Method of manufacturing a conductive pattern

Patent metadata

Field	Value
Publication number	US-11236249-B2
Application number	US-201816762171-A
Country	US
Kind code	B2
Filing date	Jun 7, 2018
Priority date	Nov 14, 2017
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

A method of preparing a conductive pattern on a substrate includes the steps of applying a receiving layer on a substrate, applying a metallic nanoparticle dispersion on the white receiving layer thereby forming a metallic pattern, and sintering the metallic pattern, characterized in that the receiving layer has a roughness Rz between 1 and 75.

First claim

The invention claimed is:

1. A method of preparing a conductive pattern on a substrate for making a touch panel device, the method comprising:
applying a receiving layer on a substrate;
applying a metallic nanoparticle dispersion directly on at least a portion of the receiving layer to define a metallic pattern; and
sintering the metallic pattern; wherein
the receiving layer has a roughness Rz between 15 μm and 75 μm.

2. The method according to claim 1 , wherein the receiving layer is white.

3. The method according to claim 1 , wherein the sintering of the metallic pattern is performed with Near Infrared (NIR) radiation.

4. The method according to claim 2 , wherein the sintering of the metallic pattern is performed with Near Infrared (NIR) radiation.

5. The method according to claim 1 , wherein the receiving layer is applied on the substrate according to a first image, and the metallic nanoparticle dispersion is applied on at least a portion of the first image to define the metallic pattern.

6. The method according to claim 1 , wherein a thickness of the receiving layer is between 10 μm and 500 μm.

7. The method according to claim 1 , further comprising:
printing a graphic design between the substrate and the receiving layer.

8. The method according to claim 1 , wherein the metallic pattern includes silver.

9. The method according to claim 8 , wherein the silver is applied by jetting a silver inkjet ink.

10. The method according to claim 1 , wherein the substrate is transparent.

11. The method according to claim 1 , wherein the substrate has a Glass Transition Temperature (Tg) lower than 180° C.

12. The method according to claim 1 , wherein the receiving layer is applied by jetting and curing a UV curable inkjet ink.

13. The method according to claim 12 , wherein the UV curable inkjet ink includes a titanium oxide pigment.

14. The method according to claim 12 , wherein the UV curable inkjet ink includes a polymerizable compound selected from the group consisting of isobornylacrylate, phenoxyethyl acrylate, tetrahydrofurfuryl acrylate, 2-(2-vinyloxy-ethoxy)ethyl (meth)acrylate, and N-vinylcaprolactam.

15. The method according to claim 1 , wherein the receiving layer has a roughness Rz between 15 μm and 60 μm.

16. The method according to claim 1 , wherein the receiving layer has a roughness Rz between 15 μm and 50 μm.

Assignees

• Agfa Gevaert Nv

Inventors

• Cortes Salazar Fernando
• Steert Koen
• Courtet Vincent
• Van Den Bossche Karl
• Gilbert Willem
• Daelemans Gert
• Willaert Peter

Classifications

• H05K3/125

  by ink-jet printing · CPC title

• C09D11/322

  Pigment inks · CPC title

• B41M5/0047

  by ink-jet printing · CPC title

• C09D11/037

  characterised by the pigment · CPC title

• H05K2201/0175

  Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor · CPC title