Method of producing a composite substrate

Patent metadata

Field	Value
Publication number	US-11239405-B2
Application number	US-201816148448-A
Country	US
Kind code	B2
Filing date	Oct 1, 2018
Priority date	Jul 25, 2013
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

Described herein is a method of bonding a piezoelectric substrate to a support substrate to form a composite substrate. The piezoelectric substrate has one surface which is positively polarized, and a second surface which is negatively polarized. The method described herein includes the steps of bonding the positively polarized surface of the piezoelectric substrate to one surface of the support substrate by a direct bonding method.

First claim

What is claimed is:

1. A method of producing a composite substrate, comprising a bonding step of bonding a positively-polarized surface of a first substrate, which is a piezoelectric substrate, one surface of which is a negatively-polarized surface and another surface of which is the positively-polarized surface, to one surface of a second substrate, which is a support substrate, by a direct bonding method to produce the composite substrate, wherein the second substrate is not a piezoelectric substrate; and
a substrate thinning step of grinding and polishing the negatively-polarized surface of the piezoelectric substrate of the composite substrate obtained in the bonding step.

2. The method of producing a composite substrate according to claim 1 , further comprising:
an etching step of etching, with a strong acid, an affected layer generated in the negatively-polarized surface in the substrate thinning step,
wherein, in the piezoelectric substrate and support substrate, an etching rate at which the negatively-polarized surface is etched with the strong acid is higher than an etching rate at which the positively-polarized surface is etched with the strong acid and an etching rate at which the support substrate is etched with the strong acid is higher than the etching rate at which the negatively-polarized surface is etched with the strong acid.

3. The method of producing a composite substrate according to claim 2 ,
wherein hydrofluoric nitric acid or hydrofluoric acid is used as the strong acid.

4. The method of producing a composite substrate according to claim 1 ,
wherein a substrate having a thermal expansion coefficient smaller than a thermal expansion coefficient of the piezoelectric substrate is used as the support substrate.

5. The method of producing a composite substrate according to claim 1 ,
wherein a lithium tantalate substrate or a lithium niobate substrate is prepared as the piezoelectric substrate, and a silicon substrate or a glass substrate is used as the support substrate.

Assignees

• Ngk Insulators Ltd
• Ngk Ceram Device Co Ltd

Inventors

• Tai Tomoyoshi
• Hori Yuji
• Yamadera Takahiro
• Hattori Ryosuke
• Suzuki Kengo

Classifications

• H03H9/02574 Primary

  of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate · CPC title

• H03H2003/0435

  of a piezoelectric layer · CPC title

• H03H9/02834

  of temperature influence (cut angles H03H9/02543) · CPC title

• Y10T29/42

  Piezoelectric device making · CPC title

• H03H3/10

  for obtaining desired frequency or temperature coefficient · CPC title