Packing body, method of manufacturing packing body, and method of manufacturing liquid ejecting apparatus

US11242186B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11242186-B2
Application numberUS-201916394840-A
CountryUS
Kind codeB2
Filing dateApr 25, 2019
Priority dateApr 25, 2018
Publication dateFeb 8, 2022
Grant dateFeb 8, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There are included a packing material that has a moisture-proof property and forms a third space, a liquid ejecting head that includes a case member which forms a second space communicating with the third space, and a first moisture absorbing material and a piezoelectric element which are disposed in the second space, and is disposed in the third space, and a second moisture absorbing material that has a higher moisture absorbing property than that of the first moisture absorbing material and is disposed in the third space.

First claim

Opening claim text (preview).

What is claimed is: 1. A packing body comprising: a packing material that has a moisture-proof property and forms a packing space; a liquid ejecting head that includes a space forming member which forms an accommodating space communicating with the packing space, and a first moisture absorbing material and a piezoelectric element which are disposed in the accommodating space, and a pressure chamber for accommodating a liquid, and a vibration plate which is disposed between the piezoelectric element and the pressure chamber, and a nozzle which communicates with the pressure chamber, and is disposed in the packing space; and a second moisture absorbing material that has a higher moisture absorbing property than that of the first moisture absorbing material and is disposed in the packing space, wherein the space forming member defines an atmosphere communication port that allows the accommodating space and the packing space to communicate with each other while the packing space is sealed and opened. 2. The packing body according to claim 1 , wherein the first moisture absorbing material is a physical adsorption-type moisture absorbing material. 3. The packing body according to claim 2 , wherein the second moisture absorbing material is a chemical reaction-type moisture absorbing material. 4. The packing body according to claim 1 , wherein a maximum amount of moisture absorption of the second moisture absorbing material is greater than a maximum amount of moisture absorption of the first moisture absorbing material. 5. The packing body according to claim 1 , wherein the liquid ejecting head is accommodated in a case having moisture permeability. 6. The packing body according to claim 1 , wherein the packing space is wider than the accommodating space such that an amount of the second moisture absorbing material is larger than an amount of the first moisture absorbing member.

Assignees

Inventors

Classifications

  • Details peculiar to packaging machines and not otherwise provided for; Arrangements of such details · CPC title

  • for adding cards, coupons or other inserts to package contents (adding unpacking elements B65B61/18) · CPC title

  • of film type, deformed by bending and disposed on a diaphragm · CPC title

  • in bags · CPC title

  • Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages · CPC title

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What does patent US11242186B2 cover?
There are included a packing material that has a moisture-proof property and forms a third space, a liquid ejecting head that includes a case member which forms a second space communicating with the third space, and a first moisture absorbing material and a piezoelectric element which are disposed in the second space, and is disposed in the third space, and a second moisture absorbing material …
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B41J2/14233. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).