.

4. A conductive molded body comprising at least a conductive portion formed of the conductive composition described in claim 1 .

5. The conductive molded body according to claim 4 , which is a molded body comprising a conjugated base material composed of two base materials and a conductive adhesive that intervenes between the two base materials and bonds the two base materials each other, wherein the conductive adhesive as the conductive portion is formed of the conductive composition described in claim 1 .

Assignees

• Mitsuboshi Belting Ltd

Inventors

• Iseda Taisuke
• Iwamoto Masahiro

Classifications

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title