Pressure-sensitive adhesive sheet

US11236253B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11236253-B2
Application numberUS-201815862989-A
CountryUS
Kind codeB2
Filing dateJan 5, 2018
Priority dateJan 10, 2017
Publication dateFeb 1, 2022
Grant dateFeb 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a PSA sheet highly durable against repeated deformation and suited for use in a flexible device as well. The PSA sheet provided by this invention comprises a PSA layer. The PSA sheet shows a recovery rate at 100% elongation of 70% or higher. The PSA layer shows a displacement of 0.5 mm or greater according to the following holding power test:<Holding Power Test>At 23° C., the PSA layer is applied over a 10 mm wide by 20 mm long bonding area to a Bakelite plate as an adherend; a 1 kg load is applied in the length direction; after one hour, the displacement from the initial position where first applied is determined.

First claim

Opening claim text (preview).

What is claimed is: 1. A pressure-sensitive adhesive sheet comprising a substrate and a pressure-sensitive adhesive layer provided on at least one face of the substrate, wherein the substrate is a non-porous polyurethane-based resin film, the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive comprising a base polymer and a tackifier resin, the tackifier resin consists of one or more species of tackifier resin T L having a softening point of from 50° C. to less than 105° C., the pressure-sensitive adhesive sheet has a thickness of 15 μm or greater, the substrate has a thickness of 10 μm or greater, and the pressure-sensitive adhesive layer has a thickness of 5 μm or greater; wherein the PSA sheet shows a recovery rate at 100% elongation of 70% or higher, and the pressure-sensitive adhesive layer shows a displacement of 0.5 mm or greater according to the following holding power test: <Holding power test> At 23° C., the pressure-sensitive adhesive layer is applied over a 10 mm wide by 20 mm long bonding area to a polyoxybenzylmethylenglycolanhydride plate as an adherend; a 1 kg load is applied in the length direction; after one hour, the displacement from the initial point where first applied is determined. 2. The pressure-sensitive adhesive sheet according to claim 1 , showing a maximum tensile strength at 100% elongation of 15 N/10 mm or less. 3. The pressure-sensitive adhesive sheet according to claim 1 , having a thickness of 250 μm or less. 4. The pressure-sensitive adhesive sheet according to claim 1 , wherein the tackifier resin content in the pressure-sensitive adhesive layer is greater than 10 parts by weight to 100 parts by weight of the base polymer. 5. The pressure-sensitive adhesive sheet according to claim 1 , wherein the base polymer is an acrylic polymer. 6. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive layer comprises a crosslinking agent. 7. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive layer shows a distance returned of 0.05 mm or greater at 5 minutes after the load is removed in the holding power test. 8. The pressure-sensitive adhesive sheet according to claim 1 , wherein the substrate is a stretchable substrate. 9. The pressure-sensitive adhesive sheet according to claim 1 , wherein the base polymer has a glass transition temperature of −25° C. or lower. 10. The pressure-sensitive adhesive sheet according to claim 4 , wherein the tackifier resin content is 15 parts by weight or greater to 100 parts by weight of the base polymer. 11. The pressure-sensitive adhesive sheet according to claim 10 , wherein the tackifier resin comprises a rosin-based resin. 12. The pressure-sensitive adhesive sheet according to claim 6 , wherein the crosslinking agent comprises an isocyanate-based crosslinking agent. 13. The pressure-sensitive adhesive sheet according to claim 12 , wherein the base polymer of the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is an acrylic polymer, the acrylic polymer is a polymer of a monomer mixture comprising a hydroxy group-containing monomer, the isocyanate-based crosslinking agent is used in an amount up to 40 times that of the hydroxy group-containing monomer. 14. The pressure-sensitive adhesive sheet according to claim 1 , having a maximum tensile strength of 7 N/10 mm or less. 15. The pressure-sensitive adhesive sheet according to claim 1 , having an elongation at break of 200% or greater. 16. The pressure-sensitive adhesive sheet according to claim 1 , having a thickness of 30 μm or greater. 17. The pressure-sensitive adhesive sheet according to claim 1 for use in a flexible device.

Assignees

Inventors

Classifications

  • of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen · CPC title

  • Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers · CPC title

  • Macromolecular additives · CPC title

  • parameters being the characterizing feature · CPC title

  • in the substrate · CPC title

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Frequently asked questions

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What does patent US11236253B2 cover?
Provided is a PSA sheet highly durable against repeated deformation and suited for use in a flexible device as well. The PSA sheet provided by this invention comprises a PSA layer. The PSA sheet shows a recovery rate at 100% elongation of 70% or higher. The PSA layer shows a displacement of 0.5 mm or greater according to the following holding power test:<Holding Power Test>At 23° C., the PSA la…
Who is the assignee on this patent?
Nitto Denko Corp
What technology area does this patent fall under?
Primary CPC classification C09J7/385. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).