Moisture-curable hot melt adhesive

US11236257B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11236257-B2
Application numberUS-201816013198-A
CountryUS
Kind codeB2
Filing dateJun 20, 2018
Priority dateDec 25, 2015
Publication dateFeb 1, 2022
Grant dateFeb 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A moisture-curable hot melt adhesive comprising, based on 100 parts by total weight of adhesive: (A) 20 to 50 parts by weight of a urethane prepolymer having a terminal isocyanate group, the urethane prepolymer being a reaction product of a mixture comprising a polyisocyanate, a polyether polyol and a polyester polyol, (B) 2 to 15 parts by weight of a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C., and (C) 2 to 20 parts by weight of a polyester-polyether block copolymer comprising a polybutylene terephthalate segment; and a segment selected from polytetramethylene glycol, and (D) 4 to 12 parts by weight of an ethylene/carboxylic acid ester copolymer comprising an ethylene vinyl acetate copolymer. 2. The moisture-curable hot melt adhesive according to the above claim 1 , wherein the content of vinyl acetate in the ethylene/vinyl acetate copolymer is 20 to 50% by weight. 3. The moisture-curable hot melt adhesive according to the above claim 1 , wherein the melt flow rate of the ethylene/vinyl acetate copolymer (D) is 20 to 200 g/10 min at 190° C., 2.16 kg. 4. The moisture-curable hot melt adhesive according to claim 1 , further comprising (E) an α-methyl styrene-based resin. 5. The moisture-curable hot melt adhesive according to claim 4 , comprising 2 to 15 parts by weight of the metallocene-based polyolefin (B) based on 100 parts by weight of a total weight of (A), (B), (C) and (E). 6. A laminate comprising the moisture-curable hot melt adhesive according to claim 1 . 7. Cured reaction products of the moisture-curable hot melt adhesive according to claim 1 . 8. A method for producing a moisture-curable hot melt adhesive according to claim 1 comprising: reacting a polyol and an isocyanate compound to form (A) a urethane prepolymer having a terminal isocyanate group; providing (B) a metallocene-based polyolefin, (C) a polyester-polyether copolymer, (D) an ethylene/carboxylic acid ester copolymer, and (E) an α-methyl styrene-based resin; and mixing the (A) a urethane prepolymer, (B) the metallocene-based polyolefin, (C) the polyester-polyether copolymer, (D) the ethylene/carboxylic acid ester copolymer, and (E) the α-methyl styrene-based resin to form the moisture-curable hot melt adhesive. 9. The moisture-curable hot melt adhesive according to claim 1 , wherein the ethylene/carboxylic acid ester copolymer (D) comprises an ethylene-C 1-10 alkyl (meth)acrylate copolymer. 10. The moisture-curable hot melt adhesive according to claim 1 , wherein the ethylene/carboxylic acid ester copolymer (D) comprises the ethylene/vinyl acetate copolymer and an ethylene-C 1-10 alkyl (meth)acrylate copolymer. 11. The moisture-curable hot melt adhesive according to claim 1 , comprising: 30 to 40 parts by weight of the (A) urethane prepolymer; 4 to 12 parts by weight of the (B) metallocene-based polyolefin; 5 to 15 parts by weight of the (C) polyester-polyether copolymer; wherein the total weight of all components in the moisture curable hot melt adhesive is 100. 12. A moisture-curable hot melt adhesive comprising, based on 100 parts by total weight of adhesive: (A) 20 to 50 parts by weight of a urethane prepolymer having a terminal isocyanate group, the urethane prepolymer being a reaction product of a mixture comprising a polyisocyanate, a polyether polyol and a polyester polyol, (B) 2 to 15 parts by weight of a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C., and (C) to 20 parts by weight of a polyester-polyether copolymer having a chemical structure comprising wherein n denotes an integer and is preferably 20 to 1,000; and wherein p is an integer of 2 to 5, q is an integer of 2 to 200, and m is an integer of 1 to 200, and (D) 4 to 12 parts by weight of an ethylene/carboxylic acid ester copolymer. 13. The moisture-curable hot melt adhesive according to claim 1 , wherein the urethane prepolymer mixture comprises an amount of the polyether polyol and a greater amount of polyester polyol, the amounts in parts by weight of the mixture.

Assignees

Inventors

Classifications

  • C09J125/16Primary

    Homopolymers or copolymers of alkyl-substituted styrenes · CPC title

  • not modified by chemical after-treatment · CPC title

  • comprising wood as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/042; next to a bituminous or tarry layer B32B11/042; next to a water setting substance layer B32B13/10; next to a metal layer B32B15/10; next to a glass layer B32B17/062; next to a layer formed of natural mineral fibres or particles B32B19/042; next to a cellulosic plastic layer B32B23/044)} · CPC title

  • Electrical equipment · CPC title

  • Homopolymers or copolymers of ethene · CPC title

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What does patent US11236257B2 cover?
The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity…
Who is the assignee on this patent?
Henkel Ag & Co Kgaa
What technology area does this patent fall under?
Primary CPC classification C09J125/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).