Mold carrier for injection molding

Patent metadata

Field	Value
Publication number	US-11235502-B2
Application number	US-201916416852-A
Country	US
Kind code	B2
Filing date	May 20, 2019
Priority date	May 20, 2019
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

Provided is a mold carrier. The mold carrier comprises a mold bearing chassis, a pressure bearing plate, and a tie bar. The mold bearing chassis includes a plurality of molds disposed therein. Each mold has one or more mold cavities. The pressure bearing plate is configured to physically couple to the mold bearing chassis during an injection molding process. The tie bar runs through the center of the mold bearing chassis and the pressure bearing plate. The mold bearing chassis is configured to allow components to be removed from their molds without separating the mold bearing chassis from the pressure bearing plate.

First claim

What is claimed is:

1. A method comprising:
injecting molten material into a first mold disposed on a mold carrier that includes a plurality of molds using an injection molding machine to create a component;
allowing the component in the first mold to at least partially solidify;
rotating, after the component has partially solidified, the mold carrier such that a second mold of the plurality of molds is aligned with a nozzle of the injection molding machine;
determining, automatically by a processor, a stress release profile for the component based on at least one characteristic of the component,
wherein the stress release profile includes a plurality of stages used to release inner stresses within the component during in-mold solidification of the component through controlled heating and cooling of the component, each stage including a target temperature for the component and an amount of time that the component is to be held at the target temperature,
wherein the stress release profile includes at least one active heating stage and at least one active cooling stage; and
controlling a temperature of the first mold according to the stress release profile,
wherein controlling the temperature of the first mold according to the stress release profile comprises:
monitoring, using at least one temperature sensor, an actual temperature of the component;
comparing the actual temperature of the component to a corresponding target temperature of the component based on the stress release profile to detect a deviation from the stress release profile; and
modifying, in response to detecting the deviation from the stress release profile, the stress release profile to correct for the detected deviation.

2. The method of claim 1 , wherein controlling the temperature of the first mold according to the stress release profile further includes:
determining, based on the comparing, a temperature difference between the actual temperature of the component and the corresponding target temperature of the component; and
responsive to the temperature difference exceeding a threshold, activating a temperature control element to change a temperature of the component.

3. The method of claim 2 , wherein each of the target temperatures corresponds to a position of the component relative to the nozzle of the injection molding machine.

4. The method of claim 3 , wherein the target temperatures are further based on an amount of time that the component has been at the position.

5. The method of claim 1 , wherein the at least one characteristic is selected from the group consisting of a shape of the component, a size of the component, and a material of the component.

6. The method of claim 1 , wherein the stress release profile is automatically determined by a processor based on a shape of the component, a size of the component, a material of the component, and a pressure within the first mold.

7. The method of claim 1 , wherein the at least one temperature sensor comprises a plurality of temperature sensors disposed on the mold carrier, wherein the plurality of temperature sensors are arranged such that each mold of the plurality of molds is monitored by one or more temperature sensors.

8. The method of claim 1 , wherein controlling the temperature of the first mold according to the stress release profile further comprises:
determining, based on the comparing, a temperature difference between the actual temperature of the component and the corresponding target temperature of the component; and
in response to the actual temperature of the component being below the corresponding target temperature of the component, activating a heating element to raise the actual temperature of the component.

9. The method of claim 1 , wherein controlling the temperature of the first mold according to the stress release profile further comprises:
determining, based on the comparing, a temperature difference between the actual temperature of the component and the corresponding target temperature of the component; and
in response to the actual temperature of the component being above the corresponding target temperature of the component, activating a cooling element to lower the actual temperature of the component.

10. The method of claim 1 , wherein modifying the stress release profile comprises:
extending, in response to determining that the actual temperature of the component at a first stage deviates from the corresponding target temperature for the first stage by more than a threshold amount, the amount of time that the component is in the first stage.

11. The method of claim 1 , wherein modifying the stress release profile comprises:
extending, in response to determining that the actual temperature of the component at a first stage deviates from the corresponding target temperature for the first stage by more than a threshold amount, the amount of time that the component is in a second stage, the second stage being after the first stage.

12. The method of claim 1 , wherein modifying the stress release profile comprises:
reducing, in response to determining that the actual temperature of the component at a first stage deviates from the corresponding target temperature for the first stage by more than a threshold amount, the amount of time that the component is in the first stage.

13. The method of claim 1 , wherein one or more stages of the stress release profile further include a target pressure.

14. A computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by processor to cause the processor to perform a method comprising:
injecting molten material into a first mold disposed on a mold carrier that includes a plurality of molds using an injection molding machine to create a component;
allowing the component in the first mold to at least partially solidify;
rotating, after the component has partially solidified, the mold carrier such that a second mold of the plurality of molds is aligned with a nozzle of the injection molding machine;
determining, automatically by a processor, a stress release profile for the component based on at least one characteristic of the component,
wherein the stress release profile includes a plurality of stages used to release inner stresses within the component during in-mold solidification of the component through controlled heating and cooling of the component, each stage including a target temperature for the component and an amount of time that the component is to be held at the target temperature,
wherein the stress release profile includes at least one active heating stage and at least one active cooling stage; and
controlling a temperature of the first mold according to the stress release profile,
wherein controlling the temperature of the first mold according to the stress release profile comprises:
monitoring, using at least one temperature sensor, an actual temperature of the component;
comparing the actual temperature of the component to a corresponding target temperature of the component based on the stress release profile to detect a deviation from the stress release profile; and
modifying, in response to detecting the deviation from the stress release profile, the stress release profile to correct for the detected deviation.

15. The computer program product of claim 14 , wherein controlling the temperature of the first mold according to the stress release profile further includes:
determining, based on the comparing, a temperature difference between the actual temperature of the compone

Assignees

• IBM

Inventors

• Xie Pengcheng
• Ma Rui
• Yu Qiuyi
• Yin Xiyuan
• Wang Qiuying

Classifications

• B29C2945/76254

  Mould · CPC title

• B29C45/78 Primary

  of temperature · CPC title

• B29C45/0441

  involving a rotational movement (B29C45/06 takes precedence) · CPC title

• B29C2945/7604

  Temperature · CPC title

• B29C2945/76531

  Temperature · CPC title