Laser dicing glass wafers using advanced laser sources
US-2024409449-A1 · Dec 12, 2024 · US
US11242284B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11242284-B2 |
| Application number | US-201314417466-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 26, 2013 |
| Priority date | Jul 26, 2012 |
| Publication date | Feb 8, 2022 |
| Grant date | Feb 8, 2022 |
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A microfabrication method is provided with which it is possible to easily form a fine periodic structure on a surface of any substrate. A glass precursor is applied to a substrate, and the glass precursor is irradiated with short-pulse laser light. By the irradiation with short-pulse laser light, the glass precursor is activated to undergo a thermal reaction, and a fine periodic structure can be easily formed on the surface. Furthermore, by oxidizing the substrate on which the fine periodic structure has been formed, the hue of the surface can be improved while maintaining the fine periodic structure.
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The invention claimed is: 1. A microfabrication method comprising: an application step of applying a glass precursor onto a substrate; an irradiation step of irradiating one short pulse laser to the glass precursor, and forming a periodic structure of a size smaller than a wavelength of the short pulse laser; and a heating step of heating the substrate at a temperature of 400° C. to 550° C. after the irradiating step, wherein the glass precursor is polysilazane having —(SiH 2 NH)— as a base unit, a pulse duration of the short pulse laser is between 0.01 picoseconds and 5 picoseconds, and a fluence range of the short pulse laser is 0.05 J/cm 2 to 0.5 J/cm 2 , wherein the irradiation step converts the glass precursor to silica, and wherein the heating step increases a total light transmittance of the silica. 2. The microfabrication method according to claim 1 , wherein the substrate is a glass. 3. The microfabrication method according to claim 2 , wherein a fine periodic structure on a glass surface has a reflectance of 1% or less in a wavelength range of 300 nm to 800 nm. 4. The microfabrication method according to claim 1 , wherein the short pulse laser has a beam spot of a quadrilateral shape. 5. A microfabrication method of producing microfabrication products comprising: an irradiation step of irradiating one short pulse laser to a glass precursor applied to a substrate and forming a periodic structure of a size smaller than a wavelength of the short pulse laser; and an oxidizing step of oxidizing a fine periodic structure formed by the irradiation step, wherein the glass precursor is polysilazane having —(SiH 2 NH)— as a base unit, a pulse duration of the short pulse laser is between 0.01 picoseconds and 5 picoseconds, and a fluence range of the short pulse laser is 0.05 J/cm 2 to 0.5 J/cm 2 , wherein the oxidizing step is a heat treatment at a temperature of 400° C. to 550° C., wherein the irradiation step converts the glass precursor to silica, and wherein the oxidizing step increases a total light transmittance of the silica. 6. The microfabrication method according to claim 5 , wherein the substrate is a glass. 7. The microfabrication method according to claim 6 , wherein the fine periodic structure on a glass surface has a reflectance of 1% or less in a wavelength range of 300 nm to 800 nm. 8. The microfabrication method according to claim 5 , wherein the heat treatment is performed in an oxygen atmosphere.
of the substrates or of layers on substrates, e.g. textured ITO layer on a glass substrate · CPC title
by a laser beam · CPC title
for the production of films or coatings · CPC title
Oxidation · CPC title
Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title
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