Assembly and method for sealing a bundle of wires

US11239639B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11239639-B2
Application numberUS-201615282670-A
CountryUS
Kind codeB2
Filing dateSep 30, 2016
Priority dateSep 30, 2016
Publication dateFeb 1, 2022
Grant dateFeb 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.

First claim

Opening claim text (preview).

We claim: 1. A sealing assembly for sealing a bundle of wires comprises: a first sheet formed of a meltable sealant material; a second sheet disposed above the first sheet, the second sheet formed of a second sealant material and includes a thermally conductive material; a third sheet disposed above the second sheet formed of the sealant material wherein the third sheet defines a plurality of teeth on a top surface that define valleys there between for controlled placement of…

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What does patent US11239639B2 cover?
A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a…
Who is the assignee on this patent?
Tyco Electronics Corp, TE Connectivity Services Gmbh
What technology area does this patent fall under?
Primary CPC classification B60R16/0215. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).